品牌是'Microchip' (5152)
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![]() | AGLN060V5-CSG81 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 81-WFBGA, CSBGA | YES | 81-CSP (5x5) | 81 | 微芯片技术 | 未说明 | 1.425 V | 70 °C | 有 | AGLN060V5-CSG81 | VFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 2.07 | 60 | Tray | AGLN060 | 活跃 | VFBGA, | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -20 °C | 1.5 V | -20°C ~ 85°C (TJ) | IGLOO nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B81 | 不合格 | OTHER | 1536 CLBS, 60000 GATES | 0.8 mm | 现场可编程门阵列 | 1536 | 18432 | 60000 | STD | 1536 | 60000 | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-FFG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 无 | A54SX16A-FFG144 | 167 MHz | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.27 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | 2.5 V | 30 | 2.25 V | 70 °C | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 111 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 111 | 1452 CLBS, 24000 GATES | 1.55 mm | 现场可编程门阵列 | 1.9 ns | 1452 | 1452 | 24000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN030V2-ZUCG81I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 81-WFBGA, CSBGA | YES | 81-UCSP (4x4) | 81 | 微芯片技术 | 85 °C | 有 | AGLN030V2-ZUCG81I | VFBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.31 | 66 | Tray | AGLN030 | Obsolete | 4 X 4 MM, 0.80 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, UCSP-81 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | -40 °C | 1.2 V | 未说明 | 1.14 V | -40°C ~ 100°C (TJ) | IGLOO nano | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.4 mm | compliant | S-PBGA-B81 | 不合格 | INDUSTRIAL | 768 CLBS, 30000 GATES | 0.8 mm | 现场可编程门阵列 | 768 | 30000 | 768 | 30000 | 4 mm | 4 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN060-Z1VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | 微芯片技术 | 71 | Tray | A3PN060 | Obsolete | -40°C ~ 100°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 18432 | 60000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EX64-PTQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 有 | EX64-PTQG100I | 357 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.7 V | 5.83 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 40 | 2.3 V | 85 °C | e3 | 哑光锡 | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | INDUSTRIAL | 3000 GATES | 1.6 mm | 现场可编程门阵列 | 0.7 ns | 3000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL060V2-CSG121 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 121 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.8 | VFBGA, | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 未说明 | 1.14 V | 85 °C | 有 | AGL060V2-CSG121 | 108 MHz | VFBGA | 8542.39.00.01 | CMOS | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B121 | 不合格 | OTHER | 1536 CLBS, 60000 GATES | 0.99 mm | 现场可编程门阵列 | 1536 | 60000 | 6 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-1FGG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 85 °C | 有 | A54SX16A-1FGG256I | 263 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.32 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 2.5 V | 40 | 2.25 V | e1 | 锡银铜 | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 180 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 180 | 1452 CLBS, 24000 GATES | 1.97 mm | 现场可编程门阵列 | 1.2 ns | 1452 | 1452 | 24000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025TS-1FCS325I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | 微芯片技术 | 27696 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | 180 | Tray | M2GL025 | 活跃 | -40°C ~ 100°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 1.2 V | 27696 | 1130496 | 2 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-FG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EX128-TQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | 2.3 V | 70 °C | 有 | EX128-TQG100 | 250 MHz | LFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 1.58 | 70 | Tray | EX128 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 2.5 V | 40 | 0°C ~ 70°C (TA) | EX | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | COMMERCIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | STD | 1 ns | 6000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-2PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 3 V | 70 °C | 有 | A42MX16-2PQG208 | 117 MHz | FQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 1.59 | 140 | Tray | A42MX16 | 活跃 | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 0°C ~ 70°C (TA) | MX | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2 | 2.1 ns | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-2PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 320 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 3 V | 70 °C | 有 | A54SX16-2PQG208 | e3 | 哑光锡 | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 1452 CLBS, 16000 GATES | 4.1 mm | 现场可编程门阵列 | 0.7 ns | 1452 | 16000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-FG324 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 324 | 400.011771 mg | 324 | 无 | AX125-FG324 | 649 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.84 | 168 | Compliant | 1 MM PITCH, FBGA-324 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.5 V | 30 | 1.425 V | 70 °C | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | 649 MHz | S-PBGA-B324 | 168 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 2.3 kB | 990 ps | 990 ps | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | 现场可编程门阵列 | 1344 | 125000 | 649 MHz | 1344 | 1344 | 0.99 ns | 1344 | 2016 | 125000 | 1.25 mm | 19 mm | 19 mm | 无 | ||||||||||||||||||||||||||||||||||
![]() | M2GL005S-1VFG400T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 微芯片技术 | 1.2000 V | 171 | Tray | M2GL005 | 活跃 | , | 未说明 | 有 | M2GL005S-1VFG400T2 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.82 | -40 to 125 °C | Automotive, AEC-Q100, IGLOO2 | 有 | 1.14V ~ 2.625V | 未说明 | compliant | 现场可编程门阵列 | 6060 | 719872 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN060V5-ZVQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | 微芯片技术 | 71 | Tray | AGLN060 | 活跃 | -40°C ~ 100°C (TJ) | IGLOO nano | 1.425V ~ 1.575V | 1536 | 18432 | 60000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-1CQ208M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 无 | A54SX16-1CQ208M | 240 MHz | QFF | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.63 V | 5.25 | QFF, TPAK208,2.9SQ,20 | FLATPACK | CERAMIC, METAL-SEALED COFIRED | TPAK208,2.9SQ,20 | -55 °C | 3.3 V | 20 | 2.97 V | 125 °C | e0 | 3A001.A.2.C | 锡铅 | 24000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | FLAT | 225 | 0.5 mm | compliant | S-CQFP-F208 | 172 | 不合格 | 3.3,5 V | MILITARY | 172 | 1452 CLBS, 16000 GATES | 3.06 mm | 现场可编程门阵列 | 0.9 ns | 1452 | 1452 | 16000 | 29.21 mm | 29.21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | 3 V | 85 °C | 无 | A54SX08-2PQ208I | 320 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.27 | 130 | Compliant | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 320 MHz | S-PQFP-G208 | 不合格 | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 700 ps | 700 ps | 768 CLBS, 8000 GATES | 4.1 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 2 | 256 | 0.7 ns | 768 | 8000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-FG256A | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS1500-2FG676 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 676-BGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | 30 | 1.425 V | 85 °C | 无 | M1AFS1500-2FG676 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | 1.425 V | 1.575 V | 252 | Compliant | Tray | M1AFS1500 | 活跃 | FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 0°C ~ 85°C (TJ) | Fusion® | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B676 | 不合格 | 1.5 V | OTHER | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | 现场可编程门阵列 | 276480 | 1.5e+06 | 1.47059 GHz | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | 无 | ||||||||||||||||||||||||||||||||||
![]() | AGLN060V5-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 未说明 | 1.425 V | 70 °C | 有 | AGLN060V5-VQG100 | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 2.06 | 71 | Tray | AGLN060 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -20 °C | 1.5 V | -20°C ~ 85°C (TJ) | IGLOO nano | e3 | Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | OTHER | 1536 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | 1536 | 18432 | 60000 | STD | 1536 | 60000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN030V5-ZVQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | AGLN030V5-ZVQ100I | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.31 | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | INDUSTRIAL | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | 768 | 30000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN030-Z1VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | 微芯片技术 | 77 | Tray | A3PN030 | Obsolete | -20°C ~ 85°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 30000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-FFG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 无 | A54SX08A-FFG144 | 172 MHz | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.27 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | 2.5 V | 30 | 2.25 V | 70 °C | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 111 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 111 | 768 CLBS, 12000 GATES | 1.55 mm | 现场可编程门阵列 | 1.7 ns | 768 | 768 | 12000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-2FGG324 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 324 | 400.011771 mg | 324 | 有 | AX125-2FGG324 | 870 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.8 | 168 | Compliant | BGA, BGA324,18X18,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.5 V | 40 | 1.425 V | 70 °C | e1 | 锡银铜 | 70 °C | 0 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | 870 MHz | S-PBGA-B324 | 168 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 2.3 kB | 740 ps | 740 ps | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | 现场可编程门阵列 | 1344 | 125000 | 870 MHz | 1344 | 2 | 1344 | 0.74 ns | 1344 | 2016 | 125000 | 1.25 mm | 19 mm | 19 mm | 无 | |||||||||||||||||||||||||||||||||
![]() | M2GL050-FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | + 100 C | 1.26 V | - 40 C | 60 | 1.14 V | SMD/SMT | 微芯片技术 | Microchip | Microchip Technology / Atmel | IGLOO2 | Details | Tray | M2GL050 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 有 | M2GL050-FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.53 | 有 | 56340 LE | 267 I/O | -40°C ~ 100°C (TJ) | Tray | M2GL050 | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 1.2 V | 667 Mb/s | 267 | 2.44 mm | 现场可编程门阵列 | 56340 | FPGA - Field Programmable Gate Array | 1869824 | 4 Transceiver | 56340 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm |
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
