N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

3.3 V

40

70 °C

有

A54SX32-1BGG329

280 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

249 I/O

3 V

0 C

+ 70 C

SMD/SMT

280 MHz

有

27

Actel

3.6 V

Tray

A54SX32

活跃

0°C ~ 70°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

3.3,5 V

COMMERCIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS600-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

7000 LE

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS600

-40°C ~ 100°C (TJ)

Tray

AFS600

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.28205 GHz

1

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

2.5 V

40

70 °C

有

A54SX32A-2BGG329

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Details

249 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

有

27

Actel

2.75 V

Tray

A54SX32

活跃

0°C ~ 70°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

2.5,3.3/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

活跃

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

2.5 V

40

85 °C

有

A54SX32A-2BGG329I

Details

249 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

313 MHz

有

27

Actel

2.75 V

Tray

A54SX32

-40°C ~ 85°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

2.5,3.3/5 V

INDUSTRIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

512 I/O

0°C ~ 100°C (TJ)

Tray

MPF300T

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

244 I/O

0°C ~ 100°C (TJ)

Tray

MPF300TL

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

192000 LE

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

364

-40°C ~ 100°C (TJ)

Tray

MPF200T

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

284 I/O

0°C ~ 100°C (TJ)

Tray

MPF300T

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

+ 100 C

SMD/SMT

有

1

PolarFire

Tray

MPF200

活跃

1.08 V

This product may require additional documentation to export from the United States.

Details

192000 LE

284 I/O

0.97 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

MPF200T

1 V, 1.05 V

12.5 Gb/s

192000

13619200

4 Transceiver

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

300000 LE

284 I/O

0.97 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

0.452847 oz

Tray

MPF300

活跃

1.08 V

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF300T

1 V, 1.05 V

12.5 Gb/s

300000

21094400

4 Transceiver

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

388

Tray

MPF500

活跃

-40°C ~ 100°C (TJ)

Tray

MPF500TLS

1.05 V

481000

33792000

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

192000 LE

244 I/O

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

0°C ~ 100°C (TJ)

Tray

MPF200T

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-784

784

784-FCBGA (29x29)

微芯片技术

Commercial

FCBGA

0C to 100C

388

300000

28NM

无

0C

有

300000

表面贴装

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

388 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

POLARFIRE

100C

0°C ~ 100°C (TJ)

Tray

MPF300T

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

388

Tray

MPF500

活跃

-40°C ~ 100°C (TJ)

Tray

MPF500T

1.05 V

481000

33792000

N/A

-

表面贴装

BGA-325

325-FCBGA (11x14.5)

微芯片技术

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

170

Tray

MPF200

活跃

-40°C ~ 100°C (TJ)

Tray

MPF200TS

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

388 I/O

-40°C ~ 100°C (TJ)

Tray

MPF300TS

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

244 I/O

-40°C ~ 100°C (TJ)

Tray

MPF300TLS

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

0.97 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

284 I/O

0°C ~ 100°C (TJ)

Tray

MPF300T

1 V, 1.05 V

12.5 Gb/s

300000

21094400

4 Transceiver

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

388

Tray

MPF500

活跃

-40°C ~ 100°C (TJ)

Tray

MPF500TS

1.05 V

481000

33792000

N/A

-

表面贴装

BGA-325

325-FCBGA (11x14.5)

微芯片技术

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

192000 LE

170 I/O

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

-40°C ~ 100°C (TJ)

Tray

MPF200T

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

364

Tray

MPF200

活跃

-40°C ~ 100°C (TJ)

Tray

MPF200TLS

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

192000 LE

284 I/O

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

-40°C ~ 100°C (TJ)

Tray

MPF200T

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

300000 LE

244 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.304431 oz

Tray

MPF300

活跃

1.03 V/1.08 V

This product may require additional documentation to export from the United States.

Details

0°C ~ 100°C (TJ)

Tray

MPF300T

1 V, 1.05 V

12.7 Gb/s

300000

21094400

8 Transceiver

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

388 I/O

-40°C ~ 100°C (TJ)

Tray

MPF300TLS

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

SMD/SMT

+ 100 C

- 40 C

970 mV/1.02 V

388 I/O

300000 LE

Details

This product may require additional documentation to export from the United States.

1.03 V/1.08 V

Tray

MPF300

活跃

有

1

20.6 Mbit

PolarFire

-40°C ~ 100°C (TJ)

Tray

MPF300TS

1.05 V

12.7 Gb/s

300000

21094400