N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

Details

69 I/O

3 V

0 C

+ 70 C

SMD/SMT

139 MHz

有

微芯片技术

90

Actel

3.3, 5 V

3 V

5.25 V

5.25 V

Tray

A40MX04

活跃

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

未说明

70 °C

有

A40MX04-VQG80

80 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

1.52

0 to 70 °C

Tray

A40MX04

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

未说明

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

STD

2.7 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

QFN-48

YES

48-QFN (6x6)

48

Details

34 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

429

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

HQCCN,

CHIP CARRIER, HEAT SINK/SLUG

3

UNSPECIFIED

-40 °C

1.5 V

30

100 °C

有

A3P030-2QNG48I

HQCCN

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

A3P030

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

1.5 V

INDUSTRIAL

2 mA

768 CLBS, 30000 GATES

现场可编程门阵列

30000

2

768

30000

0.88 mm

6 mm

6 mm

N/A

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

有

微芯片技术

260

ProASIC3 nano

1.575 V

Tray

A3PN015

活跃

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

LCC68,.32SQ,16

-40 °C

1.5 V

30

85 °C

有

A3PN015-2QNG68I

HVQCCN

SQUARE

活跃

MICROSEMI CORP

5.26

Details

49 I/O

-40°C ~ 100°C (TJ)

Tray

A3PN015

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

49

不合格

1.5 V

1.5,1.5/3.3 V

INDUSTRIAL

1 mA

49

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

15000

2

384

384

15000

0.88 mm

8 mm

8 mm

N/A

-

表面贴装

VTQFP

YES

128-VTQFP (14x14)

128

1.14 V

0 C

+ 70 C

90

IGLOO PLUS

有

微芯片技术

892.86 MHz

SMD/SMT

1.575 V

Tray

AGLP030

活跃

TFQFP, TQFP128,.63SQ,16

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP128,.63SQ,16

1.5 V

未说明

70 °C

有

AGLP030V2-VQG128

160 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.59

Details

101 I/O

0°C ~ 85°C (TJ)

Tray

AGLP030V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.4 mm

compliant

S-PQFP-G128

101

不合格

1.2 V to 1.5 V

1.2/1.5 V

COMMERCIAL

16 uA

101

792 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

792

30000

STD

792

792

30000

14 mm

14 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

1.2 V

0 C

+ 85 C

SMD/SMT

微芯片技术

有

119

IGLOO2

Tray

M2GL010

活跃

1.2 V

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL010-VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

138 I/O

0°C ~ 85°C (TJ)

Tray

M2GL010

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

12084

933888

STD

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.2000 V

1.26 V

Tray

M1A3P600

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

M1A3P600L-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

0 to 70 °C

Tray

M1A3P600L

e0

锡铅银

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

A3P400

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P400-2FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40°C ~ 100°C (TJ)

Tray

A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

2

9216

400000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

77 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

微芯片技术

90

ProASIC3

0.514365 oz

1.5000 V

1.575 V

Tray

A3P030

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P030-VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

0 to 70 °C

Tray

A3P030

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

STD

768

30000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

Lead, Tin

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

N

586 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

763 MHz

微芯片技术

有

27

Actel

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

30

85 °C

无

AX2000-1FG896I

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

AX2000

e0

锡铅

85 °C

-40 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

763 MHz

896

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

36 kB

850 ps

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

21504

1

21504

0.84 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

Details

100 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

60

ProASIC3

0.046530 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P125

活跃

1.575 V

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P125-2TQG144

350 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

1.5 V

COMMERCIAL

3072 CLBS, 125000 GATES

1.6 mm

现场可编程门阵列

36864

125000

2

3072

125000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

QFN-48

YES

48-QFN (6x6)

48

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

微芯片技术

429

ProASIC3 nano

1.575 V

Tray

A3PN010

活跃

HQCCN,

CHIP CARRIER, HEAT SINK/SLUG

3

UNSPECIFIED

-40 °C

1.5 V

30

85 °C

有

A3PN010-1QNG48I

HQCCN

SQUARE

活跃

MICROSEMI CORP

5.26

Details

34 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

A3PN010

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

1.425 V to 1.575 V

INDUSTRIAL

260 CLBS, 10000 GATES

现场可编程门阵列

10000

1

260

10000

0.88 mm

6 mm

6 mm

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-FGG676I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

1.73 mm

27 mm

27 mm

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

Details

157 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P250

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P250-1FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.8 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA-256

256-FPBGA (17x17)

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P250

活跃

1.575 V

This product may require additional documentation to export from the United States.

N

157 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

0 to 70 °C

Tray

A3P250

1.425V ~ 1.575V

1.5 V

36864

250000

1

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

N

330 LE

77 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

526.32 MHz, 892.86 MHz

微芯片技术

有

90

IGLOOe

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL030

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

AGL030V2-VQ100

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

AGL030V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.2 V to 1.5 V

OTHER

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

STD

768

30000

1 mm

14 mm

14 mm

N/A

-

表面贴装

CSP-281

YES

281-CSP (10x10)

281

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

184

IGLOO PLUS

1.575 V

Tray

AGLP125

Obsolete

TFBGA, BGA281,19X19,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA281,19X19,20

1.5 V

未说明

70 °C

无

AGLP125V5-CS281

250 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

N

212 I/O

1.425 V

0°C ~ 85°C (TJ)

Tray

AGLP125V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B281

212

不合格

1.5 V

1.5 V

COMMERCIAL

212

3120 CLBS, 125000 GATES

1.05 mm

现场可编程门阵列

3120

36864

125000

STD

3120

3120

125000

0.71 mm

10 mm

10 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

175 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

263 MHz

有

微芯片技术

24

Actel

2.75 V

Tray

A54SX16

活跃

FQFP, QFP208,1.2SQ

FLATPACK, FINE PITCH

5.24

MICROSEMI CORP

活跃

SQUARE

FQFP

263 MHz

A54SX16A-1PQG208I

有

85 °C

40

2.5 V

-40 °C

QFP208,1.2SQ

PLASTIC/EPOXY

3

Details

-40°C ~ 85°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

175

1452 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

APA150

活跃

2.375 V

- 40 C

+ 125 C

SMD/SMT

100 I/O

This product may require additional documentation to export from the United States.

Details

180 MHz

有

160

Actel

0.014110 oz

2.625 V

Tray

-40°C ~ 125°C (TJ)

Tray

APA150

2.375V ~ 2.625V

2.5 V

36864

150000

STD

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

172 MHz

有

微芯片技术

66

Actel

0.062040 oz

Tray

A42MX16

活跃

5.5 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-PQG100I

94 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.27

Details

-40°C ~ 85°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

STD

2.8 ns

1232

24000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

1.2 V

- 40 C

+ 100 C

SMD/SMT

微芯片技术

有

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL025T-1FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

27696

1130496

2 Transceiver

27696

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P250-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

-40 to 85 °C

Tray

A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P600

活跃

1.575 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P600-1FGG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Details

147 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

24

ProASIC3

1.575 V

Tray

M1A3PE1500

活跃

5.59

MICROSEMI CORP

活跃

SQUARE

FQFP

350 MHz

M1A3PE1500-PQG208

有

70 °C

40

1.5 V

QFP208,1.2SQ,20

PLASTIC/EPOXY

3

FLATPACK, FINE PITCH

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M1A3PE1500

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-456

456-PBGA (35x35)

微芯片技术

This product may require additional documentation to export from the United States.

Details

356 I/O

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

有

24

Actel

2.7 V

Tray

APA1000

活跃

-55°C ~ 125°C (TC)

Tray

APA1000

2.3V ~ 2.7V

2.5 V

202752

1000000

1.73 mm

35 mm

35 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

3 V

0 C

+ 70 C

SMD/SMT

247 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A42MX09

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-1PQG100

135 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

Details

83 I/O

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

2.1 ns

684

14000

2.7 mm

20 mm

14 mm