N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

1.2 V

1.14 V

有

M2GL050T-1FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

-40°C ~ 100°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

85 °C

有

M2GL060T-1FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

1.2 V

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

1.14 V

85 °C

无

M2GL050-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

60

IGLOO2

267

Tray

M2GL050

活跃

BGA, BGA484,22X22,40

网格排列

3

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

表面贴装

484-BFBGA

484-BGA

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

0°C ~ 85°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

+ 85 C

SMD/SMT

有

90

IGLOO2

1.26 V

Tray

M2GL005

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL005-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

6060 LE

171 I/O

1.14 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

OTHER

87.9 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

6060

17 mm

17 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060TS-FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

200 I/O

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

1.2 V

OTHER

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

1.14V ~ 2.625V

1.2 V

27696

1130496

2 Transceiver

N/A

-

YES

108

Obsolete

Microsemi Corporation

SQUARE

VBCC

350 MHz

AFS090-2QNG108

有

85 °C

1.425 V

未说明

1.5 V

LGA108,17X17,20

UNSPECIFIED

3

CHIP CARRIER, VERY THIN PROFILE

VBCC, LGA108,17X17,20

5.31

1.575 V

MICROSEMI CORP

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B108

37

不合格

1.5,3.3 V

OTHER

37

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

2304

2304

90000

8 mm

8 mm

N/A

-

YES

180

1.575 V

5.32

VBCC, LGA180,20X20,20

CHIP CARRIER, VERY THIN PROFILE

3

UNSPECIFIED

LGA180,20X20,20

1.5 V

30

1.425 V

85 °C

有

AFS090-QNG180

350 MHz

VBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

260

0.5 mm

compliant

S-XBCC-B180

60

不合格

1.5,3.3 V

OTHER

60

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

2304

2304

90000

10 mm

10 mm

N/A

-

YES

108

CHIP CARRIER, VERY THIN PROFILE

VBCC, LGA108,17X17,20

85 °C

有

AFS090-QNG108

350 MHz

VBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.31

1.425 V

未说明

1.5 V

LGA108,17X17,20

UNSPECIFIED

3

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B108

37

不合格

1.5,3.3 V

OTHER

37

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

2304

2304

90000

8 mm

8 mm

N/A

-

YES

132

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.6

HVBCC, LGA132(UNSPEC)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

LGA132(UNSPEC)

-40 °C

1.2 V

未说明

1.14 V

85 °C

有

AGL060V2-QNG132I

108 MHz

HVBCC

SQUARE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B132

80

不合格

1.2/1.5 V

INDUSTRIAL

80

1536 CLBS, 60000 GATES

0.8 mm

现场可编程门阵列

1536

1536

60000

8 mm

8 mm

N/A

-

YES

132

1.575 V

8.31

HVBCC, LGA132(UNSPEC)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

LGA132(UNSPEC)

1.5 V

未说明

1.425 V

70 °C

有

AGL125V5-QNG132

108 MHz

HVBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B132

84

不合格

1.5 V

COMMERCIAL

84

3072 CLBS, 125000 GATES

0.8 mm

现场可编程门阵列

3072

3072

125000

8 mm

8 mm

N/A

-

YES

132

1.575 V

5.61

HVBCC, LGA132(UNSPEC)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

LGA132(UNSPEC)

1.2 V

未说明

1.14 V

70 °C

有

AGL125V2-QNG132

108 MHz

HVBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B132

84

不合格

1.2/1.5 V

COMMERCIAL

84

3072 CLBS, 125000 GATES

0.8 mm

现场可编程门阵列

3072

3072

125000

8 mm

8 mm

N/A

-

表面贴装

80-TQFP

YES

80-VQFP (14x14)

80

微芯片技术

A40MX02-2VQ80I

101 MHz

TQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.26

QFP

Obsolete

A40MX02

Tray

57

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

0.1 uF

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

80

S-PQFP-G80

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2 ns

295

3000

1.6 mm

1.6 x 0.81 x 0.9

14 mm

14 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

Non-Compliant

293

Tray

M2GL150

活跃

-40°C ~ 100°C (TJ)

IGLOO2

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

Tray

A54SX16

Obsolete

FLATPACK

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

85 °C

无

A54SX16P-PQ208I

230 MHz

QFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.77

Cables

175

-40°C ~ 85°C (TA)

SX

Tinel锁适配器

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G208

175

不合格

3.3,3.3/5 V

INDUSTRIAL

175

现场可编程门阵列

24000

1452

1452

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

A42MX09-2VQ100I

146 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

83

Tray

A42MX09

Obsolete

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

240

0.5 mm

compliant

100

S-PQFP-G100

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

1.8 ns

684

14000

14 mm

14 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

微芯片技术

100 °C

无

AGL250V2-VQ100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

1.2, 1.5 V

1.14 V

1.575 V

有

3000 LE

68 I/O

+ 100 C

1.575 V

0.017672 oz

- 40 C

90

1.14 V

SMD/SMT

Microchip

Microchip Technology / Atmel

526.32 MHz, 892.86 MHz

IGLOOe

N

Tray

AGL250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

-40 to 85 °C

Tray

AGL250V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.2 V to 1.5 V

INDUSTRIAL

-

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

FPGA - Field Programmable Gate Array

36864

250000

STD

-

6144

250000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

N/A

-

表面贴装

68-LCC (J-Lead)

YES

68-PLCC (24.23x24.23)

68

微芯片技术

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A40MX02-FPL68

48 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.18

LCC

40MX

70C

Commercial

PLCC

3000

0C to 70C

57

3000

295

0.45UM

5.25(V)

3.3/5(V)

无

3(V)

0C

有

295

147

表面贴装

57

Tray

A40MX02

Obsolete

0°C ~ 70°C (TA)

Box

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

50/83(MHz)

68

S-PQCC-J68

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

3.7 ns

295

3000

24.2316 mm

24.2316 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

Obsolete

MICROSEMI CORP

1.575 V

5.6

147

Compliant

Tray

A3PE3000

Obsolete

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

70 °C

无

A3PE3000-PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

0°C ~ 85°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

231 MHz

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

63 kB

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3e+06

231 MHz

75264

75264

75264

3000000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

微芯片技术

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

30

3 V

125 °C

无

A40MX02-PL44M

80 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

LCC

SMD

40 MHz

表面贴装

34

Tray

A40MX02

Obsolete

QCCJ,

-10 to 60 °C

MX

e0

3A001.A.2.C

Temperature Compensated Crystal Oscillator (TCXO)

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

4

S-PQCC-J44

不合格

MILITARY

10 pF

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.7 ns

295

3000

削波正弦波

16.5862 mm

16.5862 mm

N/A

-

表面贴装

VQFP-100

100-VQFP (14x14)

微芯片技术

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3 nano

Details

Tray

A3PN250

活跃

20 MHz

CSMD

表面贴装

有

3000 LE

36864 bit

68 I/O

+ 85 C

1.575 V

0.017637 oz

- 20 C

90

1.425 V

SMD/SMT

-40 to 85 °C

Tray

A3PN250

可编程逻辑集成电路

1.425V ~ 1.575V

4

1.425 V to 1.575 V

-

FPGA - Field Programmable Gate Array

36864

250000

STD

-

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

SQUARE

Microsemi Corporation

Obsolete

FPGA - Field Programmable Gate Array ProASIC3

MICROSEMI CORP

1.575 V

5.61

147

Compliant

Tray

A3PE1500

Obsolete

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

70 °C

无

A3PE1500-PQ208

350 MHz

FQFP

0°C ~ 85°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1.5e+06

231 MHz

38400

38400

38400

1500000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

无

A3PN250-VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

±3 ppm/Year

37 MHz

Fundamental

表面贴装

68

Tray

A3PN250

活跃

有

3000 LE

+ 85 C

1.575 V

- 20 C

90

1.425 V

SMD/SMT

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3 nano

N

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

-40 to 85 °C

Tray

ProASIC3 nano

e0

Crystal

Tin/Lead (Sn/Pb)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

30 ppm

4

S-PQFP-G100

不合格

1.425 V to 1.575 V

OTHER

12 pF

±30 ppm

-

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

36864

250000

200 Ohm

STD

-

6144

250000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P250-FGG256I

350 MHz

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array ProASIC3

MICROSEMI CORP

1.3

1.5000 V

1.425 V

1.575 V

157

Tray

A3P250

活跃

MSL 3 - 168 hours

有

3000 LE

36864 bit

+ 100 C

1.575 V

0.032170 oz

- 40 C

90

1.425 V

SMD/SMT

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

BGA,

网格排列

-40 to 85 °C

Tray

ProASIC3

e1

3A001.A.7.B

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

30 mA

-

6144 CLBS, 250000 GATES

1.8 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

36864

250000

STD

-

6144

250000

FPGA - Field Programmable Gate Array

1.2 mm

17 mm

17 mm