品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | APA600-FG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | 微芯片技术 | 370 I/O | 2.3 V | 0 C | + 70 C | SMD/SMT | 180 MHz | 有 | 60 | Actel | 0.014110 oz | 2.7 V | Tray | APA600 | 活跃 | This product may require additional documentation to export from the United States. | N | 0°C ~ 70°C (TA) | Tray | APA600 | 70 °C | 0 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.73 mm | 23 mm | 23 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-CQ208M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-208 | 208-CQFP (75x75) | 微芯片技术 | 2.75 V | This product may require additional documentation to export from the United States. | N | 174 I/O | 2.25 V | - 55 C | + 125 C | SMD/SMT | 238 MHz | 有 | 1 | Actel | Tray | A54SX32 | 活跃 | -55°C ~ 125°C (TC) | A54SX32A | 2.25V ~ 5.25V | 2.5 V | 48000 | 2880 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA300-BG456I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-456 | YES | 456-PBGA (35x35) | 456 | 290 I/O | 2.3 V | - 40 C | + 85 C | SMD/SMT | 180 MHz | 有 | 24 | Actel | PROASICPLUS | 微芯片技术 | 85C | INDUSTRIALC | BGA | 300000 | -40C to 85C | 290 | 300000 | 0.22UM | 2.7(V) | 2.5(V) | 无 | 2.3(V) | -40C | 有 | 8192 | 表面贴装 | 2.7 V | Tray | APA300 | 活跃 | BGA, BGA456,26X26,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA456,26X26,50 | -40 °C | 2.5 V | 30 | 85 °C | 无 | APA300-BG456I | 180 MHz | BGA | SQUARE | 活跃 | FPGA ProASICPLUS Family 300K Gates 180MHz 0.22um Technology 2.5V 456-Pin BGA Tray | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | N | -40°C ~ 85°C (TA) | Tray | APA300 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 180(MHz) | 456 | S-PBGA-B456 | 290 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 290 | 300000 GATES | 2.54 mm | 现场可编程门阵列 | 73728 | 300000 | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||
![]() | AX1000-1FG484M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 微芯片技术 | 1.5 V | 30 | 125 °C | 无 | AX1000-1FG484M | 763 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | Military grade | This product may require additional documentation to export from the United States. | N | 317 I/O | 1.425 V | - 55 C | + 125 C | SMD/SMT | 763 MHz | 有 | 60 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | 锡铅 | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | S-PBGA-B484 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | 无 | |||||||||||||||||||||||||
![]() | A42MX36-1CQ208 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | CQFP-208 | YES | 208 | 208-CQFP (75x75) | 208 | 微芯片技术 | N | 176 I/O | 3.3 V | 0 C | + 70 C | SMD/SMT | 有 | 1 | Actel | Tray | A42MX36 | 活跃 | 3.3 V | QFP | 5.19 | MICROSEMI CORP | 活跃 | SQUARE | GQFF | 83 MHz | A42MX36-1CQ208 | 无 | 70 °C | 3.3 V | CERAMIC, METAL-SEALED COFIRED | FLATPACK, GUARD RING | CERAMIC, QFP-208 | 0°C ~ 70°C (TA) | A42MX36 | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | FLAT | 0.5 mm | compliant | 208 | S-CQFP-F208 | 不合格 | 3.3 V | COMMERCIAL | 5.25 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 1184 | 1 | 1822 | 2.3 ns | 2438 | 54000 | 29.21 mm | 29.21 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-1FG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 484-FPBGA (23x23) | 微芯片技术 | 1.575 V | Tray | AX500 | 活跃 | This product may require additional documentation to export from the United States. | N | 317 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 763 MHz | 有 | 60 | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA150-FG144A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | 微芯片技术 | 100 I/O | 2.375 V | - 40 C | + 125 C | SMD/SMT | 180 MHz | 有 | 160 | Actel | 0.014110 oz | 2.625 V | Tray | APA150 | 活跃 | BGA, BGA144,12X12,40 | 网格排列 | PLASTIC/EPOXY | BGA144,12X12,40 | 无 | APA150-FG144A | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.61 | This product may require additional documentation to export from the United States. | N | -40°C ~ 125°C (TJ) | Tray | APA150 | 125 °C | -40 °C | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B144 | 100 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | 2.625 V | 2.375 V | 4.5 kB | 100 | 现场可编程门阵列 | 36864 | 150000 | 180 MHz | STD | 6144 | 6144 | 1.05 mm | 13 mm | 13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-CQ208B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-208 | 208-CQFP (75x75) | 微芯片技术 | 活跃 | This product may require additional documentation to export from the United States. | N | 174 I/O | 2.25 V | - 55 C | + 125 C | SMD/SMT | 238 MHz | 有 | 1 | Actel | 2.75 V | Tray | A54SX32 | -55°C ~ 125°C (TJ) | A54SX32A | 2.25V ~ 5.25V | 2.5 V | 48000 | 2880 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-CQ256M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-256 | 256-CQFP (75x75) | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 213 I/O | 2.25 V | - 55 C | + 125 C | SMD/SMT | 217 MHz | 1 | Actel | Tray | A54SX72 | 活跃 | 2.75 V | -55°C ~ 125°C (TC) | A54SX72A | 2.25V ~ 5.25V | 2.5 V | 108000 | 6036 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-CQ208B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | CQFP | YES | 208 | 208-CQFP (75x75) | 10.567001 g | 208 | 微芯片技术 | 20 | 125 °C | 无 | A54SX32-CQ208B | 205 MHz | QFF | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Military grade | This product may require additional documentation to export from the United States. | N | 174 I/O | 3 V | - 55 C | + 125 C | SMD/SMT | 205 MHz | 有 | 1 | Actel | 0.372740 oz | Tray | A54SX32 | 活跃 | 3.6 V | QFF, TPAK208,2.9SQ,20 | FLATPACK | CERAMIC, METAL-SEALED COFIRED | TPAK208,2.9SQ,20 | -55 °C | 3.3 V | -55°C ~ 125°C (TJ) | A54SX32 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 48000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 246 | 不合格 | 3.3 V, 5 V | 3.3,5 V | MILITARY | 5.5 V | 4.5 V | 1 ns | 246 | 2880 CLBS, 32000 GATES | 3.06 mm | 现场可编程门阵列 | 48000 | 205 MHz | 2880 | MIL-STD-883 Class B | 2880 | 1080 | 1 ns | 2880 | 2880 | 32000 | 2.8 mm | 29.21 mm | 29.21 mm | 无 | ||||||||||||||||||||||||||||||||||
![]() | A54SX16-1TQG176I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | 微芯片技术 | 40 | 85 °C | 有 | A54SX16-1TQG176I | 280 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | Details | 147 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 280 MHz | 有 | 40 | Actel | 3.6 V | Tray | A54SX16 | 活跃 | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | -40 °C | 3.3 V | -40°C ~ 85°C (TA) | Tray | A54SX16 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 147 | 不合格 | 3.3 V, 5 V | 3.3,5 V | INDUSTRIAL | 147 | 1452 CLBS, 16000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 1452 | 0.8 ns | 1452 | 1452 | 16000 | 1.4 mm | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-CQ84M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-84 | YES | 84-CQFP (42x42) | 84 | 微芯片技术 | 无 | A54SX32A-CQ84M | 217 MHz | QFF | SQUARE | 活跃 | MICROSEMI CORP | 5.52 | This product may require additional documentation to export from the United States. | N | 62 I/O | 2.25 V | - 55 C | + 125 C | SMD/SMT | 238 MHz | 有 | 9 | Actel | Tray | A54SX32 | 活跃 | 2.75 V | QFF, | FLATPACK | CERAMIC, METAL-SEALED COFIRED | -55 °C | 2.5 V | 20 | 125 °C | -55°C ~ 125°C (TC) | A54SX32A | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | IT CAN ALSO OPERATE WITH 3.3V AND 5V | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 225 | 0.635 mm | compliant | S-CQFP-F84 | 不合格 | 2.5 V | MILITARY | 1800 CLBS, 48000 GATES | 2.4 mm | 现场可编程门阵列 | 48000 | 2880 | 1.4 ns | 1800 | 48000 | 16.51 mm | 16.51 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX250-2FG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 484-FPBGA (23x23) | 微芯片技术 | 1.575 V | Tray | AX250 | 活跃 | This product may require additional documentation to export from the United States. | N | 248 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 870 MHz | 有 | 60 | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | eX128-PTQG64I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-64 | YES | 64-TQFP (10x10) | 64 | 微芯片技术 | 有 | EX128-PTQG64I | 357 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.59 | Details | 46 I/O | 2.3 V | - 40 C | + 85 C | SMD/SMT | 有 | 160 | Actel | 0.012720 oz | 2.7 V | Tray | EX128 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 40 | 85 °C | -40°C ~ 85°C (TA) | Tray | eX128 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G64 | 2.5 V | INDUSTRIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | 0.7 ns | 6000 | 1.4 mm | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-1CQ208B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP | YES | 208-CQFP (75x75) | 208 | 微芯片技术 | TPAK208,2.9SQ,20 | -55 °C | 3.3 V | 20 | 125 °C | 无 | A54SX32-1CQ208B | 240 MHz | QFF | SQUARE | 活跃 | MICROSEMI CORP | 5.23 | Military grade | This product may require additional documentation to export from the United States. | N | 174 I/O | 3 V | - 55 C | + 125 C | SMD/SMT | 240 MHz | 有 | 1 | Actel | 0.372740 oz | 3.6 V | Tray | A54SX32 | 活跃 | QFF, TPAK208,2.9SQ,20 | FLATPACK | CERAMIC, METAL-SEALED COFIRED | -55°C ~ 125°C (TJ) | A54SX32 | e0 | 3A001.A.2.C | 锡铅 | 48000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 246 | 不合格 | 3.3 V, 5 V | 3.3,5 V | MILITARY | 246 | 2880 CLBS, 32000 GATES | 3.06 mm | 现场可编程门阵列 | 48000 | 2880 | MIL-STD-883 Class B | 0.9 ns | 2880 | 2880 | 32000 | 2.8 mm | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA600-CQ208B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | CQFP-208 | 208 | 208-CQFP (75x75) | 微芯片技术 | 158 I/O | 2.5 V | - 55 C | + 125 C | SMD/SMT | 5 MHz | 有 | 1 | Actel | 2.5 V | Tray | APA600 | 活跃 | This product may require additional documentation to export from the United States. | N | -55°C ~ 125°C (TJ) | APA600 | 125 °C | -55 °C | 2.3V ~ 2.7V | 2.5 V | 15.8 kB | 129024 | 600000 | 5 MHz | 21504 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA1000-BG456I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-456 | YES | 456-PBGA (35x35) | 456 | 微芯片技术 | 活跃 | 无 | APA1000-BG456I | 180 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | 85 °C | 30 | 2.5 V | -40 °C | BGA456,26X26,50 | PLASTIC/EPOXY | 3 | 网格排列 | BGA, BGA456,26X26,50 | This product may require additional documentation to export from the United States. | N | 356 I/O | 2.3 V | - 40 C | + 85 C | SMD/SMT | 180 MHz | 有 | 24 | Actel | 2.5000 V | 2.3 V | 2.7 V | 2.7 V | Tray | APA1000 | -40 to 85 °C | Tray | APA1000 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 456 | S-PBGA-B456 | 356 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 356 | 1000000 GATES | 2.54 mm | 现场可编程门阵列 | 202752 | 1000000 | STD | 56320 | 1000000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1CQ84B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-84 | YES | 84-CQFP (42x42) | 84 | 微芯片技术 | 125 °C | 无 | A54SX32A-1CQ84B | 250 MHz | QFF | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Military grade | This product may require additional documentation to export from the United States. | N | 62 I/O | 2.25 V | - 55 C | + 125 C | SMD/SMT | 278 MHz | 有 | 1 | Actel | Tray | A54SX32 | 活跃 | 2.75 V | QFF, | FLATPACK | CERAMIC, METAL-SEALED COFIRED | -55 °C | 2.5 V | 20 | -55°C ~ 125°C (TJ) | A54SX32A | e0 | 3A001.A.2.C | 锡铅 | IT CAN ALSO OPERATE WITH 3.3V AND 5V | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 225 | 0.635 mm | compliant | S-CQFP-F84 | 不合格 | 2.5 V | MILITARY | 1800 CLBS, 48000 GATES | 2.4 mm | 现场可编程门阵列 | 48000 | 2880 | MIL-STD-883 Class B | 1.2 ns | 1800 | 48000 | 16.51 mm | 16.51 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA600-BGG456M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | BGA-456 | 456 | 456-PBGA (35x35) | 微芯片技术 | 356 I/O | 2.3 V | - 55 C | + 125 C | SMD/SMT | 180 MHz | 有 | 24 | Actel | 2.7 V | Tray | APA600 | 活跃 | This product may require additional documentation to export from the United States. | Details | -55°C ~ 125°C (TC) | Tray | APA600 | 125 °C | -55 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | 21504 | 1.73 mm | 35 mm | 35 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16P-2TQG176 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | 微芯片技术 | 有 | A54SX16P-2TQG176 | 320 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Details | 147 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 320 MHz | 有 | 40 | Actel | Tray | A54SX16 | 活跃 | 3.6 V | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | 3.3 V | 40 | 70 °C | 0°C ~ 70°C (TA) | Tray | A54SX16P | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 147 | 不合格 | 3.3 V, 5 V | 3.3,3.3/5 V | COMMERCIAL | 147 | 1452 CLBS, 16000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 1452 | 0.7 ns | 1452 | 1452 | 16000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-1BG272 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | 微芯片技术 | SQUARE | 活跃 | MICROSEMI CORP | 5.19 | BGA | N | 202 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 151 MHz | 有 | 40 | Actel | 5.25 V | Tray | A42MX36 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 70 °C | 无 | A42MX36-1BG272 | 83 MHz | BGA | 0°C ~ 70°C (TA) | Tray | A42MX36 | e0 | 锡铅银 | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 225 | 1.27 mm | compliant | 272 | S-PBGA-B272 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 151 MHz | 1184 | 1 | 1822 | 2.3 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | 无 | |||||||||||||||||||||||||||||||||||||||
![]() | APA150-FG256A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 256-FPBGA (17x17) | 微芯片技术 | 2.625 V | Tray | APA150 | 活跃 | This product may require additional documentation to export from the United States. | N | 186 I/O | 2.375 V | - 40 C | + 125 C | SMD/SMT | 180 MHz | 有 | 90 | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA150 | 2.375V ~ 2.625V | 2.5 V | 36864 | 150000 | STD | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA300-PQG208M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | 208-PQFP (28x28) | 微芯片技术 | 活跃 | Actel | 24 | 有 | 180 MHz | SMD/SMT | + 125 C | - 55 C | 2.3 V | 158 I/O | Details | This product may require additional documentation to export from the United States. | 2.7 V | Tray | APA300 | -55°C ~ 125°C (TC) | Tray | APA300 | 2.3V ~ 2.7V | 2.5 V | 73728 | 300000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-CQ208B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-208 | 208-CQFP (75x75) | 微芯片技术 | 活跃 | This product may require additional documentation to export from the United States. | N | 171 I/O | 2.25 V | - 55 C | + 125 C | SMD/SMT | 217 MHz | 有 | 1 | Actel | 2.75 V | Tray | A54SX72 | -55°C ~ 125°C (TJ) | A54SX72A | 2.25V ~ 5.25V | 2.5 V | 108000 | 6036 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-2FGG256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | -40 °C | 2.5 V | 40 | 85 °C | 有 | A54SX32A-2FGG256I | 313 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 0.014110 oz | Actel | 90 | 有 | 313 MHz | SMD/SMT | + 85 C | - 40 C | 2.25 V | 203 I/O | Details | 2.75 V | Tray | A54SX32 | 活跃 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40°C ~ 85°C (TA) | Tray | A54SX32A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 203 | 不合格 | 2.5 V | 2.5,2.5/5 V | INDUSTRIAL | 203 | 2880 CLBS, 48000 GATES | 1.97 mm | 现场可编程门阵列 | 48000 | 2880 | 0.9 ns | 2880 | 2880 | 48000 | 1.2 mm | 17 mm | 17 mm |
APA600-FG484
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-CQ208M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA300-BG456I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX1000-1FG484M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-1CQ208
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX500-1FG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA150-FG144A
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-CQ208B
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX72A-CQ256M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32-CQ208B
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16-1TQG176I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-CQ84M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX250-2FG484
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
eX128-PTQG64I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32-1CQ208B
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA600-CQ208B
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA1000-BG456I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-1CQ84B
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA600-BGG456M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16P-2TQG176
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-1BG272
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA150-FG256A
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA300-PQG208M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX72A-CQ208B
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-2FGG256I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
