品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 最高工作温度 | 最小工作温度 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 速度等级 | 收发器数量 | 逻辑单元数 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||
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![]() | M2GL025-1VF256I | Microchip Technology | 数据表 | 2164 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-256 | 256-FPBGA (14x14) | 微芯片技术 | 1.2 V | This product may require additional documentation to export from the United States. | N | 27696 LE | 138 I/O | 1.2 V | - 40 C | + 100 C | SMD/SMT | 有 | 119 | IGLOO2 | Tray | M2GL025 | 活跃 | -40°C ~ 100°C (TJ) | Tray | M2GL025 | 1.14V ~ 2.625V | 1.2 V | 27696 | 1130496 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-1VQG100M | Microchip Technology | 数据表 | 2888 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | VQFP-100 | 100-VQFP (14x14) | 微芯片技术 | A3P250 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 有 | 90 | ProASIC3 | 68 | Tray | -55°C ~ 125°C (TJ) | Tray | A3P250 | 125 °C | -55 °C | 1.425V ~ 1.575V | 4.5 kB | 36864 | 250000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-FGG484 | Microchip Technology | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 有 | 1.14 V | Details | This product may require additional documentation to export from the United States. | 1.26 V | 209 | Tray | M2GL005 | 活跃 | IGLOO2 | 60 | 0°C ~ 85°C (TJ) | Tray | M2GL005S | 1.14V ~ 2.625V | 6060 | 719872 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025T-VF400I | Microchip Technology | 数据表 | 2896 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | SMD/SMT | + 100 C | - 40 C | 微芯片技术 | 1.2 V | 207 I/O | 27696 LE | N | This product may require additional documentation to export from the United States. | 1.2 V | Tray | M2GL025 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 20 | 无 | M2GL025T-VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | IGLOO2 | 90 | 有 | -40°C ~ 100°C (TJ) | Tray | M2GL025T | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 1.2 V | 207 | 1.51 mm | 现场可编程门阵列 | 27696 | 1130496 | 4 Transceiver | 27696 | 17 mm | 17 mm | |||||||||||||||||||||
![]() | M2GL050-1FCS325I | Microchip Technology | 数据表 | 2224 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | 微芯片技术 | Tray | M2GL050 | 活跃 | This product may require additional documentation to export from the United States. | N | 有 | 176 | IGLOO2 | 200 | -40°C ~ 100°C (TJ) | Tray | M2GL050 | 1.14V ~ 2.625V | 56340 | 1869824 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150-1FCS536 | Microchip Technology | 数据表 | 2314 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 微芯片技术 | Tray | M2GL150 | 活跃 | This product may require additional documentation to export from the United States. | N | 有 | 90 | IGLOO2 | 293 | 0°C ~ 85°C (TJ) | Tray | M2GL150 | 1.14V ~ 2.625V | 146124 | 5120000 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090T-FG676I | Microchip Technology | 数据表 | 2643 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | 86184 LE | 425 I/O | 1.2 V | - 40 C | 微芯片技术 | + 100 C | SMD/SMT | 有 | 40 | IGLOO2 | Tray | M2GL090 | 活跃 | 1.2 V | 27 X 27 MM, 1 MM PITCH, FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 20 | 无 | M2GL090T-FG676I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | N | -40°C ~ 100°C (TJ) | Tray | M2GL090T | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | 1.2 V | 425 | 2.44 mm | 现场可编程门阵列 | 86184 | 2648064 | 4 Transceiver | 86316 | 27 mm | 27 mm | ||||||||||||||||||||
![]() | M2GL025TS-1VFG400I | Microchip Technology | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | VFPBGA-400 | 400 | 400-VFBGA (17x17) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 27696 LE | 207 I/O | 1.2 V | - 40 C | + 100 C | SMD/SMT | 有 | 90 | IGLOO2 | 1.2 V | Tray | M2GL025 | 活跃 | -40°C ~ 100°C (TJ) | Tray | M2GL025TS | 100 °C | -40 °C | 1.14V ~ 2.625V | 1.2 V | 138 kB | 27696 | 1130496 | 1 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150TS-FCSG536I | Microchip Technology | 数据表 | 2541 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | 微芯片技术 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 有 | M2GL150TS-FCSG536I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | Details | IGLOO2 | 90 | 有 | 293 | Tray | M2GL150 | -40°C ~ 100°C (TJ) | Tray | M2GL150TS | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | ||||||||||||||||||||||||||||||||||||
![]() | M2GL010-1VFG400 | Microchip Technology | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | VFPBGA-400 | YES | 400 | 400-VFBGA (17x17) | 400 | 195 I/O | 1.2 V | 0 C | 微芯片技术 | + 85 C | SMD/SMT | 有 | IGLOO2 | 90 | 1.2 V | Tray | M2GL010 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 85 °C | 有 | M2GL010-1VFG400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | Details | 12084 LE | 0°C ~ 85°C (TJ) | Tray | M2GL010 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | 1.2 V | OTHER | 114 kB | 195 | 1.51 mm | 现场可编程门阵列 | 12084 | 933888 | 12084 | 17 mm | 17 mm | |||||||||||||||
![]() | M2GL025TS-1FG484 | Microchip Technology | 数据表 | 2717 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | N | 27696 LE | 267 I/O | 1.2 V | 0 C | 微芯片技术 | + 85 C | SMD/SMT | 有 | 60 | IGLOO2 | 1.2 V | Tray | M2GL025 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 85 °C | 无 | M2GL025TS-1FG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | M2GL025TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 1.2 V | OTHER | 267 | 2.44 mm | 现场可编程门阵列 | 27696 | 1130496 | 4 Transceiver | 27696 | 23 mm | 23 mm | ||||||||||||||||||
![]() | M2GL090-1FG676 | Microchip Technology | 数据表 | 2105 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | 86184 LE | 425 I/O | 1.2 V | 0 C | 微芯片技术 | + 85 C | SMD/SMT | 有 | 40 | IGLOO2 | 1.2 V | Tray | M2GL090 | 活跃 | 27 X 27 MM, 1 MM PITCH, FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 20 | 85 °C | 无 | M2GL090-1FG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | N | 0°C ~ 85°C (TJ) | Tray | M2GL090 | 85 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | 1.2 V | OTHER | 323.3 kB | 425 | 2.44 mm | 现场可编程门阵列 | 86316 | 2648064 | 86316 | 27 mm | 27 mm | |||||||||||||||
![]() | M2GL025TS-1VF256 | Microchip Technology | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-256 | 256-FPBGA (14x14) | 微芯片技术 | 活跃 | This product may require additional documentation to export from the United States. | N | 27696 LE | 138 I/O | 1.2 V | 0 C | + 85 C | SMD/SMT | 有 | 119 | IGLOO2 | 1.2 V | Tray | M2GL025 | 0°C ~ 85°C (TJ) | Tray | M2GL025TS | 1.14V ~ 2.625V | 1.2 V | 27696 | 1130496 | 2 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150TS-1FC1152I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 微芯片技术 | M2GL150 | 活跃 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 20 | 1.14 V | 无 | M2GL150TS-1FC1152I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | This product may require additional documentation to export from the United States. | N | 有 | 24 | IGLOO2 | 574 | Tray | -40°C ~ 100°C (TJ) | Tray | M2GL150TS | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 2.9 mm | 现场可编程门阵列 | 146124 | 5120000 | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||
![]() | M2GL025TS-1FCS325 | Microchip Technology | 数据表 | 32 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | 27696 LE | 180 I/O | 1.2 V | 0 C | 微芯片技术 | + 85 C | SMD/SMT | 有 | 176 | IGLOO2 | 1.2 V | Tray | M2GL025 | 活跃 | BGA, BGA325,21X21,20 | 网格排列 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 20 | 85 °C | 无 | M2GL025TS-1FCS325 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.2 | This product may require additional documentation to export from the United States. | N | 0°C ~ 85°C (TJ) | Tray | M2GL025TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 1.2 V | OTHER | 180 | 现场可编程门阵列 | 27696 | 1130496 | 2 Transceiver | 27696 | |||||||||||||||||||||||
![]() | M2GL050-FG896I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 896-BGA | YES | 896-FBGA (31x31) | 896 | 微芯片技术 | Tray | M2GL050 | 活跃 | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.2 V | 20 | 1.14 V | 无 | M2GL050-FG896I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | N | 有 | 27 | IGLOO2 | 377 | -40°C ~ 100°C (TJ) | Tray | M2GL050 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B896 | 377 | 不合格 | 1.2 V | 377 | 2.44 mm | 现场可编程门阵列 | 56340 | 1869824 | 56340 | 31 mm | 31 mm | ||||||||||||||||||||||||||
![]() | M2GL150T-FCG1152 | Microchip Technology | 数据表 | 2328 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 1.2000 V | 微芯片技术 | 574 | Tray | M2GL150 | 活跃 | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | 网格排列 | 4 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 1.14 V | 85 °C | 有 | M2GL150T-FCG1152 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | This product may require additional documentation to export from the United States. | Details | 有 | 24 | IGLOO2 | 0 to 85 °C | Tray | M2GL150T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 146124 | 5120000 | STD | 146124 | 35 mm | 35 mm | |||||||||||||||||||||||
![]() | M2GL060T-VF400 | Microchip Technology | 数据表 | 2665 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-400 | 400-VFBGA (17x17) | 微芯片技术 | 活跃 | IGLOO2 | 90 | 有 | SMD/SMT | + 85 C | 0 C | 1.2 V | 207 I/O | 56520 LE | N | This product may require additional documentation to export from the United States. | 1.2 V | Tray | M2GL060 | 0°C ~ 85°C (TJ) | Tray | M2GL060T | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-1VF256I | Microchip Technology | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | 微芯片技术 | Tray | M2GL005 | 活跃 | LFBGA, | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 20 | 无 | M2GL005S-1VF256I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.28 | This product may require additional documentation to export from the United States. | N | 1.14 V | 有 | 119 | IGLOO2 | 1.26 V | 161 | -40°C ~ 100°C (TJ) | Tray | M2GL005S | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B256 | 1.56 mm | 现场可编程门阵列 | 6060 | 719872 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||
![]() | M2GL150-FCS536 | Microchip Technology | 数据表 | 2867 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | 微芯片技术 | M2GL150 | 活跃 | BGA, | 网格排列 | PLASTIC/EPOXY | 1.2 V | 20 | 1.14 V | 85 °C | 无 | M2GL150-FCS536 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | N | 有 | 90 | IGLOO2 | 293 | Tray | 0°C ~ 85°C (TJ) | Tray | M2GL150 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B536 | OTHER | 现场可编程门阵列 | 146124 | 5120000 | ||||||||||||||||||||||||||||||||||||
![]() | M2GL025TS-1FGG484 | Microchip Technology | 数据表 | 2737 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | Details | 27696 LE | 267 I/O | 1.2 V | 0 C | 微芯片技术 | + 85 C | SMD/SMT | 有 | 60 | IGLOO2 | 1.2 V | Tray | M2GL025 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 85 °C | 有 | M2GL025TS-1FGG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | M2GL025TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 1.2 V | OTHER | 267 | 2.44 mm | 现场可编程门阵列 | 27696 | 1130496 | 4 Transceiver | 27696 | 23 mm | 23 mm | ||||||||||||||||||
![]() | M2GL060TS-1VFG400I | Microchip Technology | 数据表 | 2396 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | 1.2 V | - 40 C | 微芯片技术 | + 100 C | SMD/SMT | 有 | 90 | IGLOO2 | Tray | M2GL060 | 活跃 | 1.2 V | LFBGA, | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.2 V | 有 | M2GL060TS-1VFG400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | This product may require additional documentation to export from the United States. | Details | 56520 LE | 207 I/O | -40°C ~ 100°C (TJ) | Tray | M2GL060TS | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | 30 | S-PBGA-B400 | 1.2 V | 1.51 mm | 现场可编程门阵列 | 56520 | 1869824 | 1 | 4 Transceiver | 17 mm | 17 mm | ||||||||||||||||||||||||||
![]() | M2GL025T-1VF256 | Microchip Technology | 数据表 | 2938 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | 0 C | 1.2 V | 138 I/O | 微芯片技术 | 27696 LE | N | This product may require additional documentation to export from the United States. | 119 | IGLOO2 | 1.2 V | Tray | M2GL025 | 活跃 | 14 X 14 MM, 0.80 MM PITCH, VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 20 | 85 °C | 无 | M2GL025T-1VF256 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | 有 | SMD/SMT | + 85 C | 0°C ~ 85°C (TJ) | Tray | M2GL025T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | OTHER | 1.56 mm | 现场可编程门阵列 | 27696 | 1130496 | 2 Transceiver | 14 mm | 14 mm | ||||||||||||||||||||||||||
![]() | A3P250-1VQ100M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | VQFP-100 | 100 | 100-VQFP (14x14) | 微芯片技术 | Tray | A3P250 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 有 | 90 | ProASIC3 | 8542310000 | 68 | -55°C ~ 125°C (TJ) | Tray | A3P250 | 125 °C | -55 °C | 1.425V ~ 1.575V | 272 MHz | 1.5 V | 1.575 V | 1.425 V | 4.5 kB | 36864 | 250000 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025TS-FGG484I | Microchip Technology | 数据表 | 2907 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | This product may require additional documentation to export from the United States. | Details | 27696 LE | 267 I/O | 1.2 V | - 40 C | 微芯片技术 | + 100 C | SMD/SMT | 有 | 60 | IGLOO2 | 1.2000 V | 1.14 V | 1.26 V | 1.2 V | Tray | M2GL025 | 活跃 | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 有 | M2GL025TS-FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | -40 to 100 °C | Tray | M2GL025TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 1.2 V | 267 | 2.44 mm | 现场可编程门阵列 | 27696 | 1130496 | STD | 4 Transceiver | 27696 | 23 mm | 23 mm |
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