品牌是'Microchip' (5152)
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![]() | EX128-TQ64I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | YES | 64-TQFP (10x10) | 64 | 微芯片技术 | Obsolete | MICROSEMI CORP | 2.7 V | 5.32 | 46 | Tray | EX128 | Obsolete | TQFP-64 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 30 | 2.3 V | 85 °C | 无 | EX128-TQ64I | 250 MHz | LFQFP | SQUARE | Microsemi Corporation | -40°C ~ 85°C (TA) | EX | e0 | Tin/Lead (Sn/Pb) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G64 | INDUSTRIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | 1 ns | 6000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA300-PQ208M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | Obsolete | 158 | Tray | APA300 | -55°C ~ 125°C (TC) | ProASICPLUS | 2.3V ~ 2.7V | 73728 | 300000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA450-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | Obsolete | 158 | Tray | APA450 | 0°C ~ 70°C (TA) | ProASICPLUS | 2.3V ~ 2.7V | 110592 | 450000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-1LG624M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 624-BCLGA | 624 | 624-CLGA (32.5x32.5) | 微芯片技术 | Tray | AX1000 | 活跃 | 418 | Non-Compliant | -55°C ~ 125°C (TA) | Axcelerator | 125 °C | -55 °C | 1.425V ~ 1.575V | 20.3 kB | 12096 | 165888 | 1e+06 | 350 MHz | 18144 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-TQ176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 176 | 5.23 | QFP | LFQFP, QFP176,1.0SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX16-TQ176 | 94 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | e0 | 锡铅 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 176 | S-PQFP-G176 | 140 | 不合格 | 3.3,3.3/5,5 V | COMMERCIAL | 140 | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 2.8 ns | 1232 | 1232 | 24000 | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.27 | 171 | Tray | A54SX72A | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | 无 | A54SX72A-2PQ208I | 294 MHz | FQFP | -40°C ~ 85°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G208 | 171 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 171 | 6036 CLBS, 108000 GATES | 4.1 mm | 现场可编程门阵列 | 108000 | 6036 | 1.1 ns | 6036 | 6036 | 108000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.25 | 171 | Tray | A54SX72A | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | 无 | A54SX72A-1PQ208I | 250 MHz | FQFP | -40°C ~ 85°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G208 | 171 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 171 | 6036 CLBS, 108000 GATES | 4.1 mm | 现场可编程门阵列 | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.23 | 174 | Tray | A54SX32A | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | 无 | A54SX32A-1PQ208I | 278 MHz | FQFP | -40°C ~ 85°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G208 | 174 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 174 | 2880 CLBS, 48000 GATES | 4.1 mm | 现场可编程门阵列 | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | Obsolete | 175 | Tray | A54SX16A | -40°C ~ 85°C (TA) | SX-A | 2.25V ~ 5.25V | 24000 | 1452 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | MICROSEMI CORP | 3.6 V | 5.24 | QFP | 176 | Compliant | Tray | A42MX36 | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX36-2PQ208I | 91 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | 5 V | INDUSTRIAL | 170 nH | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | 1184 | 20 | 2560 | 61 A | 54000 | 164 MHz | 1184 | 2 | 1822 | 2.1 ns | 2438 | 54000 | 10.4 | 8 mm | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | 3.6 V | 7.76 | 174 | Compliant | PLASTIC, MO-143, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A54SX32-PQ208I | 240 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | e0 | 3A991.D | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 2 uF | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 240 MHz | S-PQFP-G208 | 不合格 | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 900 ps | 900 ps | 2880 CLBS, 32000 GATES | 4.1 mm | 现场可编程门阵列 | 2880 | 48000 | 240 MHz | 2880 | 1080 | 0.9 ns | 2880 | 2880 | 32000 | 1.6 | 1.6 x 0.8 x 0.63 | 3.4 mm | 28 mm | 28 mm | 无 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 7.88 | QFP | 140 | Tray | A42MX16 | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX16-PQ208I | 94 MHz | FQFP | SQUARE | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | INDUSTRIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.8 ns | 1232 | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-PQ160I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | 微芯片技术 | Transferred | ACTEL CORP | 3.6 V | 5.84 | 125 | Compliant | Tray | A42MX24 | Obsolete | PLASTIC, QFP-160 | FLATPACK | 3 | PLASTIC/EPOXY | QFP160,1.2SQ | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX24-PQ160I | 91.8 MHz | QFP | SQUARE | Actel Corporation | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATE AT 5.0V SUPPLY | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 125 | 不合格 | 5 V | 3.3,3.3/5,5 V | INDUSTRIAL | 5.5 V | 3 V | 125 | 912 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 2.5 ns | 912 | 1866 | 36000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN250V2-VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 活跃 | 有 | 3000 LE | + 100 C | 1.575 V | 0.018201 oz | 微芯片技术 | - 40 C | 90 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 250 MHz | IGLOO nano | N | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.2 V | 30 | 85 °C | 无 | AGLN250V2-VQ100I | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.6 | 1.2, 1.5 V | 1.14 V | 1.575 V | 68 | Tray | AGLN250 | -40 to 85 °C | Tray | IGLOO nano | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | 1.2 V to 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN250V2-VQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 0.356867 oz | - 20 C | 90 | 1.14 V | 微芯片技术 | SMD/SMT | Microchip | Microchip Technology / Atmel | 250 MHz | IGLOO nano | N | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -20 °C | 1.2 V | 30 | 70 °C | 无 | AGLN250V2-VQ100 | TFQFP | SQUARE | 活跃 | IC FPGA 68 I/O 100VQFP | MICROSEMI CORP | 5.59 | 68 | Tray | AGLN250 | 活跃 | 有 | 3000 LE | + 85 C | 1.575 V | -20°C ~ 85°C (TJ) | Tray | IGLOO nano | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | 1.2 V to 1.5 V | OTHER | - | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16P-VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 81 | Tray | A54SX16 | Obsolete | QFP, TQFP100,.63SQ | FLATPACK | PLASTIC/EPOXY | TQFP100,.63SQ | -40 °C | 85 °C | 无 | A54SX16P-VQ100I | 230 MHz | QFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.88 | -40°C ~ 85°C (TA) | SX | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G100 | 81 | 不合格 | 3.3,3.3/5 V | INDUSTRIAL | 81 | 现场可编程门阵列 | 24000 | 1452 | 1452 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-2FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | This product may require additional documentation to export from the United States. | 3000 LE | + 100 C | 1.575 V | 0.014110 oz | - 40 C | 微芯片技术 | 90 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 310 MHz | ProASIC3 | N | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | A3P250-2FG256I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 1.5000 V | 157 | Tray | A3P250 | 活跃 | 有 | -40 to 85 °C | Tray | ProASIC3 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.8 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 250000 | 2 | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5962-0054301QYC | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 208-CQFP (75x75) | 微芯片技术 | Tray | 5962-0054301 | 活跃 | 171 | Non-Compliant | -55°C ~ 125°C (TJ) | SX-A | 125 °C | -55 °C | 2.25V ~ 5.25V | 217 MHz | 2.5 V | 2.75 V | 2.25 V | 1.5 ns | 1.5 ns | 4024 | 108000 | 217 MHz | 6036 | 6036 | 4024 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-FGG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | Tray | A3P250 | 活跃 | 有 | 3000 LE | 36864 bit | + 85 C | 1.575 V | 微芯片技术 | 0.013369 oz | 0 C | 160 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P250-FGG144 | 1.32 | MICROSEMI CORP | FPGA - Field Programmable Gate Array A3P250-FGG144 LEAD FREE | 活跃 | SQUARE | LBGA | 350 MHz | 1.575 V | 1.425 V | 1.5000 V | 97 | 0 to 70 °C | Tray | ProASIC3 | e1 | 100 ppm/K | 470 Ohm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 可编程逻辑集成电路 | 0.25 W | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | 通用型 | compliant | S-PBGA-B144 | 不合格 | 1.5 V | COMMERCIAL | 3 mA | - | 6144 CLBS, 250000 GATES | 1.55 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 1 | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-FGG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | 36864 bit | 157 I/O | + 85 C | 1.575 V | 0.031747 oz | 0 C | 90 | 微芯片技术 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | Tray | A3P250 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P250-FGG256 | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.32 | 1.5000 V | 1.425 V | 1.575 V | 有 | 3000 LE | 0 to 70 °C | Tray | A3P250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | COMMERCIAL | 10 uH | 3 mA | - | 6144 CLBS, 250000 GATES | 1.8 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 20 | 36864 | 16 A | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 17.15 | 17.15 mm | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P125-TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | Obsolete | 100 | Tray | A3P125 | -65 to 200 °C | ProASIC3 | 1.425V ~ 1.575V | 36864 | 125000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 0.014110 oz | - 40 C | 90 | 1.425 V | 微芯片技术 | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | N | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | A3P250-FG256I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.47 | 157 | Tray | A3P250 | 活跃 | 有 | 3000 LE | + 100 C | 1.575 V | -40°C ~ 100°C (TJ) | Tray | ProASIC3 | e0 | 3A001.A.7.B | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.8 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-2FG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | 97 I/O | + 100 C | 1.575 V | 0.014110 oz | - 40 C | 160 | 1.425 V | 微芯片技术 | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | N | Tray | A3P250 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 1.5 | MICROSEMI CORP | 活跃 | SQUARE | LBGA | 350 MHz | A3P250-2FG144I | 无 | 100 °C | 30 | 1.5 V | -40 °C | PLASTIC/EPOXY | 3 | 1.5000 V | 1.425 V | 1.575 V | 有 | 3000 LE | -40 to 85 °C | Tray | A3P250 | e0 | 300.0000 ppm/°C | 470 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 可编程逻辑集成电路 | 1.0000 W | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 240 | 1 mm | Power | compliant | S-PBGA-B144 | 不合格 | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.55 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 250000 | 2 | - | 5 | 6144 | 250000 | FPGA - Field Programmable Gate Array | 6.8 mm | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025-1FGG484T1 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Tin | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 20 to 18, 20 AWG | Brass | 表面贴装 | 267 | Tray | M2GL025 | 活跃 | Straight | Crimp | -40 to 85 °C | Automotive, AEC-Q100, IGLOO2 | 连接插座 | Pin | Power/Signal | 1.14V ~ 2.625V | 27696 | 无 | 1130496 | 16.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050TS-1FG484M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 活跃 | 267 | Tray | M2GL050 | -55°C ~ 125°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 56340 | 1869824 |
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