N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

85 °C

有

EX128-PTQG100I

357 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

70 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

Details

有

90

Actel

0.023175 oz

2.7 V

Tray

EX128

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

40

-40°C ~ 85°C (TA)

Tray

eX128

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

INDUSTRIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

0.7 ns

6000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

微芯片技术

PLASTIC/EPOXY

BGA896,30X30,40

2.5 V

30

70 °C

无

APA1000-FG896

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

642 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

27

Actel

0.014110 oz

Tray

APA1000

活跃

2.7 V

BGA, BGA896,30X30,40

网格排列

3

0°C ~ 70°C (TA)

Tray

APA1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

642

不合格

2.5,2.5/3.3 V

COMMERCIAL

642

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

STD

56320

1000000

1.73 mm

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

1.5 V

30

85 °C

无

AX1000-2FG484I

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

870 MHz

有

60

Actel

0.014110 oz

Tray

AX1000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

-40°C ~ 85°C (TA)

Tray

AX1000

e0

锡铅

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

870 MHz

S-PBGA-B484

516

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

70 °C

无

AX1000-FG676

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

649 MHz

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

30

0°C ~ 70°C (TA)

Tray

AX1000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

649 MHz

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

370 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

60

Actel

0.014110 oz

Tray

APA600

活跃

2.625 V

-40°C ~ 125°C (TJ)

Tray

APA600

125 °C

-40 °C

2.5 V

15.8 kB

129024

600000

180 MHz

STD

21504

2.625 V

2.375 V

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

活跃

454 I/O

0.014110 oz

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

40

Actel

This product may require additional documentation to export from the United States.

N

2.5000 V

2.7 V

Tray

APA600

0 to 70 °C

Tray

APA600

70 °C

0 °C

2.5 V

180 MHz

15.8 kB

129024

600000

180 MHz

STD

21504

2.7 V

2.3 V

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

This product may require additional documentation to export from the United States.

N

356 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

Actel

2.7 V

Tray

APA750

活跃

0°C ~ 70°C (TA)

Tray

APA750

70 °C

0 °C

2.5 V

18 kB

147456

750000

180 MHz

STD

32768

2.7 V

2.3 V

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

N

186 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.625 V

Tray

APA450

活跃

BGA, BGA256,16X16,40

网格排列

PLASTIC/EPOXY

BGA256,16X16,40

无

APA450-FG256A

BGA

SQUARE

-40°C ~ 125°C (TJ)

Tray

APA450

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

1 mm

unknown

S-PBGA-B256

186

不合格

2.5,2.5/3.3 V

186

现场可编程门阵列

110592

450000

STD

12288

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

Lead, Silver, Tin

表面贴装

表面贴装

BGA-456

YES

456

456-PBGA (35x35)

456

微芯片技术

3

PLASTIC/EPOXY

BGA456,26X26,50

-40 °C

2.5 V

30

85 °C

无

APA750-BG456I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

356 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA750

活跃

BGA, BGA456,26X26,50

网格排列

-40 to 85 °C

Tray

APA750

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1.27 mm

unknown

180 MHz

S-PBGA-B456

356

不合格

2.5,2.5/3.3 V

INDUSTRIAL

18 kB

356

750000 GATES

2.54 mm

现场可编程门阵列

147456

750000

180 MHz

STD

32768

32768

2.7 V

2.3 V

750000

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

PLASTIC/EPOXY

BGA144,12X12,40

2.5 V

30

70 °C

无

APA450-FG144

180 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

100 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

2.7 V

Tray

APA450

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

0°C ~ 70°C (TA)

Tray

APA450

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B144

100

不合格

2.5,2.5/3.3 V

COMMERCIAL

100

450000 GATES

1.55 mm

现场可编程门阵列

110592

450000

STD

12288

450000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

微芯片技术

-55 °C

2.5 V

20

125 °C

无

APA300-CQ208B

180 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.29

Military grade

This product may require additional documentation to export from the United States.

N

158 I/O

2.5 V

- 55 C

+ 125 C

SMD/SMT

5 MHz

有

1

Actel

2.5 V

Tray

APA300

活跃

GQFF, TPAK208,2.9SQ,20

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

-55°C ~ 125°C (TJ)

Bulk

APA300

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.5 V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

158

不合格

2.5,2.5/3.3 V

MILITARY

158

300000 GATES

3.3 mm

现场可编程门阵列

73728

300000

MIL-STD-883 Class B

8192

300000

29.21 mm

29.21 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

-55 °C

1.5 V

30

125 °C

无

AX1000-1FG676M

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-55°C ~ 125°C (TA)

Tray

AX1000

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

20.3 kB

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

MIL-STD-883 Class B

1

12096

0.84 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

27 mm

27 mm

无

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-256

YES

256

256-CQFP (75x75)

256

微芯片技术

73 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

Military grade

This product may require additional documentation to export from the United States.

N

202 I/O

3.3 V

- 55 C

+ 125 C

SMD/SMT

有

1

Actel

Tray

A42MX36

活跃

3.3 V

GQFF,

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

无

A42MX36-CQ256B

-55°C ~ 125°C (TJ)

A42MX36

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V

QUAD

FLAT

225

0.5 mm

compliant

S-CQFP-F256

不合格

MILITARY

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

2560

54000

MIL-STD-883

1822

2.7 ns

2438

54000

36 mm

36 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-256

YES

256

256-CQFP (75x75)

256

微芯片技术

83 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

Military grade

N

202 I/O

3.3 V

- 55 C

+ 125 C

SMD/SMT

有

1

Actel

This product may require additional documentation to export from the United States.

3.3 V

Tray

A42MX36

活跃

GQFF,

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

无

A42MX36-1CQ256B

-55°C ~ 125°C (TJ)

A42MX36

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V

QUAD

FLAT

225

0.5 mm

compliant

S-CQFP-F256

不合格

MILITARY

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

2560

54000

MIL-STD-883

1

1822

2.3 ns

2438

54000

36 mm

36 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

2.5 V

30

85 °C

无

APA150-FG144I

180 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

100 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

2.7 V

Tray

APA150

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

-40°C ~ 85°C (TA)

Tray

APA150

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1 mm

not_compliant

180 MHz

S-PBGA-B144

100

不合格

2.5,2.5/3.3 V

INDUSTRIAL

4.5 kB

100

150000 GATES

1.55 mm

现场可编程门阵列

36864

150000

180 MHz

6144

6144

2.7 V

2.3 V

150000

1.05 mm

13 mm

13 mm

无

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

896

896-FBGA (31x31)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

586 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0.014110 oz

Actel

27

有

870 MHz

1.575 V

Tray

AX2000

活跃

0°C ~ 70°C (TA)

Tray

AX2000

70 °C

0 °C

1.5 V

870 MHz

36 kB

740 ps

740 ps

21504

294912

2000000

870 MHz

32256

21504

2

21504

1.575 V

1.425 V

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

370 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

60

Actel

0.014110 oz

2.7 V

Tray

APA600

活跃

0°C ~ 70°C (TA)

Tray

APA600

70 °C

0 °C

2.5 V

180 MHz

15.8 kB

129024

600000

180 MHz

STD

21504

2.7 V

2.3 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

CQFP-208

208-CQFP (75x75)

微芯片技术

A54SX32

活跃

2.75 V

This product may require additional documentation to export from the United States.

N

174 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

238 MHz

有

1

Actel

Tray

-55°C ~ 125°C (TC)

A54SX32A

2.5 V

48000

2880

N/A

-

表面贴装

BGA-456

YES

456

456-PBGA (35x35)

456

290 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

PROASICPLUS

微芯片技术

85C

INDUSTRIALC

BGA

300000

-40C to 85C

290

300000

0.22UM

2.7(V)

2.5(V)

无

2.3(V)

-40C

有

8192

表面贴装

2.7 V

Tray

APA300

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

-40 °C

2.5 V

30

85 °C

无

APA300-BG456I

180 MHz

BGA

SQUARE

活跃

FPGA ProASICPLUS Family 300K Gates 180MHz 0.22um Technology 2.5V 456-Pin BGA Tray

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

-40°C ~ 85°C (TA)

Tray

APA300

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1.27 mm

unknown

180(MHz)

S-PBGA-B456

290

不合格

2.5,2.5/3.3 V

INDUSTRIAL

290

300000 GATES

2.54 mm

现场可编程门阵列

73728

300000

8192

300000

1.73 mm

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

-55 °C

1.5 V

30

125 °C

无

AX1000-1FG484M

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55°C ~ 125°C (TA)

Tray

AX1000

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

763 MHz

S-PBGA-B484

516

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

MIL-STD-883 Class B

12096

1

12096

0.84 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

YES

208

208-CQFP (75x75)

208

微芯片技术

N

176 I/O

3.3 V

0 C

+ 70 C

SMD/SMT

有

1

Actel

Tray

A42MX36

活跃

3.3 V

CERAMIC, QFP-208

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

3.3 V

70 °C

无

A42MX36-1CQ208

83 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

0°C ~ 70°C (TA)

A42MX36

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F208

不合格

COMMERCIAL

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

1

1822

2.3 ns

2438

5.25 V

3 V

54000

29.21 mm

29.21 mm

无

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

AX500

活跃

0.014110 oz

Actel

60

有

763 MHz

SMD/SMT

+ 85 C

- 40 C

1.425 V

317 I/O

-40°C ~ 85°C (TA)

Tray

AX500

1.5 V

73728

500000

8064

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

This product may require additional documentation to export from the United States.

N

100 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

2.625 V

Tray

APA150

活跃

BGA, BGA144,12X12,40

网格排列

PLASTIC/EPOXY

BGA144,12X12,40

无

APA150-FG144A

BGA

SQUARE

活跃

MICROSEMI CORP

5.61

-40°C ~ 125°C (TJ)

Tray

APA150

125 °C

-40 °C

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

1 mm

unknown

S-PBGA-B144

100

不合格

2.5,2.5/3.3 V

4.5 kB

100

现场可编程门阵列

36864

150000

180 MHz

STD

6144

6144

2.625 V

2.375 V

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

CQFP-208

208-CQFP (75x75)

微芯片技术

Tray

A54SX32

活跃

This product may require additional documentation to export from the United States.

N

174 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

238 MHz

有

1

Actel

2.75 V

-55°C ~ 125°C (TJ)

A54SX32A

2.5 V

48000

2880

N/A

-

表面贴装

CQFP-256

256-CQFP (75x75)

微芯片技术

This product may require additional documentation to export from the United States.

N

213 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

217 MHz

1

Actel

Tray

A54SX72

活跃

2.75 V

-55°C ~ 125°C (TC)

A54SX72A

2.5 V

108000

6036