49 In Stock

• 1: ¥588.124814
• 10: ¥554.834730
• 100: ¥523.428989
• 500: ¥493.800934
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

+ 70 C

0 C

1.425 V

97 I/O

N

微芯片技术

This product may require additional documentation to export from the United States.

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0.014110 oz

ProASIC3

160

有

272 MHz

SMD/SMT

0 to 70 °C

Tray

M1A3P600

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.05 mm

13 mm

13 mm

969 In Stock

• 1: ¥6,931.434890
• 10: ¥6,539.089516
• 100: ¥6,168.952372
• 500: ¥5,819.766386
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

有

M1AGLE3000V2-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

60

IGLOOe

0 to 70 °C

Tray

M1AGLE3000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.2 V to 1.5 V

COMMERCIAL

1.575 V

1.14 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

892.86 MHz

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

19 In Stock

• 1: ¥340.108985
• 10: ¥320.857531
• 100: ¥302.695783
• 500: ¥285.562060
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

144

144-FPBGA (13x13)

400.011771 mg

微芯片技术

有

160

IGLOOe

0.014110 oz

1.575 V

Tray

M1AGL250

活跃

This product may require additional documentation to export from the United States.

N

3000 LE

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

M1AGL250V5

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

4.5 kB

6144

36864

250000

STD

1.05 mm

13 mm

13 mm

49 In Stock

• 1: ¥706.440725
• 10: ¥666.453515
• 100: ¥628.729728
• 500: ¥593.141259
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

SMD/SMT

272 MHz

有

90

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-1FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.2 mm

17 mm

17 mm

19 In Stock

• 1: ¥311.447047
• 10: ¥293.817966
• 100: ¥277.186764
• 500: ¥261.496947
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

160

ProASIC3

0.014110 oz

微芯片技术

1.425 V

1.575 V

Tray

M1A3P250

活跃

1.575 V

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P250-2FGG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

-40°C ~ 100°C (TJ)

Tray

M1A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.05 mm

13 mm

13 mm

2278 In Stock

• 1: ¥2,100.842672
• 10: ¥1,981.927047
• 100: ¥1,869.742493
• 500: ¥1,763.908017
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

+ 85 C

SMD/SMT

272 MHz

有

24

ProASIC3

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1A3PE1500

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

3.4 mm

28 mm

28 mm

504 In Stock

• 1: ¥4,824.112438
• 10: ¥4,551.049469
• 100: ¥4,293.442898
• 500: ¥4,050.417828
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

+ 70 C

SMD/SMT

微芯片技术

892.86 MHz

1.2000 V

1.14 V

1.26 V

Tray

A3PE3000

活跃

1.26 V

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.2 V

30

70 °C

无

A3PE3000L-1FG324

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

有

84

ProASIC3

0.014110 oz

This product may require additional documentation to export from the United States.

N

221 I/O

1.14 V

0 C

0 to 70 °C

Tray

A3PE3000L

e0

锡铅银

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.5 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

892.86 MHz

1

75264

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

2485 In Stock

• 1: ¥4,028.384773
• 10: ¥3,800.362991
• 100: ¥3,585.248102
• 500: ¥3,382.309531
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

A3PE3000-1FGG324

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

221 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

84

ProASIC3

0 to 70 °C

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

25 mA

63 kB

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

2767 In Stock

• 1: ¥2,138.273683
• 10: ¥2,017.239324
• 100: ¥1,903.055963
• 500: ¥1,795.335820
查看所有的价格

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

M1AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS600-2FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

0°C ~ 85°C (TJ)

Tray

M1AFS600

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

13824

600000

1.2 mm

17 mm

17 mm

无

2436 In Stock

• 1: ¥1,857.855620
• 10: ¥1,752.693978
• 100: ¥1,653.484885
• 500: ¥1,559.891401
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

85 °C

有

A3P1000L-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

-40 to 85 °C

Tray

A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

19 In Stock

• 1: ¥146.615536
• 10: ¥138.316546
• 100: ¥130.487304
• 500: ¥123.101236
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

90

ProASIC3

1.5000 V

微芯片技术

1.425 V

1.575 V

Tray

M1A3P250

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-2VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

0 to 70 °C

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

2933 In Stock

• 1: ¥1,418.882040
• 10: ¥1,338.567959
• 100: ¥1,262.799967
• 500: ¥1,191.320718
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

160

ProASIC3

微芯片技术

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

30

85 °C

无

M1A3P600L-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

-40 to 85 °C

Tray

M1A3P600L

e0

锡铅银

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

13824

600000

1.05 mm

13 mm

13 mm

2187 In Stock

• 1: ¥1,121.484804
• 10: ¥1,058.004529
• 100: ¥998.117486
• 500: ¥941.620268
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

M1AGL600V2-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

0.014110 oz

IGLOOe

90

有

SMD/SMT

+ 70 C

0 C

1.14 V

177 I/O

1.575 V

Tray

M1AGL600

0°C ~ 70°C (TA)

Tray

M1AGL600V2

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.2 V to 1.5 V

OTHER

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

2608 In Stock

• 1: ¥901.884208
• 10: ¥850.834157
• 100: ¥802.673736
• 500: ¥757.239373
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

+ 70 C

SMD/SMT

有

160

IGLOOe

0.014110 oz

微芯片技术

FBGA

1.5000 V

1.425 V

600000

97

600000

1.575 V

表面贴装

Tray

M1AGL600

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AGL600V5-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Commercial grade

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 C

0 to 70 °C

Tray

M1AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

144

S-PBGA-B144

不合格

1.5 V

OTHER

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

Commercial

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

19 In Stock

• 1: ¥611.857178
• 10: ¥577.223756
• 100: ¥544.550713
• 500: ¥513.727092
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

+ 70 C

SMD/SMT

781.25 MHz

有

160

ProASIC3

微芯片技术

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

M1A3P600L-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

0 C

0 to 70 °C

Tray

M1A3P600L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

2423 In Stock

• 1: ¥1,121.484804
• 10: ¥1,058.004529
• 100: ¥998.117486
• 500: ¥941.620268
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

40

85 °C

有

M1AGL600V2-FGG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

有

90

IGLOOe

0.014110 oz

0 to 70 °C

Tray

M1AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.2 V to 1.5 V

OTHER

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

无铅

2833 In Stock

• 1: ¥1,439.977289
• 10: ¥1,358.469138
• 100: ¥1,281.574658
• 500: ¥1,209.032699
查看所有的价格

-

表面贴装

CSP

YES

281-CSP (10x10)

281

184

微芯片技术

IGLOOe

Tray

AGL1000

活跃

1.575 V

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

未说明

85 °C

无

AGL1000V2-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

11000 LE

215 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

0°C ~ 70°C (TA)

Tray

AGL1000V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B281

不合格

1.2 V to 1.5 V

OTHER

44 uA

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

0.71 mm

10 mm

10 mm

2150 In Stock

• 1: ¥1,791.538863
• 10: ¥1,690.131006
• 100: ¥1,594.463213
• 500: ¥1,504.210582
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3P1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

85 °C

有

A3P1000L-FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

11000 LE

-40 to 85 °C

Tray

A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

2285 In Stock

• 1: ¥3,873.224445
• 10: ¥3,653.985328
• 100: ¥3,447.155972
• 500: ¥3,252.033932
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

1.575 V

Tray

A3PE3000

活跃

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, FBGA-324

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE3000-2FG324

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

221 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

84

ProASIC3

0.014110 oz

1.5000 V

0 to 70 °C

Tray

A3PE3000

e0

锡铅银

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

25 mA

63 kB

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

2588 In Stock

• 1: ¥3,687.595460
• 10: ¥3,478.863639
• 100: ¥3,281.946831
• 500: ¥3,096.176257
查看所有的价格

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

1.575 V

FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS1500-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

Tray

M1AFS1500

活跃

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

2916 In Stock

• 1: ¥2,468.310159
• 10: ¥2,328.594488
• 100: ¥2,196.787255
• 500: ¥2,072.440804
查看所有的价格

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

1.425 V

444 I/O

N

微芯片技术

This product may require additional documentation to export from the United States.

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

30

70 °C

无

M1A3PE1500-1FG676

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

40

ProASIC3

0.014110 oz

有

272 MHz

SMD/SMT

+ 70 C

0 C

0°C ~ 85°C (TJ)

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

27 mm

27 mm

989 In Stock

• 1: ¥13,267.702411
• 10: ¥12,831.433663
• 25: ¥12,742.238000
• 50: ¥12,653.662362
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

SMD/SMT

892.86 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.2000 V

Tray

M1A3PE3000

活跃

1.26 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

30

85 °C

无

M1A3PE3000L-1FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

- 40 C

+ 85 C

-40 to 85 °C

Tray

M1A3PE3000L

e0

锡铅

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

25 mA

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

23 mm

23 mm

2990 In Stock

• 1: ¥1,074.815783
• 10: ¥1,013.977154
• 100: ¥956.582221
• 500: ¥902.436054
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

+ 85 C

SMD/SMT

310 MHz

有

0.014110 oz

ProASIC3

微芯片技术

60

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-2FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

23 mm

23 mm

49 In Stock

• 1: ¥387.199753
• 10: ¥365.282787
• 100: ¥344.606402
• 500: ¥325.100378
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

160

IGLOOe

微芯片技术

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

Tray

M1AGL250

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.2 V

40

100 °C

有

M1AGL250V2-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

3000 LE

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

有

-40 to 85 °C

Tray

M1AGL250V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.2 V to 1.5 V

INDUSTRIAL

1.575 V

1.14 V

4.5 kB

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

2650 In Stock

• 1: ¥2,780.559209
• 10: ¥2,623.169064
• 100: ¥2,474.687797
• 500: ¥2,334.611129
查看所有的价格

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

This product may require additional documentation to export from the United States.

Details

300000 LE

512 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

0°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400