N/A

-

144

97

Non-Compliant

3

20

无

AGL600V2-FG144T

Microsemi Corporation

活跃

MICROSEMI CORP

5.25

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

235

unknown

1.5 V

13.5 kB

现场可编程门阵列

13824

600000

N/A

-

表面贴装

YES

144

微芯片技术

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL010S-1TQ144

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.26 V

5.57

84

Tray

Obsolete

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

12084

933888

20 mm

20 mm

N/A

-

表面贴装

YES

100

100

4.5 V

85 °C

无

A1415A-PQ100I

125 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

5.88

5.5 V

MICROSEMI CORP

80

Compliant

PLASTIC, QFP-100

FLATPACK

PLASTIC/EPOXY

-40 °C

5 V

85 °C

-40 °C

CMOS

QUAD

鸥翼

0.65 mm

compliant

125 MHz

R-PQFP-G100

5 V

INDUSTRIAL

5.5 V

4.5 V

3 ns

3 ns

200 CLBS, 1500 GATES

3.4 mm

现场可编程门阵列

200

1500

200

264

3 ns

200

1500

20 mm

14 mm

无

N/A

-

表面贴装

100

57

Non-Compliant

85 °C

-40 °C

57 MHz

5 V

5.5 V

4.5 V

3.8 ns

295

1200

295

1

147

无

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

208

95

Compliant

70 °C

0 °C

1.5 V

1.575 V

1.425 V

13.5 kB

600000

1.47059 GHz

2

13824

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

FLATPACK

微芯片技术

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A42MX09-1PQ100

135 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

83

Tray

A42MX09

Obsolete

QFP,

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

100

R-PQFP-G100

不合格

COMMERCIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

2.1 ns

684

14000

20 mm

14 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

158

Tray

APA300

Obsolete

-40°C ~ 125°C (TJ)

ProASICPLUS

2.375V ~ 2.625V

73728

300000

32 In Stock

• 1: ¥197.493326
• 10: ¥186.314461
• 100: ¥175.768357
• 500: ¥165.819201
查看所有的价格

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

3

PLASTIC/EPOXY

1.2 V

40

1.14 V

85 °C

有

AGL125V2-FGG144

108 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

97

Tray

AGL125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

0°C ~ 70°C (TA)

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

OTHER

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

13 mm

13 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

QFP-208

FLATPACK, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

1.5 V

30

1.425 V

125 °C

无

A3P1000-PQ208M

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.24

154

Tray

A3P1000

Obsolete

-55°C ~ 125°C (TJ)

ProASIC3

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5,1.5/3.3 V

MILITARY

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

QFP,

FLATPACK

微芯片技术

3

PLASTIC/EPOXY

-55 °C

3.3 V

30

3 V

125 °C

无

A42MX09-1PQ100M

135 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

83

Tray

A42MX09

Obsolete

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

100

R-PQFP-G100

不合格

MILITARY

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

2.1 ns

684

14000

20 mm

14 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P250-2PQ208I

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

151

Tray

M1A3P250

Obsolete

FQFP,

FLATPACK, FINE PITCH

-40°C ~ 100°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

36864

250000

6144

250000

28 mm

28 mm

N/A

-

表面贴装

80-TQFP

YES

80-VQFP (14x14)

80

TQFP,

FLATPACK, THIN PROFILE

微芯片技术

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A40MX02-3VQ80I

109 MHz

TQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.26

QFP

Obsolete

A40MX02

Tray

57

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

80

S-PQFP-G80

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

1.7 ns

295

3000

14 mm

14 mm

2202 In Stock

• 1: ¥878.902142
• 10: ¥829.152960
• 100: ¥782.219781
• 500: ¥737.943187
查看所有的价格

-

表面贴装

748-FBGA

748-FBGA (23x23)

微芯片技术

+ 85 C

0 C

Tray

活跃

56500 LE

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 1.26V

56520

1869824

N/A

-

YES

484

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P1000L-1FGG484I

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

INDUSTRIAL

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

24576

1000000

23 mm

23 mm

N/A

-

YES

100

40

3 V

85 °C

有

A54SX16-2VQG100I

320 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.26

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

e3

哑光锡

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

0.7 ns

1452

16000

14 mm

14 mm

N/A

-

YES

144

-40 °C

2.5 V

30

2.25 V

85 °C

无

A54SX16A-1FG144I

263 MHz

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.32

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

e0

Tin/Lead/Silver (Sn/Pb/Ag)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

INDUSTRIAL

111

1452 CLBS, 24000 GATES

1.55 mm

现场可编程门阵列

1.2 ns

1452

1452

24000

13 mm

13 mm

44 In Stock

• 1: ¥616.943735
• 10: ¥582.022389
• 100: ¥549.077725
• 500: ¥517.997856
查看所有的价格

-

表面贴装

144-LBGA

144-FPBGA (13x13)

微芯片技术

96

Tray

A3P060

活跃

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

1.425V ~ 1.575V

18432

60000

N/A

-

N/A

-

YES

208

3 V

70 °C

无

A54SX16-1PQ208

280 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

30

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

0.8 ns

1452

16000

28 mm

28 mm

N/A

-

表面贴装

208

130

Compliant

70 °C

0 °C

320 MHz

5 V

5.25 V

4.75 V

700 ps

700 ps

768

12000

320 MHz

768

2

256

3.4 mm

28 mm

28 mm

无

N/A

-

YES

144

40

Obsolete

MICROSEMI CORP

2.75 V

5.32

Microsemi Corporation

SQUARE

LBGA

313 MHz

A54SX08A-2FGG144

有

70 °C

2.25 V

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

2.5 V

e1

锡银铜

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

COMMERCIAL

111

768 CLBS, 12000 GATES

1.55 mm

现场可编程门阵列

0.9 ns

768

768

12000

13 mm

13 mm

24 In Stock

• 1: ¥428.880963
• 10: ¥404.604679
• 100: ¥381.702527
• 500: ¥360.096720
查看所有的价格

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

活跃

BGA, BGA325,21X21,20

网格排列

微芯片技术

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

85 °C

有

M2GL025-FCSG325

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.27

27696 LE

+ 85 C

0 C

SMD/SMT

180

Tray

M2GL025

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

180

不合格

1.2 V

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

STD

27696

N/A

-

表面贴装

784-BBGA, FCBGA

784-FCBGA (29x29)

微芯片技术

活跃

388

Tray

-55°C ~ 125°C (TJ)

PolarFire™

0.97V ~ 1.08V

300000

21600666

N/A

-