N/A

-

78101197455

Cooper

N/A

-

N/A

-

微芯片技术

4184880

Fluke

131

Tray

Discontinued at Digi-Key

This product may require additional documentation to export from the United States.

1

微芯片技术

N

活跃

MICROSEMI CORP

5.74

0°C ~ 70°C (TA)

MX

可编程逻辑集成电路

3V ~ 3.6V, 4.75V ~ 5.25V

compliant

现场可编程门阵列

FPGA - Field Programmable Gate Array

24000

FPGA - Field Programmable Gate Array

N/A

-

Miscellaneous

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

BTW39-700X

Miscellaneous

284

Tray

活跃

-55°C ~ 125°C (TJ)

PolarFire™

0.97V ~ 1.08V

300000

21600666

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

2.5 V

30

2.25 V

85 °C

无

A54SX08A-2TQ144I

313 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.25

113

Tray

A54SX08A

Obsolete

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

INDUSTRIAL

113

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

0.9 ns

768

768

12000

20 mm

20 mm

N/A

-

表面贴装

176-TQFP

YES

176-VQFP (20x20)

176

微芯片技术

TFQFP

250 MHz

AGLP060V5-VQ176

无

70 °C

1.425 V

未说明

1.5 V

TQFP176,.87SQ,16

PLASTIC/EPOXY

137

Tray

AGLP060

Obsolete

20 X 20 MM, 1 MM HEIGHT, 0.4 MM PITCH, VQFP-176

FLATPACK, THIN PROFILE, FINE PITCH

5.28

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

0°C ~ 85°C (TJ)

IGLOO PLUS

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.4 mm

unknown

S-PQFP-G176

137

不合格

1.5 V

COMMERCIAL

137

1584 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1584

18432

60000

1584

1584

60000

20 mm

20 mm

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

QFP100,.63SQ,20

-40 °C

2.5 V

30

2.25 V

85 °C

无

294 MHz

LFQFP

SQUARE

Obsolete

MICROSEMI CORP

2.75 V

5.27

C0005P9GSES

Cutler Hammer, Div of Eaton Corp

81

Tray

A54SX16A

Obsolete

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,3.3/5 V

INDUSTRIAL

81

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1 ns

1452

1452

24000

14 mm

14 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

活跃

,

未说明

有

M2GL060-1FGG484T1

Microsemi Corporation

活跃

MICROSEMI CORP

5.81

267

Tray

M2GL060

-40°C ~ 135°C (TJ)

Automotive, AEC-Q100, IGLOO2

有

1.14V ~ 2.625V

未说明

compliant

现场可编程门阵列

56520

1869824

N/A

-

表面贴装

484-BFBGA

484-FPBGA (19x19)

Copper

微芯片技术

600 V

Compliant

PVC

284

Tray

MPF100

活跃

600 V

0°C ~ 100°C (TJ)

PolarFire™

Blue

0.97V ~ 1.08V

12 A

20 AWG

109000

7782400

N/A

-

Non-Compliant

Female

Socket

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

1.2 V

30

1.14 V

70 °C

无

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.61

ASLD29922N-111-A-12V

IDEC

147

Tray

M1A3PE3000L

Obsolete

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

0°C ~ 85°C (TJ)

ProASIC3L

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

微芯片技术

Tray

A54SX32A

Obsolete

113

0°C ~ 70°C (TA)

SX-A

2.25V ~ 5.25V

48000

2880

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

1.5000 V

115

Tray

AX500

活跃

0 to 70 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

STD

N/A

-

表面贴装

196-TFBGA, CSBGA

YES

196-CSP (8x8)

196

微芯片技术

PLASTIC/EPOXY

1.2 V

未说明

1.14 V

85 °C

有

AGL400V2-CSG196

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

1.2, 1.5 V

1.14 V

1.575 V

143

Tray

AGL400

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

0 to 70 °C

IGLOO

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

OTHER

9216 CLBS, 400000 GATES

1.2 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

8 mm

8 mm

N/A

-

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

68

3

微芯片技术

UNSPECIFIED

5.59

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

HVQCCN

AGLN020V2-QNG68

有

70 °C

1.14 V

未说明

1.2 V

-20 °C

1.2, 1.5 V

1.14 V

1.575 V

49

Tray

AGLN020

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

-20 to 70 °C

IGLOO nano

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N68

不合格

OTHER

520 CLBS, 20000 GATES

1 mm

现场可编程门阵列

520

20000

STD

520

20000

8 mm

8 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

2.25 V

2.5000 V

203

Tray

A54SX32

活跃

2.75 V

-40 to 85 °C

SX-A

2.25V ~ 5.25V

48000

2880

STD

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-UCSP (4x4)

81

微芯片技术

有

AGLN030V5-ZUCG81I

VFBGA

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.31

Miscellaneous

66

Tray

AGLN030

Obsolete

4 X 4 MM, 0.80 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, UCSP-81

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

1.425 V

85 °C

-40°C ~ 100°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.4 mm

compliant

S-PBGA-B81

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

0.8 mm

现场可编程门阵列

768

30000

768

30000

4 mm

4 mm

N/A

-

Polystyrene

132078

Brady

Safety Signs

Fall Hazard

Yellow

English

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

Aluminum

81

微芯片技术

1.14 V

70 °C

有

VFBGA

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.8

None

P-Q7Q29-B3RX

Grace Technologies

60

Tray

AGLN125

Obsolete

5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-20 °C

1.2 V

未说明

-20°C ~ 85°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

OTHER

3072 CLBS, 125000 GATES

0.8 mm

现场可编程门阵列

3072

36864

125000

3072

125000

IP65

5 mm

5 mm

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

微芯片技术

70 °C

有

VFBGA

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.81

1SNA020043R2100

ABB

60

Tray

AGLN250

Obsolete

5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-20 °C

1.5 V

未说明

1.425 V

-20°C ~ 85°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

OTHER

6144 CLBS, 250000 GATES

0.8 mm

现场可编程门阵列

6144

36864

250000

6144

250000

5 mm

5 mm

N/A

-

YES

313

3 V

85 °C

无

320 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

3.6 V

5.24

Cutler Hammer, Div of Eaton Corp

STS363NP3

BGA, BGA313,25X25,50

网格排列

3

PLASTIC/EPOXY

BGA313,25X25,50

-40 °C

3.3 V

30

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B313

249

不合格

3.3,5 V

INDUSTRIAL

249

2880 CLBS, 32000 GATES

2.52 mm

现场可编程门阵列

0.7 ns

2880

2880

32000

35 mm

35 mm

N/A

-

Honeywell

T678A1445/U

CSA, UL

Remote Bulb

2 SPDT

N/A

-

Surface

24D10MST2-10AMP

Amperite

10

0.250 in Flat Blade

24 VDC

Interval

固态

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

微芯片技术

有

AGLN250V5-ZCSG81I

VFBGA

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.81

Miscellaneous

60

Tray

AGLN250

Obsolete

5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

1.425 V

85 °C

-40°C ~ 100°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

0.8 mm

现场可编程门阵列

6144

36864

250000

6144

250000

5 mm

5 mm