品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 内存大小 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 长度 | 宽度 | |||||||||||||||||||||||||||||
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![]() | A42MX09-TQG176I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 176-LQFP | YES | 176-TQFP (24x24) | 176 | 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 微芯片技术 | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 3 V | 85 °C | 有 | A42MX09-TQG176I | 117 MHz | LFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.29 | 104 | Tray | A42MX09 | 活跃 | -40°C ~ 85°C (TA) | MX | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | INDUSTRIAL | 684 CLBS, 14000 GATES | 1.6 mm | 现场可编程门阵列 | 14000 | STD | 2.5 ns | 684 | 14000 | 24 mm | 24 mm | ||||||||||||||||||||||||
![]() | A3PE600-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | QFP208,1.2SQ,20 | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | A3PE600-1PQ208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.85 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 147 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||
![]() | AX250-FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | 1.425 V | 1.575 V | 138 | Tray | AX250 | 活跃 | -40°C ~ 85°C (TA) | Axcelerator | 1.425V ~ 1.575V | 55296 | 250000 | 4224 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-FGG484M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 317 | Tray | AX500 | 活跃 | -55°C ~ 125°C (TA) | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250L-1FGG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | A3P250L-1FGG256 | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.28 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 157 | 不合格 | 1.5/3.3 V | COMMERCIAL | 157 | 6144 CLBS, 250000 GATES | 1.8 mm | 现场可编程门阵列 | 6144 | 6144 | 250000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||
![]() | A3P1000-FG144T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 活跃 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 微芯片技术 | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | -40 °C | 1.5 V | 20 | 1.425 V | 125 °C | 无 | A3P1000-FG144T | 350 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.23 | Automotive grade | 97 | Tray | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 235 | 1 mm | compliant | S-PBGA-B144 | 97 | 不合格 | 1.5/3.3 V | AUTOMOTIVE | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | 现场可编程门阵列 | 147456 | 1000000 | AEC-Q100 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||
![]() | AGL400V2-FGG256T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256 | 55296 | Compliant | 3 | 30 | 有 | AGL400V2-FGG256T | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.77 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | 250 | compliant | 6.8 kB | 现场可编程门阵列 | 9216 | 400000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000L-FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | BGA484,22X22,40 | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | A3P1000L-FG484I | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 300 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 24576 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||
![]() | AFS600-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 1.425 V | 85 °C | 无 | AFS600-PQ208 | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.84 | QFP-208 | FLATPACK | 3 | PLASTIC/EPOXY | 1.5 V | 30 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | QUAD | FLAT | 225 | 0.5 mm | unknown | R-PQFP-F208 | 不合格 | OTHER | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 600000 | 30.6 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000L-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | BGA484,22X22,40 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | A3P1000L-1FGG484I | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 7.66 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 300 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 24576 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||
![]() | A3P030-QNG132 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS600-FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 1.5000 V | 1.425 V | 1.575 V | 172 | Tray | AFS600 | 活跃 | -40 to 85 °C | Fusion® | 1.425V ~ 1.575V | 110592 | 600000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-2FGG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | BGA144,12X12,40 | -40 °C | 2.5 V | 40 | 2.25 V | 85 °C | 有 | A54SX32A-2FGG144I | 313 MHz | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.32 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | e1 | 锡银铜 | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 111 | 不合格 | 2.5,2.5/5 V | INDUSTRIAL | 111 | 2880 CLBS, 48000 GATES | 1.55 mm | 现场可编程门阵列 | 0.9 ns | 2880 | 2880 | 48000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||
![]() | A1425A-1CQ132B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 132 | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | TPAK132,2.5SQ,25 | -55 °C | 5 V | 未说明 | 4.5 V | 125 °C | 无 | A1425A-1CQ132B | 150 MHz | GQFF | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.88 | Military grade | 100 | Non-Compliant | HERMETIC SEALED, CERAMIC, QFP-132 | e0 | 3A001.A.2.C | 锡铅 | 6250 PLD EQUIVALENT GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | FLAT | 未说明 | 0.635 mm | compliant | S-CQFP-F132 | 100 | 不合格 | 5 V | MILITARY | 100 | 310 CLBS, 2500 GATES | 2.9464 mm | 现场可编程门阵列 | 2500 | MIL-STD-883 | 310 | 2.6 ns | 310 | 310 | 2500 | 24.13 mm | 24.13 mm | ||||||||||||||||||||||||
![]() | A3P1000-1FG144T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 活跃 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 微芯片技术 | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | -40 °C | 1.5 V | 20 | 1.425 V | 125 °C | 无 | A3P1000-1FG144T | 350 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.23 | Automotive grade | 97 | Tray | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e0 | 锡铅银 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 235 | 1 mm | compliant | S-PBGA-B144 | 97 | 不合格 | 1.5/3.3 V | AUTOMOTIVE | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | 现场可编程门阵列 | 147456 | 1000000 | AEC-Q100 | 1 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||
![]() | A1010B-VQ80I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE600L-1FGG484M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 微芯片技术 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 40 | 1.14 V | 125 °C | 有 | A3PE600L-1FGG484M | 250 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | 270 | Tray | A3PE600 | -55°C ~ 125°C (TJ) | ProASIC3EL | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 270 | 不合格 | 1.2/1.5,1.2/3.3 V | MILITARY | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | 13824 | 13824 | 600000 | 23 mm | 23 mm | |||||||||||||||||||
![]() | A1440A-PLG84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-1QNG132I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE600-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | QFP208,1.2SQ,20 | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | A3PE600-PQ208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.85 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 147 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||
![]() | A1280A-1CQ172B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A14V40A-VQ100C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 3.3 V | 30 | 3 V | 70 °C | 无 | A14V40A-VQ100C | 100 MHz | TFQFP | SQUARE | Microsemi Corporation | 生命周期结束 | MICROSEMI CORP | 3.6 V | 5.32 | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | e0 | Tin/Lead (Sn/Pb) | MAX 83 I/OS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 83 | 不合格 | 3.3 V | COMMERCIAL | 83 | 564 CLBS, 4000 GATES | 1.2 mm | 现场可编程门阵列 | 3.9 ns | 564 | 564 | 4000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||
![]() | A3P400-FG256I/J62537AA | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300T-FCG784IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | West Control Solutions | P4701Z2110001 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300XT-FCG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | P4701Z2111100 | West Control Solutions |
A42MX09-TQG176I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE600-1PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX250-FG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX500-FGG484M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P250L-1FGG256
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000-FG144T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL400V2-FGG256T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000L-FG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS600-PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000L-1FGG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P030-QNG132
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS600-FGG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-2FGG144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1425A-1CQ132B
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000-1FG144T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1010B-VQ80I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE600L-1FGG484M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1440A-PLG84C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P250-1QNG132I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE600-PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1280A-1CQ172B
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A14V40A-VQ100C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P400-FG256I/J62537AA
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF300T-FCG784IPP
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF300XT-FCG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
