N/A

-

YES

68

有

85 °C

1.425 V

未说明

1.5 V

UNSPECIFIED

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

HVQCCN,

5.31

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

HVQCCN

AGL015V5-QNG68

8542.39.00.01

CMOS

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N68

不合格

OTHER

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

N/A

-

YES

208

30

1.425 V

85 °C

无

AFS600-PQ208I

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.84

QFP-208

FLATPACK

3

PLASTIC/EPOXY

-40 °C

1.5 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

QUAD

FLAT

225

0.5 mm

unknown

R-PQFP-F208

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

600000

30.6 mm

28 mm

N/A

-

YES

100

30

4.75 V

70 °C

无

A1440A-1VQ100C

150 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.88

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

5 V

e0

锡铅

MAX 83 I/OS

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

140

不合格

5 V

COMMERCIAL

140

564 CLBS, 4000 GATES

1.2 mm

现场可编程门阵列

2.6 ns

564

564

4000

14 mm

14 mm

N/A

-

YES

176

278 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.75 V

2.5 V

40

2.25 V

A54SX32A-1TQG176I

有

Obsolete

MICROSEMI CORP

LFQFP, QFP176,1.0SQ,20

5.8

e3

哑光锡

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

2.5,2.5/5 V

INDUSTRIAL

147

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

1.1 ns

2880

2880

48000

24 mm

24 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

5.24

微芯片技术

280 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.6 V

3.3 V

40

81

Tray

A54SX16

活跃

3 V

A54SX16P-1VQG100I

有

活跃

MICROSEMI CORP

TFQFP, TQFP100,.63SQ

-40°C ~ 85°C (TA)

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

3.3,3.3/5 V

INDUSTRIAL

81

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

24000

1452

1

0.8 ns

1452

1452

16000

14 mm

14 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

MICROSEMI CORP

FQFP,

5.28

微芯片技术

108 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

40

3.3, 5 V

3 V

5.5 V

140

Tray

A42MX16

活跃

3 V

A42MX16-1PQG208I

有

活跃

-40 to 85 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

1

2.4 ns

1232

24000

28 mm

28 mm

N/A

-

YES

176

320 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

A54SX16P-2TQ176I

无

Obsolete

MICROSEMI CORP

LFQFP,

5.25

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G176

不合格

INDUSTRIAL

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

0.7 ns

1452

16000

24 mm

24 mm

N/A

-

表面贴装

176-TQFP

YES

176-VQFP (20x20)

176

微芯片技术

MICROSEMI CORP

20 X 20 MM, 1 MM HEIGHT, 0.4 MM PITCH, VQFP-176

5.28

160 MHz

70 °C

PLASTIC/EPOXY

1.575 V

1.5 V

未说明

137

Tray

AGLP060

Obsolete

1.425 V

TFQFP

TQFP176,.87SQ,16

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

AGLP060V2-VQ176

无

Obsolete

0°C ~ 85°C (TJ)

IGLOO PLUS

8542.39.00.01

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.4 mm

unknown

S-PQFP-G176

137

不合格

1.2/1.5 V

COMMERCIAL

137

1584 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1584

18432

60000

1584

1584

60000

20 mm

20 mm

N/A

-

YES

176

3 V

A54SX16P-2TQ176

无

Obsolete

MICROSEMI CORP

LFQFP,

5.25

320 MHz

3.3 V

30

3

70 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G176

不合格

COMMERCIAL

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

0.7 ns

1452

16000

24 mm

24 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

294 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

2.75 V

2.5 V

30

171

Tray

A54SX72A

Obsolete

2.25 V

A54SX72A-2PQ208

无

Obsolete

MICROSEMI CORP

PLASTIC, QFP-208

5.27

0°C ~ 70°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

171

不合格

2.5,3.3/5 V

COMMERCIAL

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

108000

6036

1.1 ns

6036

6036

108000

28 mm

28 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

0.50 MM PITCH, GREEN, VQFP-100

微芯片技术

5.23

350 MHz

3

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

71

Tray

A3P060

活跃

1.425 V

Automotive grade

125 °C

A3P060-VQG100T

有

活跃

MICROSEMI CORP

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e3

Matte Tin (Sn)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G100

71

不合格

1.5/3.3 V

AUTOMOTIVE

71

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

AEC-Q100

STD

1536

1536

60000

14 mm

14 mm

N/A

-

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

68

微芯片技术

100 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.575 V

1.5 V

30

49

Tray

A3P030

活跃

1.425 V

A3P030-1QNG68I

有

活跃

MICROSEMI CORP

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, GREEN, QFN-68

1.37

3

-40°C ~ 100°C (TJ)

ProASIC3

8542.39.00.01

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

30000

768

30000

8 mm

8 mm

N/A

-

YES

208

350 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.2 V

30

1.14 V

A3P1000L-PQ208

无

Obsolete

MICROSEMI CORP

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

5.27

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

COMMERCIAL

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

24576

24576

1000000

28 mm

28 mm

N/A

-

YES

208

A54SX08-PQ208

无

活跃

MICROSEMI CORP

5.84

240 MHz

70 °C

PLASTIC/EPOXY

QFP

QFP208,1.2SQ,20

SQUARE

FLATPACK

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G208

130

不合格

3.3,5 V

COMMERCIAL

130

现场可编程门阵列

768

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

LFQFP

PLASTIC/EPOXY

70 °C

微芯片技术

3

180 MHz

1.59

LFQFP, QFP144,.87SQ,20

MICROSEMI CORP

活跃

有

APA075-TQG144

40

2.5 V

2.7 V

2.5000 V

2.3 V

2.7 V

107

Tray

APA075

活跃

2.3 V

FLATPACK, LOW PROFILE, FINE PITCH

SQUARE

QFP144,.87SQ,20

0 to 70 °C

ProASICPLUS

e3

Matte Tin (Sn)

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

107

不合格

2.5,2.5/3.3 V

COMMERCIAL

107

75000 GATES

1.6 mm

现场可编程门阵列

27648

75000

STD

3072

75000

20 mm

20 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

3

85 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

133

Tray

A3P125

Obsolete

1.425 V

A3P125-1PQ208

无

Obsolete

MICROSEMI CORP

FQFP,

5.26

350 MHz

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

36864

125000

3072

125000

28 mm

28 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

3

85 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.575 V

1.5 V

30

91

Tray

A3P060

Obsolete

1.425 V

A3P060-2TQ144

无

Obsolete

MICROSEMI CORP

LFQFP,

5.25

350 MHz

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

不合格

COMMERCIAL

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

18432

60000

1536

60000

20 mm

20 mm

N/A

-

YES

208

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.2 V

40

1.14 V

M1A3P1000L-1PQG208I

有

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.25

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

INDUSTRIAL

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

5.61

微芯片技术

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

147

Tray

M1A3PE3000

Obsolete

1.425 V

M1A3PE3000-2PQ208I

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

-40°C ~ 100°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

20

84

Tray

Obsolete

1.14 V

M2GL005-TQ144

无

Obsolete

MICROSEMI CORP

20 X 20 MM, 0.50 MM PITCH, TQFP-144

5.57

3

85 °C

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

30

84

Tray

Obsolete

1.14 V

M2S005-TQ144I

无

Obsolete

MICROSEMI CORP

TQFP-144

5.88

3

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

鸥翼

240

0.5 mm

not_compliant

S-PQFP-G144

84

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

84

1.6 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

128KB

20 mm

20 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

350 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

147

Tray

M1A3PE3000

Obsolete

1.425 V

M1A3PE3000-2PQ208

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.61

0°C ~ 85°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm

N/A

-

YES

208

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.2 V

30

1.14 V

M1A3P600L-PQ208I

无

Obsolete

MICROSEMI CORP

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

5.25

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

INDUSTRIAL

154

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

YES

208

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

1.425 V

M7AFS600-1PQ208I

无

Obsolete

MICROSEMI CORP

0.50 MM PITCH, PQFP-208

5.84

3

e0

锡铅

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

不合格

INDUSTRIAL

600000 GATES

4.1 mm

现场可编程门阵列

600000

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

350 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

147

Tray

M1A3PE3000

Obsolete

1.425 V

M1A3PE3000-PQ208

无

Obsolete

MICROSEMI CORP

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

5.61

0°C ~ 85°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm