品牌是'Microchip' (5152)
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![]() | A54SX72A-FGG484M | Microchip Technology | 数据表 | 516 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | FBGA | 484 | 484-FPBGA (27X27) | 400.011771 mg | 微芯片技术 | 有 | 217 MHz | SMD/SMT | + 125 C | - 55 C | 2.25 V | 360 I/O | Details | This product may require additional documentation to export from the United States. | 2.75 V | Tray | A54SX72 | 活跃 | 0.014110 oz | Actel | 40 | -55°C ~ 125°C (TC) | Tray | A54SX72A | 125 °C | -55 °C | 2.25V ~ 5.25V | 217 MHz | 2.5 V | 2.75 V | 2.25 V | 1.5 ns | 1.5 ns | 6036 | 108000 | 217 MHz | 6036 | 6036 | 4024 | 1.73 mm | 23 mm | 23 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000-2FGG256I | Microchip Technology | 数据表 | 2911 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | M1A3P1000-2FGG256I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 0.014110 oz | ProASIC3 | 90 | 有 | 310 MHz | SMD/SMT | + 85 C | - 40 C | 1.425 V | 177 I/O | Details | This product may require additional documentation to export from the United States. | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | M1A3P1000 | -40 to 85 °C | Tray | M1A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-FPQG100 | Microchip Technology | 数据表 | 2868 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | + 70 C | SMD/SMT | 103 MHz | 有 | 66 | Actel | 0.062040 oz | 42MX | 70C | 微芯片技术 | COMMERCIALC | PQFP | 24000 | 0C to 70C | 83 | 24000 | 608 | 0.45UM | 5.25(V) | 3.3/5(V) | 无 | 3(V) | 0C | 有 | 608 | 928 | 表面贴装 | Tray | A42MX16 | 活跃 | 5.25 V | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-FPQG100 | 56 MHz | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 5.24 | Details | 83 I/O | 3 V | 0 C | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | 62/103(MHz) | 100 | R-PQFP-G100 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 1232 CLBS, 24000 GATES | 3.4 mm | 现场可编程门阵列 | 24000 | 4 ns | 1232 | 24000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||
![]() | AX1000-FGG676M | Microchip Technology | 数据表 | 996 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | 40 | 125 °C | 有 | AX1000-FGG676M | 649 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | Military grade | This product may require additional documentation to export from the United States. | Details | 418 I/O | 1.425 V | - 55 C | + 125 C | SMD/SMT | 649 MHz | 有 | 40 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | -55 °C | 1.5 V | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B676 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | 无 | |||||||||||||||||||||||||||||
![]() | A42MX16-1PQG208M | Microchip Technology | 数据表 | 926 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 125 °C | 有 | A42MX16-1PQG208M | 108 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.28 | This product may require additional documentation to export from the United States. | Details | 140 I/O | 3 V | - 55 C | + 125 C | SMD/SMT | 198 MHz | 有 | 24 | Actel | 5.5 V | Tray | A42MX16 | 活跃 | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 40 | -55°C ~ 125°C (TC) | Tray | A42MX16 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | 3.3 V, 5 V | MILITARY | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 1232 | 24000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL125V5-VQ100 | Microchip Technology | 数据表 | 36 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | AGL125V5-VQ100 | 108 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | N | 1500 LE | 71 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 892.86 MHz | 有 | 90 | IGLOOe | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | AGL125 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 0 to 70 °C | Tray | AGL125V5 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | 1.5 V | OTHER | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P060-2FGG144 | Microchip Technology | 数据表 | 36 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 144-FPBGA (13x13) | 144 | 微芯片技术 | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P060-2FGG144 | 350 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Details | 96 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 310 MHz | 有 | 160 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3P060 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 0 to 70 °C | Tray | A3P060 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | 1.5 V | COMMERCIAL | 1536 CLBS, 60000 GATES | 1.55 mm | 现场可编程门阵列 | 18432 | 60000 | 2 | 1536 | 60000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE600-2FG484I | Microchip Technology | 数据表 | 2880 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | -40 °C | 1.5 V | 30 | 85 °C | 无 | A3PE600-2FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | N | 270 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 310 MHz | 有 | 60 | ProASIC3 | 0.014110 oz | 1.5000 V | Tray | A3PE600 | 活跃 | 1.575 V | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | -40 to 85 °C | Tray | A3PE600 | e0 | 锡铅 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | 2 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-2FGG144I | Microchip Technology | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | 微芯片技术 | 1.575 V | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 有 | A3P250-2FGG144I | 350 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | Details | 97 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 310 MHz | 有 | 160 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | Tray | A3P250 | 活跃 | -40 to 85 °C | Tray | A3P250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | 1.5 V | INDUSTRIAL | 6144 CLBS, 250000 GATES | 1.55 mm | 现场可编程门阵列 | 36864 | 250000 | 2 | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE1500-FG676 | Microchip Technology | 数据表 | 2601 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.5 V | 30 | 70 °C | 无 | A3PE1500-FG676 | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | N | 444 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 231 MHz | 有 | 40 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | Tray | A3PE1500 | 活跃 | 1.575 V | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676 | 网格排列 | 3 | 0 to 70 °C | Tray | A3PE1500 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B676 | 444 | 不合格 | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 33.8 kB | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | 现场可编程门阵列 | 276480 | 1500000 | 231 MHz | STD | 38400 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | 无 | |||||||||||||||||||||||||||||||||||||
![]() | A3P250-2VQ100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 1.5 V | 30 | 85 °C | 无 | A3P250-2VQ100 | 350 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | N | 68 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 310 MHz | 有 | 90 | ProASIC3 | 1.425 V | 1.575 V | Tray | A3P250 | 活跃 | 1.575 V | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 0°C ~ 85°C (TJ) | Tray | A3P250 | e0 | 锡铅 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 36864 | 250000 | 2 | 6144 | 250000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-2PQG208 | Microchip Technology | 数据表 | 2248 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | 208-PQFP (28x28) | 微芯片技术 | Actel | 24 | 有 | 870 MHz | SMD/SMT | + 70 C | 0 C | 1.425 V | 115 I/O | Details | This product may require additional documentation to export from the United States. | 1.575 V | Tray | AX500 | 活跃 | 0°C ~ 70°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-VQG100A | Microchip Technology | 数据表 | 2520 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | A42MX09-VQG100A | 174 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.6 | Details | 83 I/O | 4.75 V | - 40 C | + 125 C | SMD/SMT | 192 MHz | 有 | 90 | Actel | 5.25 V | Tray | A42MX09 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 40 | 125 °C | 有 | -40°C ~ 125°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5.0V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 5 V | AUTOMOTIVE | 684 CLBS, 14000 GATES | 1.2 mm | 现场可编程门阵列 | 14000 | STD | 2 ns | 684 | 14000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-VQG80M | Microchip Technology | 数据表 | 2838 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP | YES | 80-VQFP (14x14) | 80 | 微芯片技术 | 125 °C | 有 | A40MX02-VQG80M | 80 MHz | TQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | This product may require additional documentation to export from the United States. | Details | 57 I/O | 3 V | - 55 C | + 125 C | SMD/SMT | 139 MHz | 有 | 90 | Actel | 5.5 V | Tray | A40MX02 | 活跃 | TQFP, | FLATPACK, THIN PROFILE | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 40 | -55°C ~ 125°C (TC) | Tray | A40MX02 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 260 | 0.65 mm | compliant | S-PQFP-G80 | 不合格 | 3.3 V, 5 V | MILITARY | 295 CLBS, 3000 GATES | 1.2 mm | 现场可编程门阵列 | 3000 | 2.7 ns | 295 | 3000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000-2FGG484 | Microchip Technology | 数据表 | 2405 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | M1A3P1000-2FGG484 | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | Details | 300 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 310 MHz | 有 | 60 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | M1A3P1000 | 活跃 | 0 to 70 °C | Tray | M1A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-FGG484I | Microchip Technology | 数据表 | 2290 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 微芯片技术 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | Details | 172 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 1098.9 MHz | 有 | 60 | Fusion | 0.014110 oz | 1.575 V | Tray | M1AFS600 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 85 °C | 有 | M1AFS600-FGG484I | -40°C ~ 100°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 1.0989 GHz | S-PBGA-B484 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | 1.0989 GHz | STD | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-1FGG676M | Microchip Technology | 数据表 | 781 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | 40 | 125 °C | 有 | AX1000-1FGG676M | 763 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | Military grade | This product may require additional documentation to export from the United States. | Details | 418 I/O | 1.425 V | - 55 C | + 125 C | SMD/SMT | 763 MHz | 有 | 40 | Actel | 0.014110 oz | Tray | AX1000 | 活跃 | 1.575 V | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | -55 °C | 1.5 V | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | 无 | |||||||||||||||||||||||||||||||
![]() | A3P250-2VQG100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P250-2VQG100 | 350 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | Details | 68 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 310 MHz | 有 | 90 | ProASIC3 | 1.5000 V | 1.425 V | 1.575 V | Tray | A3P250 | 活跃 | 1.575 V | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 0 to 70 °C | Tray | A3P250 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 36864 | 250000 | 2 | 6144 | 250000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE1500-1FGG484I | Microchip Technology | 数据表 | 2740 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 微芯片技术 | -40 °C | 1.5 V | 40 | 85 °C | 有 | A3PE1500-1FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 0.014110 oz | ProASIC3 | 60 | 有 | 272 MHz | SMD/SMT | + 85 C | - 40 C | 1.425 V | 280 I/O | Details | This product may require additional documentation to export from the United States. | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3PE1500 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 to 85 °C | Tray | A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | 现场可编程门阵列 | 276480 | 1500000 | 272 MHz | 1 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-1FGG484I | Microchip Technology | 数据表 | 642 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 40 | 85 °C | 有 | M1AFS600-1FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 1.425 V | - 40 C | + 85 C | 172 I/O | Details | This product may require additional documentation to export from the United States. | SMD/SMT | 1282.05 MHz | 有 | 60 | Fusion | 0.014110 oz | Tray | M1AFS600 | 活跃 | 1.575 V | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | -40°C ~ 100°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | 1 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AGL250V5-FGG144 | Microchip Technology | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | 微芯片技术 | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | This product may require additional documentation to export from the United States. | Details | 3000 LE | 97 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 有 | 160 | IGLOOe | 0.014110 oz | Tray | M1AGL250 | 活跃 | 1.575 V | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | M1AGL250V5-FGG144 | 108 MHz | 0°C ~ 70°C (TA) | Tray | M1AGL250V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.55 mm | 现场可编程门阵列 | 6144 | 36864 | 250000 | STD | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P060-VQ100I | Microchip Technology | 数据表 | 60 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 1.5 V | 30 | 100 °C | 无 | A3P060-VQ100I | 350 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.51 | N | 700 LE | 71 I/O | 1.425 V | - 40 C | + 100 C | SMD/SMT | 350 MHz | 有 | 90 | ProASIC3 | 0.356867 oz | 1.575 V | Tray | A3P060 | 活跃 | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | -40°C ~ 100°C (TJ) | Tray | A3P060 | e0 | 锡铅 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 240 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 1.5 V | INDUSTRIAL | - | 1536 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | 18432 | 60000 | STD | - | 1536 | 60000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-1FGG484M | Microchip Technology | 数据表 | 985 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 微芯片技术 | 40 | 125 °C | 有 | AX1000-1FGG484M | 763 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | Military grade | This product may require additional documentation to export from the United States. | Details | 317 I/O | 1.425 V | - 55 C | + 125 C | 有 | 763 MHz | SMD/SMT | 60 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.5 V | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 763 MHz | S-PBGA-B484 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | 无 | ||||||||||||||||||||||||||||
![]() | M1A3P1000-1FGG144I | Microchip Technology | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 144-FPBGA (13x13) | 微芯片技术 | 272 MHz | 有 | 160 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | M1A3P1000 | 活跃 | This product may require additional documentation to export from the United States. | Details | 97 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | -40 to 85 °C | Tray | M1A3P1000 | 1.425V ~ 1.575V | 1.5 V | 147456 | 1000000 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600-FG256 | Microchip Technology | 数据表 | 36 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | 微芯片技术 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | N | 177 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 231 MHz | 有 | 90 | ProASIC3 | 0.014110 oz | 1.575 V | Tray | A3P600 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | A3P600-FG256 | 350 MHz | 0°C ~ 85°C (TJ) | Tray | A3P600 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | 无 |
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