N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

微芯片技术

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-2PQG100I

117 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

1.56

Details

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

215 MHz

有

66

Actel

0.062040 oz

3.3, 5 V

3 V

5.5 V

Tray

A42MX16

活跃

5.5 V

QFP,

-40 to 85 °C

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

2

2.1 ns

1232

24000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

TQFP-100

100-TQFP (14x14)

微芯片技术

Actel

90

-

Tray

APA075

活跃

2.625 V

Details

-

66 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

0.023175 oz

-40°C ~ 125°C (TJ)

Tray

APA075

2.5 V

27648

75000

STD

1.4 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP

YES

100

100-VQFP (14x14)

100

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.28

Details

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

237 MHz

有

90

Actel

5.5 V

Tray

A42MX16

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-3VQG100I

129 MHz

TFQFP

-40°C ~ 85°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

5.5 V

3 V

24000

1 mm

14 mm

14 mm

无

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

微芯片技术

-55 °C

PLASTIC/EPOXY

3

FLATPACK

ROHS COMPLIANT, PLASTIC, QFP-100

5.29

MICROSEMI CORP

活跃

RECTANGULAR

QFP

92 MHz

This product may require additional documentation to export from the United States.

Details

57 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

160 MHz

有

66

Actel

0.062040 oz

Tray

A40MX02

活跃

5.5 V

A40MX02-1PQG100M

有

125 °C

40

3.3 V

-55°C ~ 125°C (TC)

Tray

A40MX02

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

MILITARY

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

2.3 ns

295

3000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

微芯片技术

A40MX02-3PLG68

109 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0 C

+ 70 C

SMD/SMT

188 MHz

有

19

Actel

0.171777 oz

5.25 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

1.7 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

Production (Last Updated: 1 month ago)

Tin

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

2.25 V

- 40 C

+ 85 C

SMD/SMT

217 MHz

有

24

Actel

2.5000 V

2.25 V

微芯片技术

2.75 V

SX-A

85C

INDUSTRIALC

PQFP

108000

-40C to 85C

171

72000

6036

0.25um

2.75(V)

2.5(V)

无

2.25(V)

-40C

有

4024

4024

表面贴装

5.25 V

Tray

A54SX72

活跃

PLASTIC, QFP-208

FLATPACK, FINE PITCH

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

未说明

85 °C

有

A54SX72A-PQG208I

230.8 MHz

FQFP

SQUARE

Transferred

ACTEL CORP

5.76

3

Details

4024 LE

171 I/O

-40 to 85 °C

Tray

A54SX72A

e3

Matte Tin (Sn)

85 °C

-40 °C

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

未说明

0.5 mm

compliant

217(MHz)

S-PQFP-G208

171

不合格

2.5,3.3/5 V

INDUSTRIAL

1.5 ns

1.5 ns

-

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

6036

108000

217 MHz

6036

6036

STD

-

4024

1.3 ns

6036

6036

2.75 V

2.25 V

108000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

微芯片技术

85 °C

有

A42MX16-1PQG160I

108 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

125 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

198 MHz

有

24

Actel

0.196363 oz

Tray

A42MX16

活跃

5.5 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

-40°C ~ 85°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

40

3.3 V

-40 °C

PLASTIC/EPOXY

3

FLATPACK, FINE PITCH

FQFP,

Actel

24

有

215 MHz

SMD/SMT

+ 85 C

- 40 C

3 V

140 I/O

Details

5.5 V

Tray

A42MX16

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

FQFP

117 MHz

A42MX16-2PQG208I

有

85 °C

-40°C ~ 85°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.1 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

A40MX02-1PLG44

92 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

34 I/O

3 V

0 C

+ 70 C

SMD/SMT

160 MHz

有

27

Actel

0.084185 oz

5.25 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P1000-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

0 to 70 °C

Tray

M1A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-1VQG100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

198 MHz

有

90

Actel

5.5 V

3 V

3.3, 5 V

5.5 V

Tray

A42MX16

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

-40 to 85 °C

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

1

2.4 ns

1232

24000

1 mm

14 mm

14 mm

N/A

-

表面贴装

CQFP-208

208-CQFP (75x75)

微芯片技术

N

171 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

217 MHz

有

1

Actel

2.75 V

Tray

A54SX72

活跃

0°C ~ 70°C (TA)

A54SX72A

2.5 V

108000

6036

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

1.5 V

40

70 °C

有

AX250-2FGG256

870 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

138 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

870 MHz

有

90

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

0°C ~ 70°C (TA)

Tray

AX250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

248

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

248

2816 CLBS, 250000 GATES

1.7 mm

现场可编程门阵列

55296

250000

4224

0.74 ns

2816

4224

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

微芯片技术

85 °C

有

A42MX09-3PQG100I

161 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

296 MHz

有

66

Actel

0.062040 oz

Tray

A42MX09

活跃

5.5 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

1.6 ns

684

14000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

1.2 V

30

100 °C

无

AGL600V2-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

90

IGLOOe

0.014110 oz

1.575 V

Tray

AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

-40°C ~ 85°C (TA)

Tray

AGL600V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

85 °C

有

A3P125-2PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

133 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

24

ProASIC3

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

0°C ~ 85°C (TJ)

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

36864

125000

2

3072

125000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

AGL600V2-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

160

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL600

活跃

0 to 70 °C

Tray

AGL600V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

OTHER

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

A42MX16-FPLG84

56 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.25

Details

608 LE

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

16

Actel

0.239083 oz

5.25 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC84,1.2SQ

3.3 V

40

70 °C

有

0°C ~ 70°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

140

不合格

3.3,3.3/5,5 V

COMMERCIAL

-

140

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

608

24000

103 MHz

608

-

928

4 ns

1232

1232

5.25 V

3 V

24000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

-40 °C

1.5 V

40

85 °C

有

A3PE1500-1FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

40

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

Tray

A3PE1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 to 85 °C

Tray

A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

不合格

INDUSTRIAL

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

M7AFS600-FG256

0°C ~ 70°C (TA)

Tray

M7AFS600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

COMMERCIAL

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

STD

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

3.3 V

40

125 °C

有

A40MX04-1PLG44M

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

34 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

160 MHz

有

27

Actel

0.084185 oz

5.5 V

Tray

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

-55°C ~ 125°C (TC)

Tube

A40MX04

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

MILITARY

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P060-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

N

96 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P060

活跃

1.575 V

LBGA,

-40 to 85 °C

Tray

A3P060

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

1

1536

60000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

微芯片技术

3.3 V

PLASTIC/EPOXY

3

FLATPACK, THIN PROFILE

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

Details

69 I/O

3 V

0 C

+ 70 C

SMD/SMT

83 MHz

有

90

Actel

5.25 V

Tray

A40MX04

活跃

5.24

MICROSEMI CORP

活跃

SQUARE

TQFP

48 MHz

A40MX04-FVQG80

有

70 °C

40

0°C ~ 70°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

COMMERCIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

3.7 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P400-2FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

5000 LE

178 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P400

活跃

BGA,

网格排列

3

-40°C ~ 100°C (TJ)

Tray

A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

-

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

2

-

9216

400000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

微芯片技术

有

A40MX04-FPLG68

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.24

3

CHIP CARRIER

QCCJ,

Details

547 LE

57 I/O

3 V

0 C

+ 70 C

SMD/SMT

83 MHz

有

-

19

Actel

0.171777 oz

5.25 V

Tube

A40MX04

活跃

PLASTIC/EPOXY

3.3 V

40

70 °C

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

3.7 ns

547

6000

3.68 mm

24.23 mm

24.23 mm