品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 内存大小 | 传播延迟 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 等效门数 | 高度 | 长度 | 宽度 | 辐射硬化 | 无铅 | |||||||||||||||||||||||||||||||||||||||
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![]() | MPF300TL-FCG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FCBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 300000 LE | 244 I/O | 970 mV/1.02 V | - 40 C | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | 1.03 V/1.08 V | Tray | MPF300 | 活跃 | -40°C ~ 100°C (TJ) | Tray | MPF300TL | 1.05 V | 12.7 Gb/s | 300000 | 21094400 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200TS-FCG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | YES | 484-FCBGA (23x23) | 484 | 0.97 V | - 40 C | + 100 C | SMD/SMT | 微芯片技术 | 有 | 1 | PolarFire | 0.667354 oz | Tray | MPF200 | 活跃 | 1.08 V | BGA, | 网格排列 | 4 | PLASTIC/EPOXY | -40 °C | 1 V | 未说明 | 100 °C | 有 | MPF200TS-FCG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.82 | This product may require additional documentation to export from the United States. | Details | 192000 LE | 284 I/O | -40°C ~ 100°C (TJ) | Tray | MPF200TS | CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL | 1.05 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B484 | INDUSTRIAL | 12.5 Gb/s | 2.87 mm | 现场可编程门阵列 | 192000 | 13619200 | 4 Transceiver | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500TL-FCG1152I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-1152 | 1152-FCBGA (35x35) | 微芯片技术 | SMD/SMT | 有 | 1 | PolarFire | 1.03 V/1.08 V | 584 | Tray | MPF500 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | -40°C ~ 100°C (TJ) | Tray | MPF500TL | 1.05 V | 481000 | 33792000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500TLS-FCG1152I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-1152 | 1152-FCBGA (35x35) | 微芯片技术 | SMD/SMT | 有 | 1 | PolarFire | 1.03 V/1.08 V | 584 | Tray | MPF500 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | -40°C ~ 100°C (TJ) | Tray | MPF500TLS | 1.05 V | 481000 | 33792000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-1PQG160 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-160 | YES | 160-PQFP (28x28) | 160 | SMD/SMT | 247 MHz | 有 | 微芯片技术 | 24 | Actel | 0.196363 oz | 5.25 V | Tray | A42MX09 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-160 | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX09-1PQG160 | 135 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | Details | 101 I/O | 3 V | 0 C | + 70 C | 0°C ~ 70°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | COMMERCIAL | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | 14000 | 2.1 ns | 684 | 14000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1TQG100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | YES | 100-TQFP (14x14) | 100 | + 70 C | SMD/SMT | 278 MHz | 有 | 微芯片技术 | 90 | Actel | 0.023175 oz | 2.75 V | Tray | A54SX32 | 活跃 | LFQFP, QFP100,.63SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP100,.63SQ,20 | 2.5 V | 40 | 70 °C | 有 | A54SX32A-1TQG100 | 278 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Details | 81 I/O | 2.25 V | 0 C | 0°C ~ 70°C (TA) | Tray | A54SX32A | e3 | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 81 | 不合格 | 2.5,2.5/5 V | COMMERCIAL | 81 | 2880 CLBS, 48000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.4 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||
![]() | EX64-TQG64I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-64 | YES | 64-TQFP (10x10) | 64 | Details | 128 LE | 41 I/O | 2.3 V | - 40 C | + 85 C | SMD/SMT | 250 MHz | 微芯片技术 | 有 | 160 | Actel | 0.012720 oz | 2.5000 V | 2.3 V | 2.7 V | 2.7 V | Tray | EX64 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 40 | 85 °C | 有 | EX64-TQG64I | 250 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.58 | -40 to 85 °C | Tray | EX64 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G64 | INDUSTRIAL | - | 3000 GATES | 1.6 mm | 现场可编程门阵列 | 128 | 3000 | STD | - | 1 ns | 3000 | 1.4 mm | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||
![]() | A54SX72A-PQG208A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | PQFP-208 | 208 | 208-PQFP (28x28) | 微芯片技术 | SMD/SMT | 217 MHz | 有 | 24 | Actel | 2.75 V | Tray | A54SX72 | 活跃 | Details | 171 I/O | 2.25 V | - 40 C | + 125 C | -40°C ~ 125°C (TA) | Tray | A54SX72A | 125 °C | -40 °C | 2.5 V | 1.5 ns | 108000 | 217 MHz | 6036 | 6036 | 4024 | 2.75 V | 2.25 V | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA300-BGG456 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-456 | YES | 456-PBGA (35x35) | 456 | 0 C | + 70 C | SMD/SMT | 180 MHz | 微芯片技术 | 有 | 24 | Actel | 2.7 V | Tray | APA300 | 活跃 | BGA, BGA456,26X26,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA456,26X26,50 | 2.5 V | 40 | 70 °C | 有 | APA300-BGG456 | 180 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.23 | This product may require additional documentation to export from the United States. | Details | 290 I/O | 2.3 V | 0°C ~ 70°C (TA) | Tray | APA300 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.5 V | BOTTOM | BALL | 245 | 1.27 mm | compliant | S-PBGA-B456 | 290 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 290 | 300000 GATES | 2.54 mm | 现场可编程门阵列 | 73728 | 300000 | STD | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1PQG208I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | 174 I/O | 2.25 V | - 40 C | + 85 C | SMD/SMT | 278 MHz | 有 | 微芯片技术 | 24 | Actel | 2.5000 V | 2.25 V | 2.75 V | 2.75 V | Tray | A54SX32 | 活跃 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 2.5 V | 40 | 85 °C | 有 | A54SX32A-1PQG208I | 278 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.34 | Details | -40 to 85 °C | Tray | A54SX32A | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.5 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 174 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 174 | 2880 CLBS, 48000 GATES | 4.1 mm | 现场可编程门阵列 | 48000 | 2880 | 1 | 1.1 ns | 2880 | 2880 | 48000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||
![]() | M7A3P1000-FGG256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | SMD/SMT | 231 MHz | 微芯片技术 | 有 | 90 | ProASIC3 | 0.014110 oz | Tray | M7A3P1000 | 活跃 | 1.575 V | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 85 °C | 有 | M7A3P1000-FGG256I | 350 MHz | BGA | SQUARE | 不推荐 | MICROSEMI CORP | 5.25 | This product may require additional documentation to export from the United States. | Details | 177 I/O | 1.425 V | - 40 C | + 85 C | -40°C ~ 100°C (TJ) | Tray | M7A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B256 | 不合格 | INDUSTRIAL | 18 kB | 24576 CLBS, 1000000 GATES | 1.7 mm | 现场可编程门阵列 | 147456 | 1000000 | 231 MHz | STD | 24576 | 24576 | 1.575 V | 1.425 V | 1000000 | 1.2 mm | 17 mm | 17 mm | 无 | ||||||||||||||||||||||||||
![]() | A54SX16A-2PQG208 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | SMD/SMT | 294 MHz | 有 | 微芯片技术 | 24 | Actel | 2.75 V | Tray | A54SX16 | 活跃 | 5.25 | MICROSEMI CORP | 活跃 | SQUARE | FQFP | 294 MHz | A54SX16A-2PQG208 | 有 | 70 °C | 40 | 2.5 V | QFP208,1.2SQ | PLASTIC/EPOXY | 3 | FLATPACK, FINE PITCH | FQFP, QFP208,1.2SQ | Details | 175 I/O | 2.25 V | 0 C | + 70 C | 0°C ~ 70°C (TA) | Tray | A54SX16A | e3 | Matte Tin (Sn) | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.5 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 175 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 175 | 1452 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 1452 | 1 ns | 1452 | 1452 | 24000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||
![]() | A54SX32-2BGG329I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-329 | YES | 329-PBGA (31x31) | 329 | + 85 C | SMD/SMT | 320 MHz | 有 | 微芯片技术 | 27 | Actel | Tray | A54SX32 | 活跃 | 3.6 V | 5.24 | MICROSEMI CORP | 活跃 | SQUARE | BGA | 320 MHz | A54SX32-2BGG329I | 有 | 85 °C | 40 | 3.3 V | -40 °C | BGA329,23X23,50 | PLASTIC/EPOXY | 3 | 网格排列 | BGA, BGA329,23X23,50 | Details | 249 I/O | 3 V | - 40 C | -40°C ~ 85°C (TA) | Tray | A54SX32 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3.3 V, 5 V | BOTTOM | BALL | 250 | 1.27 mm | compliant | S-PBGA-B329 | 249 | 不合格 | 3.3,5 V | INDUSTRIAL | 249 | 2880 CLBS, 32000 GATES | 2.7 mm | 现场可编程门阵列 | 48000 | 2880 | 0.7 ns | 2880 | 2880 | 32000 | 1.8 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||
![]() | A54SX16P-1TQG176 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | SMD/SMT | 280 MHz | 有 | 微芯片技术 | 40 | Actel | 3.6 V | Tray | A54SX16 | 活跃 | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 5.25 | MICROSEMI CORP | 活跃 | SQUARE | LFQFP | 280 MHz | A54SX16P-1TQG176 | 有 | 70 °C | 40 | 3.3 V | QFP176,1.0SQ,20 | PLASTIC/EPOXY | 3 | Details | 147 I/O | 3 V | 0 C | + 70 C | 0°C ~ 70°C (TA) | Tray | A54SX16P | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 147 | 不合格 | 3.3,3.3/5 V | COMMERCIAL | 147 | 1452 CLBS, 16000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 1452 | 0.8 ns | 1452 | 1452 | 16000 | 1.4 mm | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||
![]() | A42MX09-1PQG160I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-160 | YES | 160-PQFP (28x28) | 160 | + 85 C | SMD/SMT | 247 MHz | 有 | 微芯片技术 | 24 | Actel | 0.196363 oz | 5.5 V | Tray | A42MX09 | 活跃 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX09-1PQG160I | 135 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | Details | 101 I/O | 3 V | - 40 C | -40°C ~ 85°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | INDUSTRIAL | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | 14000 | 2.1 ns | 684 | 14000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-BGG329 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | BGA-329 | YES | 329 | 329-PBGA (31x31) | 329 | 有 | 微芯片技术 | 27 | Actel | Tray | A54SX32 | 活跃 | 3.6 V | BGA, BGA329,23X23,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA329,23X23,50 | 3.3 V | 40 | 70 °C | 有 | A54SX32-BGG329 | 240 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Details | 249 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 240 MHz | 0°C ~ 70°C (TA) | Tray | A54SX32 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3.3 V, 5 V | BOTTOM | BALL | 250 | 1.27 mm | compliant | 240 MHz | S-PBGA-B329 | 249 | 不合格 | 3.3,5 V | COMMERCIAL | 900 ps | 900 ps | 249 | 2880 CLBS, 32000 GATES | 2.7 mm | 现场可编程门阵列 | 2880 | 48000 | 240 MHz | 2880 | 2880 | 1080 | 0.9 ns | 2880 | 2880 | 5.25 V | 4.75 V | 32000 | 1.8 mm | 31 mm | 31 mm | 无 | |||||||||||||||||||||
![]() | AFS250-1FG256 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | 微芯片技术 | 1282.05 MHz | 有 | 90 | Fusion | 0.014110 oz | Tray | AFS250 | 活跃 | 1.575 V | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | AFS250-1FG256 | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | N | 3000 LE | 114 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 0°C ~ 85°C (TJ) | Tray | AFS250 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 不合格 | OTHER | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | 现场可编程门阵列 | 36864 | 250000 | 1.28205 GHz | 1 | 6144 | 6144 | 1.575 V | 1.425 V | 250000 | 1.2 mm | 17 mm | 17 mm | 无 | ||||||||||||||||||||||||||||
![]() | A54SX72A-1CQ256B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-256 | YES | 256-CQFP (75x75) | 256 | 2.25 V | - 55 C | + 125 C | SMD/SMT | 250 MHz | 微芯片技术 | 有 | 1 | Actel | Tray | A54SX72 | 活跃 | 2.75 V | QFF, TPAK256,3SQ,20 | FLATPACK | CERAMIC, METAL-SEALED COFIRED | TPAK256,3SQ,20 | -55 °C | 2.5 V | 20 | 125 °C | 无 | A54SX72A-1CQ256B | 250 MHz | QFF | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Military grade | This product may require additional documentation to export from the United States. | N | 213 I/O | -55°C ~ 125°C (TJ) | A54SX72A | e0 | 3A001.A.2.C | 锡铅 | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.5 V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F256 | 213 | 不合格 | 2.5,3.3/5 V | MILITARY | 213 | 6036 CLBS, 108000 GATES | 3.3 mm | 现场可编程门阵列 | 108000 | 6036 | MIL-STD-883 Class B | 1.3 ns | 6036 | 6036 | 108000 | 36 mm | 36 mm | |||||||||||||||||||||||||||||||||
![]() | A54SX32A-2PQG208 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | SMD/SMT | 313 MHz | 有 | 微芯片技术 | 24 | Actel | 2.75 V | Tray | A54SX32 | 活跃 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 2.5 V | 40 | 70 °C | 有 | A54SX32A-2PQG208 | 313 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | Details | 174 I/O | 2.25 V | 0 C | + 70 C | 0°C ~ 70°C (TA) | Tray | A54SX32A | e3 | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.5 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 174 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 174 | 2880 CLBS, 48000 GATES | 4.1 mm | 现场可编程门阵列 | 48000 | 2880 | 0.9 ns | 2880 | 2880 | 48000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||
![]() | AX1000-1FGG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | SMD/SMT | 763 MHz | 微芯片技术 | 有 | 60 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.5 V | 40 | 85 °C | 有 | AX1000-1FGG484I | 763 MHz | BGA | SQUARE | 活跃 | 5.25 | MICROSEMI CORP | This product may require additional documentation to export from the United States. | Details | 317 I/O | 1.425 V | - 40 C | + 85 C | -40°C ~ 85°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 250 | 1 mm | compliant | 763 MHz | S-PBGA-B484 | 516 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 763 MHz | 18144 | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1.575 V | 1.425 V | 1000000 | 1.73 mm | 23 mm | 23 mm | 无 | |||||||||||||
![]() | AFS1500-1FG256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | 微芯片技术 | 1.425 V | - 40 C | + 85 C | SMD/SMT | 1282.05 MHz | 有 | 90 | Fusion | 0.014110 oz | 1.575 V | Tray | AFS1500 | 活跃 | This product may require additional documentation to export from the United States. | N | 119 I/O | -40°C ~ 100°C (TJ) | Tray | AFS1500 | 85 °C | -40 °C | 1.5 V | 33.8 kB | 276480 | 1500000 | 1.28205 GHz | 1 | 38400 | 1.575 V | 1.425 V | 1.2 mm | 17 mm | 17 mm | 无 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1TQG144M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-144 | YES | 144-TQFP (20x20) | 144 | 60 | 有 | 278 MHz | SMD/SMT | + 125 C | - 55 C | 微芯片技术 | 2.25 V | 113 I/O | Details | This product may require additional documentation to export from the United States. | 2.75 V | Tray | A54SX32 | 活跃 | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | -55 °C | 2.5 V | 40 | 125 °C | 有 | A54SX32A-1TQG144M | 278 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 0.046530 oz | Actel | -55°C ~ 125°C (TC) | Tray | A54SX32A | e3 | 3A001.A.2.C | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | 113 | 不合格 | 2.5,3.3/5 V | MILITARY | 113 | 2880 CLBS, 48000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.4 mm | 20 mm | 20 mm | |||||||||||||||||||||||||||||||
![]() | A54SX72A-2FGG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 484-FPBGA (27X27) | 微芯片技术 | 294 MHz | 有 | 40 | Actel | 0.014110 oz | SMD/SMT | + 85 C | - 40 C | 2.25 V | 360 I/O | Details | 2.75 V | Tray | A54SX72 | 活跃 | -40°C ~ 85°C (TA) | Tray | A54SX72A | 2.5 V | 108000 | 6036 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1FG256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | - 40 C | + 85 C | SMD/SMT | 278 MHz | 有 | 微芯片技术 | 90 | Actel | 0.014110 oz | 2.75 V | Tray | A54SX32 | 活跃 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 2.5 V | 30 | 85 °C | 无 | A54SX32A-1FG256I | 278 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | N | 203 I/O | 2.25 V | -40°C ~ 85°C (TA) | Tray | A54SX32A | TIN LEAD/TIN LEAD SILVER | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.5 V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 203 | 不合格 | 2.5,2.5/5 V | INDUSTRIAL | 203 | 2880 CLBS, 48000 GATES | 1.97 mm | 现场可编程门阵列 | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||
![]() | A54SX16A-1TQG100M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | YES | 100-TQFP (14x14) | 100 | 81 I/O | 2.25 V | - 55 C | + 125 C | SMD/SMT | 263 MHz | 微芯片技术 | 有 | 90 | Actel | 0.023175 oz | 2.75 V | Tray | A54SX16 | 活跃 | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP100,.63SQ,20 | -55 °C | 2.5 V | 40 | 125 °C | 有 | A54SX16A-1TQG100M | 263 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | Details | -55°C ~ 125°C (TC) | Tray | A54SX16A | e3 | 3A001.A.2.C | Matte Tin (Sn) | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 172 | 不合格 | 2.5,3.3/5 V | MILITARY | 172 | 1452 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 1452 | 1.2 ns | 1452 | 1452 | 24000 | 1.4 mm | 14 mm | 14 mm |
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