N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

1.2 V

- 40 C

微芯片技术

+ 100 C

SMD/SMT

有

40

IGLOO2

Tray

M2GL090

活跃

1.2 V

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

无

M2GL090T-FG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL090T

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

425

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

100 °C

-40 °C

1.2 V

138 kB

27696

1130496

1

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

SMD/SMT

微芯片技术

有

Details

This product may require additional documentation to export from the United States.

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2GL010-1VFG400

有

85 °C

30

1.2 V

BGA400,20X20,32

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE, FINE PITCH

LFBGA, BGA400,20X20,32

12084 LE

195 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL010

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

12084

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

27696 LE

微芯片技术

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

1.2 V

Tray

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL025TS-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

有

60

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL090

活跃

MICROSEMI CORP

5.27

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

85 °C

无

M2GL090-1FG676

BGA

SQUARE

活跃

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

0°C ~ 85°C (TJ)

Tray

M2GL090

85 °C

0 °C

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

86316

27 mm

27 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

IGLOO2

119

有

SMD/SMT

+ 85 C

0 C

1.2 V

138 I/O

27696 LE

N

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.2 V

27696

1130496

2 Transceiver

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

85 °C

无

M2GL025TS-1FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

2 Transceiver

27696

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060T

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

SMD/SMT

+ 85 C

0 C

微芯片技术

1.2 V

267 I/O

27696 LE

Details

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL025TS-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

有

60

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

+ 100 C

SMD/SMT

有

90

IGLOO2

Tray

M2GL060

活跃

1.2 V

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

有

M2GL060TS-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

1.51 mm

现场可编程门阵列

56520

1869824

1

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

0 C

微芯片技术

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

M2GL025

Tray

活跃

5.27

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2GL025T-1VF256

无

85 °C

20

1.2 V

PLASTIC/EPOXY

GRID ARRAY, LOW PROFILE, FINE PITCH

14 X 14 MM, 0.80 MM PITCH, VFBGA-256

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL025T

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP-100

100

100-VQFP (14x14)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

90

ProASIC3

8542310000

68

Tray

A3P250

-55°C ~ 125°C (TJ)

Tray

A3P250

125 °C

-55 °C

1.5 V

272 MHz

4.5 kB

36864

250000

1.575 V

1.425 V

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

27696 LE

267 I/O

1.2 V

- 40 C

微芯片技术

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2000 V

1.14 V

1.26 V

1.2 V

Tray

M2GL025

活跃

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

有

M2GL025TS-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

-40 to 100 °C

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

STD

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

180 I/O

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

85 °C

有

M2GL025T-FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

Details

27696 LE

0°C ~ 85°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

STD

2 Transceiver

27696

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

+ 100 C

微芯片技术

SMD/SMT

有

60

IGLOO2

0.035380 oz

1.26 V

Tray

M2GL005

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005-1TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

2.03

Details

6060 LE

84 I/O

1.14 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL005

8542.39.00.01

1.2 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

667 Mb/s

1.6 mm

现场可编程门阵列

6060

719872

1

20 mm

20 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

119

IGLOO2

Tray

M2GL025

活跃

1.2 V

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL025TS-1VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

27696 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025T

85 °C

0 °C

1.2 V

138 kB

27696

1130496

1

4 Transceiver

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL010TS-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

195 I/O

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

BGA

M2GL090T-1FG484

无

85 °C

20

1.2 V

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

23 X 23 MM, 1 MM PITCH, FBGA-484

This product may require additional documentation to export from the United States.

N

86184 LE

267 I/O

0°C ~ 85°C (TJ)

Tray

M2GL090T

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

1.2 V

- 40 C

微芯片技术

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL025-FCS325I

BGA

SQUARE

活跃

FPGA IGLOOu00ae2 Family 27696 Cells 1.2V 325-Pin FCBGA Tray

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL025

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

180

现场可编程门阵列

27696

1130496

STD

27696

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

0°C ~ 85°C (TJ)

Tray

M2GL060

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

OTHER

1.51 mm

现场可编程门阵列

56520

1869824

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025T

1.2 V

27696

1130496

2 Transceiver

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

SMD/SMT

有

60

IGLOO2

1.26 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

56520 LE

267 I/O

1.14 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

667 Mb/s

2.44 mm

现场可编程门阵列

56520

1869824

1

4 Transceiver

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL025

1.2 V

27696

1130496

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090T-FCSG325

活跃

MICROSEMI CORP

5.8

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

0°C ~ 85°C (TJ)

Tray

M2GL090T

8542.39.00.01

CMOS

1.2 V

compliant

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

STD

4 Transceiver

86316