N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P125-PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.22

Details

1500 LE

133 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

24

36864 bit

ProASIC3

0.183425 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

FQFP,

-40 to 85 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

15 mA

-

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

36864

125000

STD

-

3072

125000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA-256

256-FPBGA (17x17)

微芯片技术

36 kbit

180 MHz

有

-

90

36864 bit

ProASICPLUS

2.7 V

Tray

APA150

活跃

This product may require additional documentation to export from the United States.

Details

-

186 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

36 kbit

0°C ~ 70°C (TA)

Tray

APA150

2.3V ~ 2.7V

2.5 V

5 mA

36864

150000

STD

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

Details

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

Tray

AFS1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

AFS1500-2FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

AFS1500

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.28205 GHz

1

38400

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

活跃

MICROSEMI CORP

5.29

Details

140 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

172 MHz

有

24

Actel

Tray

A42MX16

活跃

5.5 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-PQG208I

94 MHz

FQFP

SQUARE

-40°C ~ 85°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

STD

2.8 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

有

M7A3P1000-FGG256

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

0 to 70 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1000000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

活跃

MICROSEMI CORP

5.29

160 MHz

有

27

Actel

0.084185 oz

SMD/SMT

+ 70 C

0 C

3 V

34 I/O

Details

5.25 V

Tray

A40MX04

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-1PLG44

48 MHz

QCCJ

SQUARE

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

5.23

Details

174 I/O

3 V

0 C

+ 70 C

SMD/SMT

240 MHz

有

24

Actel

3.6 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

3.3 V

40

70 °C

有

A54SX32-PQG208

240 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

0°C ~ 70°C (TA)

Tray

A54SX32

e3

Matte Tin (Sn)

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

240 MHz

S-PQFP-G208

174

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

5.25 V

4.75 V

900 ps

900 ps

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

0.9 ns

2880

2880

32000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

YES

208

208-CQFP (75x75)

208

微芯片技术

SMD/SMT

有

1

Actel

3.3 V

Tray

A42MX36

活跃

CERAMIC, QFP-208

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

3.3 V

70 °C

无

A42MX36-CQ208

73 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

N

176 I/O

3.3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

A42MX36

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

FLAT

0.5 mm

compliant

208

S-CQFP-F208

不合格

3.3 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

1822

2.7 ns

2438

2414

54000

29.21 mm

29.21 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

A3P125-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

0°C ~ 85°C (TJ)

Tray

A3P125

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

1

3072

125000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

Details

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

238 MHz

有

60

Actel

0.046530 oz

2.75 V

Tray

A54SX08

活跃

0°C ~ 70°C (TA)

Tray

A54SX08A

2.25V ~ 5.25V

2.5 V

12000

768

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

微芯片技术

3.3 V

40

85 °C

有

A42MX16-1PQG100I

108 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

Details

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

198 MHz

有

66

Actel

0.062040 oz

3.3, 5 V

3 V

5.5 V

Tray

A42MX16

活跃

5.5 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

-40 to 85 °C

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

1

2.4 ns

1232

24000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

A54SX16A-2TQG100I

294 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

81 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

294 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40 °C

2.5 V

40

85 °C

有

-40°C ~ 85°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

172

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

172

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1 ns

1452

1452

24000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

167 MHz

有

60

Actel

0.046530 oz

2.75 V

Tray

A54SX16

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

70 °C

有

A54SX16A-FTQG144

167 MHz

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.9 ns

1452

1452

24000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

EX256-TQG100

250 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

512 LE

81 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

-

90

Actel

0.023175 oz

2.7 V

Tray

EX256

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

40

70 °C

有

0°C ~ 70°C (TA)

Tray

EX256

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

2.5 V

COMMERCIAL

12000 GATES

1.6 mm

现场可编程门阵列

512

12000

1 ns

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

249 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

280 MHz

有

27

Actel

3.6 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

3.3 V

40

85 °C

有

A54SX32-1BGG329I

280 MHz

-40°C ~ 85°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

INDUSTRIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

活跃

1.575 V

Details

-

100 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

60

ProASIC3

0.046530 oz

1.5000 V

Tray

A3P125

-40 to 85 °C

Tray

A3P125

1.425V ~ 1.575V

1.5 V

36864

125000

1

1.4 mm

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

1.63

This product may require additional documentation to export from the United States.

Details

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

60

Fusion

0.014110 oz

Tray

AFS1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

AFS1500-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

-40°C ~ 100°C (TJ)

Tray

AFS1500

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

1.0989 GHz

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.0989 GHz

STD

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

370 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

60

Actel

0.014110 oz

2.5000 V

2.3 V

2.7 V

Tray

APA600

活跃

2.7 V

-40 to 85 °C

Tray

APA600

85 °C

-40 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

有

66

Actel

0.062040 oz

42MX

85C

INDUSTRIALC

PQFP

微芯片技术

14000

-40C to 85C

83

14000

336

0.45UM

5.5(V)

3.3/5(V)

无

3(V)

-40C

有

336

516

表面贴装

5.5 V

Tray

A42MX09

活跃

1.55

MICROSEMI CORP

活跃

RECTANGULAR

QFP

135 MHz

A42MX09-1PQG100I

有

85 °C

40

3.3 V

-40 °C

PLASTIC/EPOXY

3

FLATPACK

ROHS COMPLIANT, PLASTIC, QFP-100

Details

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

247 MHz

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

148/247(MHz)

100

R-PQFP-G100

不合格

3.3 V, 5 V

INDUSTRIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

2.1 ns

684

14000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

BGA-456

456-PBGA (35x35)

微芯片技术

2.7 V

Tray

APA450

活跃

2.7 V

This product may require additional documentation to export from the United States.

Details

344 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

-40 to 85 °C

Tray

APA450

2.3V ~ 2.7V

456

2.5 V

110592

450000

STD

1.73 mm

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

This product may require additional documentation to export from the United States.

N

7000 LE

172 I/O

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

360 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

294 MHz

有

40

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

30

70 °C

无

A54SX72A-2FG484

294 MHz

0°C ~ 70°C (TA)

Tray

A54SX72A

e0

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

360

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1.1 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

+ 85 C

SMD/SMT

126 kbit

126 kbit

180 MHz

有

-

24

129024 bit

ProASICPLUS

2.5000 V

2.3 V

2.7 V

Tray

APA600

活跃

2.7 V

Details

7000 LE

158 I/O

2.3 V

- 40 C

-40 to 85 °C

Tray

APA600

2.3V ~ 2.7V

2.5 V

5 mA

-

129024

600000

STD

-

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

APA300-FGG144

180 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

100 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

2.7 V

Tray

APA300

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

2.5 V

40

70 °C

有

0°C ~ 70°C (TA)

Tray

APA300

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

100

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

100

300000 GATES

1.55 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.05 mm

13 mm

13 mm