N/A

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

1.14 V

85 °C

有

M2GL050TS-FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

27

IGLOO2

377

Tray

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

6060 LE

209 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

-

60

703 kbit

IGLOO2

1.26 V

Tray

M2GL005

-40°C ~ 100°C (TJ)

Tray

M2GL005

100 °C

-40 °C

1.14V ~ 2.625V

1.2 V

87.9 kB

87.9 kB

6060

719872

1

23 mm

23 mm

N/A

-

表面贴装

FPBGA-896

YES

896-FBGA (31x31)

896

Details

56340 LE

377 I/O

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

-

27

1826 kbit

IGLOO2

1.2 V

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

85 °C

有

M2GL050-FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL050

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

1.2 V

OTHER

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

VFBGA-400

YES

400-VFBGA (17x17)

400

- 40 C

+ 100 C

微芯片技术

SMD/SMT

有

90

IGLOO2

0.034371 oz

1.26 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

有

M2GL010-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.57

Details

12084 LE

195 I/O

1.14 V

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

667 Mb/s

195

1.51 mm

现场可编程门阵列

12084

933888

STD

4 Transceiver

12084

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

TQFP-144

YES

144

- 40 C

+ 100 C

微芯片技术

SMD/SMT

有

60

IGLOO2

0.578352 oz

1.26 V

Tray

M2GL005

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005-TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.54

Details

6060 LE

84 I/O

1.14 V

-40°C ~ 100°C (TJ)

Tray

M2GL005

e3

Matte Tin (Sn)

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

1.2 V

-

1.6 mm

现场可编程门阵列

6060

719872

STD

-

20 mm

20 mm

N/A

-

TQFP-144

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

12084 LE

84 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.26 V

Tray

M2GL010

-40°C ~ 100°C (TJ)

Tray

M2GL010S

1.14V ~ 2.625V

1.2 V

-

12084

933888

-

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

IGLOO2

60

SMD/SMT

+ 125 C

- 55 C

1.2 V

267 I/O

56520 LE

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL060

活跃

-55°C ~ 125°C (TJ)

Tray

M2GL060T

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

TQFP-144

微芯片技术

This product may require additional documentation to export from the United States.

Details

12084 LE

84 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

60

IGLOO2

Tray

M2GL010

活跃

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010S

1.14V ~ 2.625V

1.2 V

12084

933888

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

SMD/SMT

有

60

IGLOO2

1.26 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

56520 LE

267 I/O

1.14 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

1.2 V

667 Mb/s

2.44 mm

现场可编程门阵列

56520

1869824

1

4 Transceiver

23 mm

23 mm

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

Tray

M2GL150

0°C ~ 85°C (TJ)

Tray

M2GL150

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

- 40 C

IGLOO2

119

有

SMD/SMT

+ 100 C

1.2 V

Tray

M2GL025

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL025

1.14V ~ 2.625V

1.2 V

27696

1130496

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090T-FCSG325

活跃

MICROSEMI CORP

5.8

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

0°C ~ 85°C (TJ)

Tray

M2GL090T

8542.39.00.01

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

STD

4 Transceiver

86316

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

+ 85 C

0 C

微芯片技术

1.2 V

387 I/O

56520 LE

Details

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060T-FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

IGLOO2

40

有

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B676

1.2 V

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL010-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

0°C ~ 85°C (TJ)

Tray

M2GL010

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

OTHER

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

12084

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060T

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL010T-VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

138 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL010T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

1.56 mm

现场可编程门阵列

12084

933888

STD

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VFPBGA-400

400

400-VFBGA (17x17)

微芯片技术

27696 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

M2GL025T

85 °C

0 °C

1.14V ~ 2.625V

1.2 V

138 kB

27696

1130496

1

4 Transceiver

N/A

-

表面贴装

400-LFBGA

400-VFBGA (17x17)

微芯片技术

90

IGLOO2

1.26 V

169

Tray

M2GL005

活跃

This product may require additional documentation to export from the United States.

Details

1.14 V

有

-40°C ~ 100°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

6060

719872

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

86184 LE

425 I/O

1.2 V

- 40 C

微芯片技术

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2000 V

1.14 V

1.26 V

1.2 V

Tray

M2GL090

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

有

M2GL090-FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

-40 to 100 °C

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

425

不合格

1.2 V

1.2 V

425

2.44 mm

现场可编程门阵列

86184

2648064

STD

86316

27 mm

27 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060TS-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

OTHER

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

400-LFBGA

400-VFBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

M2GL050

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

60

IGLOO2

Tray

M2GL060

活跃

1.2 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

0°C ~ 85°C (TJ)

Tray

M2GL060

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

1.2 V

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

STD

23 mm

23 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

16 X 16 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-536

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

有

M2GL150T-FCSG536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

293

Tray

M2GL150

活跃

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000