N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

MICROSEMI CORP

活跃

SQUARE

BGA

350 MHz

A3PE3000-FGG484I

有

85 °C

40

1.5 V

-40 °C

BGA484,22X22,40

PLASTIC/EPOXY

This product may require additional documentation to export from the United States.

Details

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

5.29

-40 to 85 °C

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

231 MHz

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

231 MHz

STD

75264

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

微芯片技术

活跃

ROHS COMPLIANT, PLASTIC, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

未说明

85 °C

有

A40MX02-PLG68I

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

Details

295 LE

57 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

139 MHz

有

-

19

Actel

0.171777 oz

3.3, 5 V

3 V

5.5 V

5.5 V

Tray

A40MX02

-40 to 85 °C

Tube

A40MX02

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

未说明

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

STD

2.7 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

有

AX2000-FGG896M

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

- 55 C

+ 125 C

SMD/SMT

649 MHz

有

27

Actel

0.014110 oz

1.425 V

586 I/O

Details

This product may require additional documentation to export from the United States.

Tray

AX2000

活跃

1.575 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.5 V

40

125 °C

-55°C ~ 125°C (TA)

Tray

AX2000

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

36 kB

990 ps

990 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

649 MHz

32256

MIL-STD-883 Class B

21504

21504

0.99 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

238 MHz

有

-

24

Actel

2.5000 V

2.25 V

2.75 V

Tray

A54SX32

活跃

5.25 V

Details

1800 LE

174 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

900 uA

-

48000

2880

STD

-

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

UCSP

YES

36-UCSP (3x3)

36

微芯片技术

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO

MICROSEMI CORP

5.59

Details

100 LE

23 I/O

1.14 V

- 20 C

+ 70 C

SMD/SMT

250 MHz

有

490

IGLOO nano

Tray

AGLN010

Obsolete

1.575 V

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-20 °C

1.2 V

未说明

70 °C

有

AGLN010V2-UCG36

VFBGA

-20°C ~ 85°C (TJ)

Tray

AGLN010V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.4 mm

compliant

S-PBGA-B36

不合格

1.2 V to 1.5 V

OTHER

3 uA

260 CLBS, 10000 GATES

0.8 mm

现场可编程门阵列

260

10000

STD

260

10000

3 mm

3 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

有

APA450-PQG208

180 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.56

This product may require additional documentation to export from the United States.

Details

-

158 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

-

24

110592 bit

ProASICPLUS

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA450

活跃

0 to 70 °C

Tray

APA450

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

245

0.5 mm

compliant

180 MHz

S-PQFP-G208

158

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

2.7 V

2.3 V

13.5 kB

5 mA

13.5 kB

158

450000 GATES

4.1 mm

现场可编程门阵列

110592

450000

180 MHz

STD

12288

12288

450000

3.4 mm

28 mm

28 mm

无

无铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

无

AX2000-FG896M

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

N

586 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

有

27

Actel

0.014110 oz

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.5 V

30

125 °C

-55°C ~ 125°C (TA)

Tray

AX2000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

36 kB

990 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

649 MHz

32256

MIL-STD-883 Class B

21504

0.99 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

有

M1A3P600-FGG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P600

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

-40°C ~ 100°C (TJ)

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

A3P250-2FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

A3P250

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

0°C ~ 85°C (TJ)

Tray

A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

A42MX16-1PLG84I

108 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

Details

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

198 MHz

有

16

Actel

0.239083 oz

5.5 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

未说明

85 °C

有

-40°C ~ 85°C (TA)

Tube

A42MX16

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

未说明

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

584

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

MPF500T

0.97V ~ 1.08V

1.05 V

481000

33792000

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

160

ProASIC3

0.014110 oz

Tray

M1A3P250

活跃

1.575 V

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P250-2FG144I

-40°C ~ 100°C (TJ)

Tray

M1A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

无

M1A3P600-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

235 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

60

ProASIC3

0.014110 oz

Tray

M1A3P600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

-40°C ~ 100°C (TJ)

Tray

M1A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1.575 V

Tray

A3P400

活跃

This product may require additional documentation to export from the United States.

Details

178 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

-40 to 85 °C

Tray

A3P400

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

6.8 kB

55296

400000

272 MHz

1

9216

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

Lead, Tin

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

8542390000

1.575 V

Tray

A3PE1500

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PE1500-2FG484I

BGA

-40°C ~ 100°C (TJ)

Tray

A3PE1500

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

310 MHz

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

310 MHz

2

38400

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

24 In Stock

-

12 Weeks

Tin

表面贴装

表面贴装

208-BFQFP

208

161

-40°C~85°C TC

Tray

1997

AT40K/KLV

yes

活跃

3 (168 Hours)

208

4.5V~5.5V

QUAD

鸥翼

5V

0.5mm

AT40K10

192

不合格

5V

5V

576B

576B

现场可编程门阵列

576

4608

20000

100MHz

2

576

576

10000

3.65mm

ROHS3 Compliant

N/A

-

表面贴装

CQFP-256

YES

256-CQFP (75x75)

256

微芯片技术

活跃

MICROSEMI CORP

5.24

N

213 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

1

Actel

Tray

A54SX72

活跃

2.75 V

QFF, TPAK256,3SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK256,3SQ,20

2.5 V

未说明

70 °C

无

A54SX72A-1CQ256

250 MHz

QFF

SQUARE

0°C ~ 70°C (TA)

A54SX72A

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

未说明

0.5 mm

unknown

S-CQFP-F256

213

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

213

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

36 mm

36 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

微芯片技术

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

100 °C

有

AGL250V2-CSG196I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

Details

3000 LE

143 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

250 MHz

有

348

IGLOOe

0.300366 oz

1.5000 V

1.14 V

1.575 V

1.575 V

Tray

AGL250

活跃

TFBGA,

-40 to 85 °C

Tray

AGL250V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

1.2 V to 1.5 V

INDUSTRIAL

20 uA

-

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

8 mm

8 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

+ 70 C

0 C

3 V

249 I/O

N

Actel

27

3.3, 5 V

2.97, 4.75 V

3.63, 5.25 V

微芯片技术

SX

70C

Commercial

BGA

48000

0C to 70C

249

32000

2880

0.35um

3.6/5.25(V)

3.3/5(V)

无

3/4.75(V)

0C

有

1800

1080

表面贴装

3.6 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

3.3 V

30

70 °C

无

A54SX32-2BG329

320 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

320 MHz

有

SMD/SMT

0 to 70 °C

Tray

A54SX32

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

320(MHz)

329

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

2

0.7 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

M1A3P1000-2PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

24

ProASIC3

Tray

M1A3P1000

活跃

1.575 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

APA300

活跃

2.625 V

Actel

90

有

180 MHz

SMD/SMT

+ 125 C

- 40 C

2.375 V

186 I/O

N

This product may require additional documentation to export from the United States.

0.014110 oz

Tray

-40°C ~ 125°C (TJ)

Tray

APA300

2.375V ~ 2.625V

2.5 V

73728

300000

STD

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

Tray

APA075

活跃

Details

-

158 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

-

24

Actel

2.625 V

-40°C ~ 125°C (TJ)

Tray

APA075

2.375V ~ 2.625V

2.5 V

27648

75000

STD

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

SMD/SMT

172 MHz

有

90

Actel

0.023175 oz

SX-A

70C

微芯片技术

COMMERCIALC

TQFP

12000

0C to 70C

81

8000

768

0.25um

2.75(V)

2.5(V)

无

2.25(V)

0C

有

512

512

表面贴装

2.75 V

Tray

A54SX08

活跃

LFQFP, TQFP100,.63SQ

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

40

70 °C

有

A54SX08A-FTQG100

172 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.37

Details

81 I/O

2.25 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

172(MHz)

100

S-PQFP-G100

130

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

130

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

1.7 ns

768

768

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

CSP-289

YES

289-CSP (14x14)

289

微芯片技术

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

N

157 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

119

IGLOO PLUS

1.575 V

Tray

AGLP060

Obsolete

TFBGA, BGA289,17X17,32

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA289,17X17,32

-40 °C

1.5 V

未说明

85 °C

无

AGLP060V5-CS289I

250 MHz

-40°C ~ 100°C (TJ)

Tray

AGLP060V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

unknown

S-PBGA-B289

157

不合格

1.5 V

1.5 V

INDUSTRIAL

157

1584 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1584

18432

60000

STD

1584

1584

60000

0.81 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

70 °C

无

A3PE3000L-1FG484

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

60

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

8542320050

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

0 to 70 °C

Tray

A3PE3000L

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

892.86 MHz

1

75264

75264

75264

3000000

1.73 mm

23 mm

23 mm

无