N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

Details

620 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.2 V

40

85 °C

有

M1A3PE3000L-FGG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

M1A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-FGG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

160

ProASIC3

97

Tray

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

微芯片技术

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

1.425 V

70 °C

有

M1A3PE3000-1FGG324

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

84

ProASIC3

221

Tray

M1A3PE3000

活跃

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

40

S-PBGA-B324

221

不合格

1.5/3.3 V

COMMERCIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

- 40 C

1.425 V

微芯片技术

71 I/O

N

1.575 V

Tray

A3PN125

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PN125-VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

ProASIC3 nano

90

有

350 MHz

SMD/SMT

+ 85 C

-40°C ~ 100°C (TJ)

Tray

A3PN125

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

微芯片技术

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

有

M1AGL1000V5-CSG281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

IGLOOe

184

有

SMD/SMT

11000 LE

Details

This product may require additional documentation to export from the United States.

215

Tray

M1AGL1000

0°C ~ 70°C (TA)

Tray

M1AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

0.5 mm

compliant

S-PBGA-B281

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

10 mm

10 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-LBGA

YES

256

256-FPBGA (17x17)

256

微芯片技术

PLASTIC/EPOXY

-55 °C

1.5 V

20

1.425 V

100 °C

无

AFS1500-1FG256K

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

Fusion

90

有

N

This product may require additional documentation to export from the United States.

119

Tray

AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

-55°C ~ 100°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

OTHER

33.8 kB

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1.5e+06

1500000

17 mm

17 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

微芯片技术

活跃

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, FBGA-324

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

30

1.425 V

70 °C

无

M1A3PE3000-1FG324

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

ProASIC3

84

有

N

This product may require additional documentation to export from the United States.

221

Tray

M1A3PE3000

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e0

锡铅银

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

COMMERCIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

119

Tray

P1AFS1500

活跃

0°C ~ 85°C (TJ)

Tray

P1AFS1500

1.425V ~ 1.575V

276480

1500000

2

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

Details

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.14 V

1.26 V

1.26 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

70 °C

有

M1A3PE3000L-FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M1A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-55 °C

1.5 V

20

1.425 V

100 °C

无

M1AFS600-1FG256K

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

Fusion

119

Tray

M1AFS600

活跃

-55°C ~ 100°C (TJ)

Tray

M1AFS600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

600000

17 mm

17 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PN250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PN250-1VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

A3PN250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

1.2, 1.5 V

微芯片技术

1.2 V

1.5 V

177

Tray

M1AGL1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.2 V

40

1.14 V

85 °C

有

M1AGL1000V2-FGG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

IGLOOe

90

有

SMD/SMT

11000 LE

Details

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1AGL1000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1e+06

STD

24576

1000000

17 mm

17 mm

无铅

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

Details

3000 LE

143 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

有

348

36864 bit

IGLOOe

0.260886 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL250

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

未说明

85 °C

有

AGL250V5-CSG196

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

AGL250V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

1.5 V

OTHER

20 uA

-

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

8 mm

8 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

M1A3PE3000

微芯片技术

活跃

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.5 V

40

1.425 V

85 °C

有

M1A3PE3000-2FGG324I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

84

ProASIC3

221

Tray

-40°C ~ 100°C (TJ)

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

INDUSTRIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

Tray

M1A3P1000

活跃

1.575 V

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-55 °C

1.5 V

40

125 °C

有

M1A3P1000-FGG144M

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

e1

3A001.A.2.C

锡银铜

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5 V

1.5,1.5/3.3 V

MILITARY

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

1.5 V

1.425 V

85 °C

有

M1AGL600V5-CSG281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

184

IGLOOe

215

Tray

M1AGL600

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

0°C ~ 70°C (TA)

Tray

M1AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

0.5 mm

compliant

30

S-PBGA-B281

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

13824

600000

10 mm

10 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

M1A3P400

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-2PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

ProASIC3

24

有

151

Tray

0°C ~ 85°C (TJ)

Tray

M1A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

M1A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P400-1FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

ProASIC3

90

有

SMD/SMT

N

This product may require additional documentation to export from the United States.

178

Tray

0°C ~ 85°C (TJ)

Tray

M1A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 70 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.575 V

Tray

A3PN250

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN250-2VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

68 I/O

1.425 V

- 20 C

-20°C ~ 85°C (TJ)

Tray

A3PN250

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

CSP

YES

196-CSP (8x8)

196

0 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

348

IGLOOe

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL400

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

未说明

85 °C

无

AGL400V2-CS196

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

143 I/O

1.14 V

0 to 70 °C

Tray

AGL400V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B196

不合格

1.2 V to 1.5 V

OTHER

27 uA

9216 CLBS, 400000 GATES

1.2 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

0.7 mm

8 mm

8 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

70 °C

无

U1AFS1500-FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

Fusion

119

Tray

U1AFS1500

活跃

LBGA,

0°C ~ 85°C (TJ)

Tray

U1AFS1500

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

38400 CLBS, 1500000 GATES

1.68 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

30

有

AFS1500-FGG484K

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.79

This product may require additional documentation to export from the United States.

Details

有

60

Fusion

223

Tray

AFS1500

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55°C ~ 100°C (TJ)

Tray

AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

223

不合格

1.5,3.3 V

33.8 kB

223

现场可编程门阵列

276480

1.5e+06

STD

38400

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

微芯片技术

M1AGL1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1AGL1000V5-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

90

IGLOOe

177

Tray

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

M1A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-1FGG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

160

ProASIC3

97

Tray

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 70 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.575 V

Tray

A3PN250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN250-1VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

68 I/O

1.425 V

- 20 C

-20°C ~ 85°C (TJ)

Tray

A3PN250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm