45 In Stock

• 1: ¥648.460553
• 10: ¥611.755241
• 100: ¥577.127587
• 500: ¥544.459980
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

177 I/O

0°C ~ 85°C (TJ)

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

2494 In Stock

• 1: ¥1,794.300099
• 10: ¥1,692.735940
• 100: ¥1,596.920702
• 500: ¥1,506.528962
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

Tray

M1AGL1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1AGL1000V5-FGG484I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

SMD/SMT

有

60

IGLOOe

300

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

23 mm

23 mm

45 In Stock

• 1: ¥169.002283
• 10: ¥159.436114
• 100: ¥150.411424
• 500: ¥141.897571
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

M1A3P250

活跃

1.575 V

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P250-2VQG100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

68 I/O

-40 to 85 °C

Tray

M1A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

2755 In Stock

• 1: ¥1,209.331983
• 10: ¥1,140.879228
• 100: ¥1,076.301159
• 500: ¥1,015.378454
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

有

90

Fusion

114

Tray

U1AFS600

0°C ~ 85°C (TJ)

Tray

U1AFS600

1.425V ~ 1.575V

36864

250000

STD

2524 In Stock

• 1: ¥2,250.933334
• 10: ¥2,123.522013
• 100: ¥2,003.322652
• 500: ¥1,889.927032
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

Details

119 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

M1AFS1500

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.47059 GHz

2

38400

1.2 mm

17 mm

17 mm

无

3504 In Stock

• 1: ¥77.203106
• 10: ¥72.833113
• 100: ¥68.710486
• 500: ¥64.821210
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

90

有

350 MHz

微芯片技术

SMD/SMT

+ 70 C

1.575 V

Tray

A3PN060

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN060-VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 20 C

ProASIC3 nano

-20°C ~ 85°C (TJ)

Tray

A3PN060

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

STD

1536

60000

1 mm

14 mm

14 mm

66 In Stock

• 1: ¥126.286545
• 10: ¥119.138251
• 100: ¥112.394578
• 500: ¥106.032615
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

有

90

IGLOO nano

1.575 V

Tray

AGLN060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AGLN060V5-VQ100I

TFQFP

SQUARE

活跃

FPGA - Field Programmable Gate Array AGLN060V5-VQ100I

MICROSEMI CORP

5.59

N

700 LE

71 I/O

-40°C ~ 100°C (TJ)

Tray

AGLN060V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

10 uA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1536

18432

60000

STD

1536

60000

1 mm

14 mm

14 mm

2522 In Stock

• 1: ¥2,778.192892
• 10: ¥2,620.936691
• 100: ¥2,472.581783
• 500: ¥2,332.624326
查看所有的价格

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

20

无

AFS600-FG484K

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.83

This product may require additional documentation to export from the United States.

N

7000 LE

有

60

Fusion

172

Tray

AFS600

活跃

-55°C ~ 100°C (TJ)

Tray

AFS600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

172

不合格

1.5,3.3 V

172

现场可编程门阵列

110592

600000

13824

2710 In Stock

• 1: ¥1,317.136806
• 10: ¥1,242.581891
• 100: ¥1,172.247067
• 500: ¥1,105.893464
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

177 I/O

1.14 V

0 C

0.014110 oz

ProASIC3

90

微芯片技术

有

892.86 MHz

SMD/SMT

+ 70 C

1.26 V

Tray

M1A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

40

70 °C

有

M1A3P1000L-1FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

M1A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

8 mA

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.2 mm

17 mm

17 mm

862 In Stock

• 1: ¥7,615.927298
• 10: ¥7,184.837077
• 100: ¥6,778.148186
• 500: ¥6,394.479419
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

60

Fusion

0.014110 oz

Tray

M1AFS1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS1500-2FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

2514 In Stock

• 1: ¥1,217.305082
• 10: ¥1,148.401018
• 100: ¥1,083.397187
• 500: ¥1,022.072825
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

Details

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.2000 V

Tray

M1A3P600

活跃

1.26 V

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

85 °C

有

M1A3P600L-FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

-40 to 85 °C

Tray

M1A3P600L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

2246 In Stock

• 1: ¥3,800.979193
• 10: ¥3,585.829431
• 100: ¥3,382.857954
• 500: ¥3,191.375426
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

1.425 V

119 I/O

Details

1.575 V

Tray

M1AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS1500-2FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

0.014110 oz

Fusion

90

有

1470.59 MHz

SMD/SMT

+ 85 C

- 40 C

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

1500000

1.2 mm

17 mm

17 mm

无

2362 In Stock

• 1: ¥1,805.685864
• 10: ¥1,703.477229
• 100: ¥1,607.053993
• 500: ¥1,516.088669
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

Tray

M1AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1AGL1000V5-FG484I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

60

IGLOOe

300

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

23 mm

23 mm

2730 In Stock

• 1: ¥1,182.419886
• 10: ¥1,115.490461
• 100: ¥1,052.349490
• 500: ¥992.782540
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

Details

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3P600

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

85 °C

有

M1A3P600L-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

-40 to 85 °C

Tray

M1A3P600L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

5 mA

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

13824

600000

1.05 mm

13 mm

13 mm

663 In Stock

• 1: ¥13,422.534004
• 10: ¥12,981.174083
• 25: ¥12,890.937519
• 50: ¥12,801.328225
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

1.14 V

微芯片技术

341 I/O

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

125 °C

无

A3PE3000L-FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

0.014110 oz

ProASIC3

60

有

SMD/SMT

+ 125 C

- 55 C

-55°C ~ 125°C (TJ)

Tray

A3PE3000L

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

1.575 V

1.14 V

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

75264

3000000

23 mm

23 mm

无

658 In Stock

• 1: ¥8,573.748415
• 10: ¥8,088.441902
• 100: ¥7,630.605566
• 500: ¥7,198.684494
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

30

85 °C

无

M1A3PE3000L-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000L

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

37 In Stock

• 1: ¥142.098353
• 10: ¥134.055055
• 100: ¥126.467031
• 500: ¥119.308521
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PN125-2VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

A3PN125

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

2

3072

125000

1 mm

14 mm

14 mm

45 In Stock

• 1: ¥144.224005
• 10: ¥136.060378
• 100: ¥128.358850
• 500: ¥121.093253
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

- 20 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

90

IGLOO nano

Tray

AGLN125

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

AGLN125V5-VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

N

1500 LE

71 I/O

1.425 V

-20°C ~ 85°C (TJ)

Tray

AGLN125V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.5 V

OTHER

18 uA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

2548 In Stock

• 1: ¥1,405.068738
• 10: ¥1,325.536542
• 100: ¥1,250.506176
• 500: ¥1,179.722810
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

SMD/SMT

250 MHz

微芯片技术

有

90

IGLOOe

Tray

M1AGL1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1AGL1000V5-FGG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

M1AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

127 uA

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

24576

1000000

17 mm

17 mm

45 In Stock

• 1: ¥130.685261
• 10: ¥123.287984
• 100: ¥116.309416
• 500: ¥109.725862
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PN125-1VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

A3PN125

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

1

3072

125000

1 mm

14 mm

14 mm

2520 In Stock

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

+ 125 C

SMD/SMT

350 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

Tray

A3PE3000

活跃

1.575 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.2 V

40

125 °C

有

A3PE3000L-1FGG896M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

620 I/O

1.14 V

- 55 C

-55°C ~ 125°C (TJ)

Tray

A3PE3000L

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

1.575 V

1.14 V

25 mA

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

350 MHz

1

75264

75264

75264

3000000

31 mm

31 mm

无

2024 In Stock

• 1: ¥1,565.798377
• 10: ¥1,477.168282
• 100: ¥1,393.554984
• 500: ¥1,314.674508
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

11000 LE

N

微芯片技术

This product may require additional documentation to export from the United States.

60

IGLOOe

Tray

M1AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1AGL1000V5-FG484

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

有

250 MHz

SMD/SMT

+ 70 C

0 C

300 I/O

0°C ~ 70°C (TA)

Tray

M1AGL1000V5

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

OTHER

127 uA

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

24576

1000000

23 mm

23 mm

28 In Stock

• 1: ¥78.826735
• 10: ¥74.364845
• 100: ¥70.155513
• 500: ¥66.184444
查看所有的价格

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

SMD/SMT

310 MHz

有

微芯片技术

260

ProASIC3

1.575 V

Tray

A3P030

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

1.5 V

30

85 °C

有

A3P030-2QNG68

350 MHz

HVQCCN

SQUARE

活跃

MICROSEMI CORP

5.24

Details

49 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

A3P030

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

1.5 V

COMMERCIAL

2 mA

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

30000

2

768

30000

0.88 mm

8 mm

8 mm

2907 In Stock

• 1: ¥1,436.104353
• 10: ¥1,354.815429
• 100: ¥1,278.127762
• 500: ¥1,205.780906
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

微芯片技术

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M1AGL1000V2-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

184

IGLOOe

215

Tray

M1AGL1000

0°C ~ 70°C (TA)

Tray

M1AGL1000V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

10 mm

10 mm

37 In Stock

• 1: ¥763.538989
• 10: ¥720.319801
• 100: ¥679.546983
• 500: ¥641.082059
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

160

有

892.86 MHz

SMD/SMT

+ 70 C

微芯片技术

0 C

1.14 V

97 I/O

N

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

A3P600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

A3P600L-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0.014110 oz

ProASIC3

0 to 70 °C

Tray

A3P600L

e0

锡铅银

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

1.26 V

1.14 V

5 mA

13.5 kB

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

892.86 MHz

1

13824

13824

13824

600000

1.05 mm

13 mm

13 mm

无