N/A

-

YES

100

PLASTIC/EPOXY

2.5 V

30

2.3 V

70 °C

无

EX64-FTQ100

178 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.7 V

5.86

TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G100

COMMERCIAL

3000 GATES

1.6 mm

现场可编程门阵列

1.4 ns

3000

14 mm

14 mm

N/A

-

YES

100

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.88

30

-40 °C

PLASTIC/EPOXY

3

FLATPACK, LOW PROFILE, FINE PITCH

TQFP-100

125 °C

无

EX64-TQ100A

250 MHz

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G100

AUTOMOTIVE

3000 GATES

1.6 mm

现场可编程门阵列

1 ns

3000

14 mm

14 mm

N/A

-

YES

100

PLASTIC/EPOXY

2.5 V

30

2.3 V

70 °C

无

EX64-PTQ100

357 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.7 V

5.9

TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G100

COMMERCIAL

3000 GATES

1.6 mm

现场可编程门阵列

0.7 ns

3000

14 mm

14 mm

N/A

-

表面贴装

144

97

Non-Compliant

70 °C

0 °C

4.5 kB

3072

125000

N/A

-

Non-Compliant

N/A

-

表面贴装

784-FBGA

784-VFBGA (23x23)

微芯片技术

395

Tray

活跃

56500 LE

+ 85 C

0 C

SMD/SMT

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 1.26V

56520

1869824

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

Obsolete

158

Tray

APA300

-40°C ~ 125°C (TJ)

ProASICPLUS

2.375V ~ 2.625V

73728

300000

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

208-BFCQFP with Tie Bar

YES

208-CQFP (75x75)

208

活跃

GQFF, TPAK208,2.9SQ,20

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

微芯片技术

TPAK208,2.9SQ,20

-55 °C

1.5 V

20

1.425 V

125 °C

无

AX250-CQ208M

649 MHz

GQFF

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.29

Military grade

115

Tray

AX250

-55°C ~ 125°C (TA)

Axcelerator

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

248

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

248

2816 CLBS, 250000 GATES

3.3 mm

现场可编程门阵列

55296

250000

4224

MIL-STD-883 Class B

0.99 ns

2816

4224

250000

29.21 mm

29.21 mm

N/A

-

表面贴装

1657-BCLGA

1657-CLGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

Obsolete

QFP,

FLATPACK

3

微芯片技术

PLASTIC/EPOXY

-40 °C

5 V

30

4.75 V

125 °C

无

A42MX16-PQ100A

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.53

83

Tray

A42MX16

-40°C ~ 125°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

AUTOMOTIVE

24000 GATES

3.4 mm

现场可编程门阵列

24000

2.4 ns

24000

20 mm

14 mm

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

微芯片技术

PLASTIC/EPOXY

1.2 V

40

1.14 V

85 °C

有

AGL125V2-FGG144

108 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

97

Tray

AGL125

0°C ~ 70°C (TA)

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

OTHER

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

13 mm

13 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Obsolete

QFP-208

FLATPACK, FINE PITCH

3

微芯片技术

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

1.5 V

30

1.425 V

125 °C

无

A3P1000-PQ208M

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.24

154

Tray

A3P1000

-55°C ~ 125°C (TJ)

ProASIC3

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5,1.5/3.3 V

MILITARY

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

微芯片技术

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P250-2PQ208I

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

151

Tray

M1A3P250

-40°C ~ 100°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

36864

250000

6144

250000

28 mm

28 mm

N/A

-

4 Days

YES

256

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK256,3SQ,20

SQUARE

FLATPACK

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-256

125 °C

-55 °C

e0

9A515.E

锡铅

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F256

136

不合格

MILITARY

136

21504 CLBS, 2000000 GATES

3.3 mm

现场可编程门阵列

MIL-STD-883 Class B

1.1 ns

21504

32256

2000000

36 mm

36 mm

N/A

-

1.5 V

1.425 V

1.575 V

-55 °C

125 °C

MICROCHIP TECHNOLOGY INC

活跃

无

3A001.A.2.C

8542.39.00.01

1.27 mm

compliant

248

248

2816 CLBS, 250000 GATES

现场可编程门阵列

MIL-STD-883 Class S (Modified)

1.1 ns

250000

32.5 mm

32.5 mm

N/A

-

gold-plated

YES

94

208

2x47

2.54mm

THT

8.93 g

female

TPAK208,2.9SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, GUARD RING

2.75 V

2.25 V

2.5 V

socket

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-208

310 MHz

2.54mm

straight

125 °C

-55 °C

pin strips

CERAMIC, METAL-SEALED COFIRED

HGQFF

-40...163°C

e0

3A001.A.2.C

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

1.5A

20

S-CQFP-F208

360

不合格

MILITARY

360

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

MIL-STD-883 Class B

1.2 ns

6036

6036

60V

108000

beryllium copper

100k Rad(Si) V

29.21 mm

29.21 mm

0.75µm

UL94V-0

N/A

-

gold-plated

YES

1

208

1x1

2.54mm

THT

0.05 g

female

TPAK208,2.9SQ,20

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

socket

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-208

310 MHz

straight

125 °C

-55 °C

pin strips

CERAMIC, METAL-SEALED COFIRED

GQFF

-40...163°C

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

未说明

0.5 mm

compliant

3A

未说明

S-CQFP-F208

227

不合格

MILITARY

227

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535

1.4 ns

2880

2880

150V

48000

beryllium copper

29.21 mm

29.21 mm

0.75µm

UL94V-0

N/A

-

gold-plated

YES

8

208

2x4

2.54mm

THT

0.76 g

female

无

活跃

MICROCHIP TECHNOLOGY INC

238 MHz

125 °C

-55 °C

CERAMIC

GQFF

2.54mm

straight

TPAK208,2.9SQ,20

SQUARE

FLATPACK, GUARD RING

pin strips

socket

-40...163°C

3A001.A.2.C

8542.39.00.01

QUAD

FLAT

0.5 mm

unknown

1.5A

S-XQFP-F208

173

不合格

MILITARY

173

现场可编程门阵列

38535V;38534K;883S

2880

60V

beryllium copper

0.75µm

UL94V-0

N/A

-

YES

84

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK84,1.63SQ,25

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-84

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

未说明

0.635 mm

compliant

未说明

S-CQFP-F84

62

不合格

MILITARY

62

2880 CLBS, 48000 GATES

2.4 mm

现场可编程门阵列

MIL-PRF-38535 Class V

1.2 ns

2880

2880

48000

100k Rad(Si) V

16.51 mm

16.51 mm

N/A

-

YES

352

-55 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK352,2.9SQ,20

SQUARE

FLATPACK

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-352

125 °C

e0

3A001.A.2.C

锡铅

125000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F352

198

不合格

MILITARY

198

12096 CLBS, 1000000 GATES

2.89 mm

现场可编程门阵列

MIL-STD-883 Class B

1.1 ns

12096

18144

1000000

48 mm

48 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

AX250

活跃

1.5000 V

248

Tray

-40 to 85 °C

Axcelerator

1.425V ~ 1.575V

55296

250000

4224

STD

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

A3P060

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

微芯片技术

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.5 V

20

1.425 V

125 °C

无

A3P060-FG144T

350 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.23

Automotive grade

96

Tray

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

1 mm

compliant

S-PBGA-B144

96

不合格

1.5/3.3 V

AUTOMOTIVE

96

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

AEC-Q100

STD

1536

1536

60000

13 mm

13 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

活跃

QFP, TQFP100,.63SQ

FLATPACK

3

微芯片技术

PLASTIC/EPOXY

TQFP100,.63SQ

-55 °C

125 °C

有

A54SX16P-1VQG100M

241 MHz

QFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.82

81

Tray

A54SX16

-55°C ~ 125°C (TC)

SX

3A001.A.2.C

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G100

81

不合格

3.3,3.3/5 V

MILITARY

81

现场可编程门阵列

24000

1452

1452

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

微芯片技术

Obsolete

113

Tray

A54SX16A

-40°C ~ 125°C (TA)

SX-A

2.25V ~ 5.25V

24000

1452