对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

JESD-30代码

输出的数量

资历状况

电源

温度等级

内存大小

传播延迟

接通延迟时间

数据率

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

筛选水平

逻辑块数(LABs)

速度等级

收发器数量

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

电压 - 供电 (最大值)

电压 - 供电 (最小值)

等效门数

高度

长度

宽度

辐射硬化

无铅

MPF300TL-FCG484I
MPF300TL-FCG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

300000 LE

244 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

-40°C ~ 100°C (TJ)

Tray

MPF300TL

1.05 V

12.7 Gb/s

300000

21094400

MPF200TS-FCG484I
MPF200TS-FCG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

YES

484-FCBGA (23x23)

484

0.97 V

- 40 C

+ 100 C

SMD/SMT

微芯片技术

1

PolarFire

0.667354 oz

Tray

MPF200

活跃

1.08 V

BGA,

网格排列

4

PLASTIC/EPOXY

-40 °C

1 V

未说明

100 °C

MPF200TS-FCG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.82

This product may require additional documentation to export from the United States.

Details

192000 LE

284 I/O

-40°C ~ 100°C (TJ)

Tray

MPF200TS

CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL

1.05 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B484

INDUSTRIAL

12.5 Gb/s

2.87 mm

现场可编程门阵列

192000

13619200

4 Transceiver

23 mm

23 mm

MPF500TL-FCG1152I
MPF500TL-FCG1152I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

SMD/SMT

1

PolarFire

1.03 V/1.08 V

584

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

-40°C ~ 100°C (TJ)

Tray

MPF500TL

1.05 V

481000

33792000

MPF500TLS-FCG1152I
MPF500TLS-FCG1152I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

SMD/SMT

1

PolarFire

1.03 V/1.08 V

584

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

-40°C ~ 100°C (TJ)

Tray

MPF500TLS

1.05 V

481000

33792000

A42MX09-1PQG160
A42MX09-1PQG160
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

SMD/SMT

247 MHz

微芯片技术

24

Actel

0.196363 oz

5.25 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX09-1PQG160

135 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

101 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

COMMERCIAL

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

2.1 ns

684

14000

3.4 mm

28 mm

28 mm

A54SX32A-1TQG100
A54SX32A-1TQG100
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

+ 70 C

SMD/SMT

278 MHz

微芯片技术

90

Actel

0.023175 oz

2.75 V

Tray

A54SX32

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

A54SX32A-1TQG100

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

81 I/O

2.25 V

0 C

0°C ~ 70°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,2.5/5 V

COMMERCIAL

81

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.4 mm

14 mm

14 mm

EX64-TQG64I
EX64-TQG64I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-64

YES

64-TQFP (10x10)

64

Details

128 LE

41 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

160

Actel

0.012720 oz

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

EX64

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

40

85 °C

EX64-TQG64I

250 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.58

-40 to 85 °C

Tray

EX64

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G64

INDUSTRIAL

-

3000 GATES

1.6 mm

现场可编程门阵列

128

3000

STD

-

1 ns

3000

1.4 mm

10 mm

10 mm

A54SX72A-PQG208A
A54SX72A-PQG208A
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

SMD/SMT

217 MHz

24

Actel

2.75 V

Tray

A54SX72

活跃

Details

171 I/O

2.25 V

- 40 C

+ 125 C

-40°C ~ 125°C (TA)

Tray

A54SX72A

125 °C

-40 °C

2.5 V

1.5 ns

108000

217 MHz

6036

6036

4024

2.75 V

2.25 V

3.4 mm

28 mm

28 mm

APA300-BGG456
APA300-BGG456
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

0 C

+ 70 C

SMD/SMT

180 MHz

微芯片技术

24

Actel

2.7 V

Tray

APA300

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

2.5 V

40

70 °C

APA300-BGG456

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

290 I/O

2.3 V

0°C ~ 70°C (TA)

Tray

APA300

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

245

1.27 mm

compliant

S-PBGA-B456

290

不合格

2.5,2.5/3.3 V

COMMERCIAL

290

300000 GATES

2.54 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.73 mm

35 mm

35 mm

A54SX32A-1PQG208I
A54SX32A-1PQG208I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

174 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

278 MHz

微芯片技术

24

Actel

2.5000 V

2.25 V

2.75 V

2.75 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

40

85 °C

A54SX32A-1PQG208I

278 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.34

Details

-40 to 85 °C

Tray

A54SX32A

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

2.5,3.3/5 V

INDUSTRIAL

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

1

1.1 ns

2880

2880

48000

3.4 mm

28 mm

28 mm

M7A3P1000-FGG256I
M7A3P1000-FGG256I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

SMD/SMT

231 MHz

微芯片技术

90

ProASIC3

0.014110 oz

Tray

M7A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

M7A3P1000-FGG256I

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B256

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.7 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1.575 V

1.425 V

1000000

1.2 mm

17 mm

17 mm

A54SX16A-2PQG208
A54SX16A-2PQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

SMD/SMT

294 MHz

微芯片技术

24

Actel

2.75 V

Tray

A54SX16

活跃

5.25

MICROSEMI CORP

活跃

SQUARE

FQFP

294 MHz

A54SX16A-2PQG208

70 °C

40

2.5 V

QFP208,1.2SQ

PLASTIC/EPOXY

3

FLATPACK, FINE PITCH

FQFP, QFP208,1.2SQ

Details

175 I/O

2.25 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

2.5,3.3/5 V

COMMERCIAL

175

1452 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

1452

1 ns

1452

1452

24000

3.4 mm

28 mm

28 mm

A54SX32-2BGG329I
A54SX32-2BGG329I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

+ 85 C

SMD/SMT

320 MHz

微芯片技术

27

Actel

Tray

A54SX32

活跃

3.6 V

5.24

MICROSEMI CORP

活跃

SQUARE

BGA

320 MHz

A54SX32-2BGG329I

85 °C

40

3.3 V

-40 °C

BGA329,23X23,50

PLASTIC/EPOXY

3

网格排列

BGA, BGA329,23X23,50

Details

249 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

3.3,5 V

INDUSTRIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.7 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

A54SX16P-1TQG176
A54SX16P-1TQG176
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

SMD/SMT

280 MHz

微芯片技术

40

Actel

3.6 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

5.25

MICROSEMI CORP

活跃

SQUARE

LFQFP

280 MHz

A54SX16P-1TQG176

70 °C

40

3.3 V

QFP176,1.0SQ,20

PLASTIC/EPOXY

3

Details

147 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3,3.3/5 V

COMMERCIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.8 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

A42MX09-1PQG160I
A42MX09-1PQG160I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

+ 85 C

SMD/SMT

247 MHz

微芯片技术

24

Actel

0.196363 oz

5.5 V

Tray

A42MX09

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A42MX09-1PQG160I

135 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

101 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

2.1 ns

684

14000

3.4 mm

28 mm

28 mm

A54SX32-BGG329
A54SX32-BGG329
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

BGA-329

YES

329

329-PBGA (31x31)

329

微芯片技术

27

Actel

Tray

A54SX32

活跃

3.6 V

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

3.3 V

40

70 °C

A54SX32-BGG329

240 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

249 I/O

3 V

0 C

+ 70 C

SMD/SMT

240 MHz

0°C ~ 70°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

250

1.27 mm

compliant

240 MHz

S-PBGA-B329

249

不合格

3.3,5 V

COMMERCIAL

900 ps

900 ps

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

0.9 ns

2880

2880

5.25 V

4.75 V

32000

1.8 mm

31 mm

31 mm

AFS250-1FG256
AFS250-1FG256
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

1282.05 MHz

90

Fusion

0.014110 oz

Tray

AFS250

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

AFS250-1FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

3000 LE

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

AFS250

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

OTHER

4.5 kB

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1.28205 GHz

1

6144

6144

1.575 V

1.425 V

250000

1.2 mm

17 mm

17 mm

A54SX72A-1CQ256B
A54SX72A-1CQ256B
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

CQFP-256

YES

256-CQFP (75x75)

256

2.25 V

- 55 C

+ 125 C

SMD/SMT

250 MHz

微芯片技术

1

Actel

Tray

A54SX72

活跃

2.75 V

QFF, TPAK256,3SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK256,3SQ,20

-55 °C

2.5 V

20

125 °C

A54SX72A-1CQ256B

250 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.24

Military grade

This product may require additional documentation to export from the United States.

N

213 I/O

-55°C ~ 125°C (TJ)

A54SX72A

e0

3A001.A.2.C

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F256

213

不合格

2.5,3.3/5 V

MILITARY

213

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

MIL-STD-883 Class B

1.3 ns

6036

6036

108000

36 mm

36 mm

A54SX32A-2PQG208
A54SX32A-2PQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

SMD/SMT

313 MHz

微芯片技术

24

Actel

2.75 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

A54SX32A-2PQG208

313 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

174 I/O

2.25 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

2.5,3.3/5 V

COMMERCIAL

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

3.4 mm

28 mm

28 mm

AX1000-1FGG484I
AX1000-1FGG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

763 MHz

微芯片技术

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

AX1000-1FGG484I

763 MHz

BGA

SQUARE

活跃

5.25

MICROSEMI CORP

This product may require additional documentation to export from the United States.

Details

317 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 85°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

763 MHz

S-PBGA-B484

516

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

12096

1

12096

0.84 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

AFS1500-1FG256I
AFS1500-1FG256I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

90

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

N

119 I/O

-40°C ~ 100°C (TJ)

Tray

AFS1500

85 °C

-40 °C

1.5 V

33.8 kB

276480

1500000

1.28205 GHz

1

38400

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

含铅

A54SX32A-1TQG144M
A54SX32A-1TQG144M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

60

278 MHz

SMD/SMT

+ 125 C

- 55 C

微芯片技术

2.25 V

113 I/O

Details

This product may require additional documentation to export from the United States.

2.75 V

Tray

A54SX32

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-55 °C

2.5 V

40

125 °C

A54SX32A-1TQG144M

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

0.046530 oz

Actel

-55°C ~ 125°C (TC)

Tray

A54SX32A

e3

3A001.A.2.C

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

MILITARY

113

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.4 mm

20 mm

20 mm

A54SX72A-2FGG484I
A54SX72A-2FGG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

484-FPBGA (27X27)

微芯片技术

294 MHz

40

Actel

0.014110 oz

SMD/SMT

+ 85 C

- 40 C

2.25 V

360 I/O

Details

2.75 V

Tray

A54SX72

活跃

-40°C ~ 85°C (TA)

Tray

A54SX72A

2.5 V

108000

6036

1.73 mm

23 mm

23 mm

A54SX32A-1FG256I
A54SX32A-1FG256I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 40 C

+ 85 C

SMD/SMT

278 MHz

微芯片技术

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

30

85 °C

A54SX32A-1FG256I

278 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

203 I/O

2.25 V

-40°C ~ 85°C (TA)

Tray

A54SX32A

TIN LEAD/TIN LEAD SILVER

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5,2.5/5 V

INDUSTRIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

A54SX16A-1TQG100M
A54SX16A-1TQG100M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

81 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

263 MHz

微芯片技术

90

Actel

0.023175 oz

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-55 °C

2.5 V

40

125 °C

A54SX16A-1TQG100M

263 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A54SX16A

e3

3A001.A.2.C

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

172

不合格

2.5,3.3/5 V

MILITARY

172

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

1.4 mm

14 mm

14 mm