N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

IGLOO2

微芯片技术

200

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

85 °C

无

M2GL050-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

176

0°C ~ 85°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

STD

56340

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

IGLOO2

微芯片技术

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

无

M2GL150-1FC1152I

BGA

SQUARE

活跃

IC FPGA 574 I/O 1152FCBGA

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

24

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

IGLOO2

微芯片技术

377

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

85 °C

无

M2GL050T-1FG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

27

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

1

56340

31 mm

31 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

IGLOO2

微芯片技术

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

85 °C

无

M2GL150T-FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

24

0°C ~ 85°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP-100

100-VQFP (14x14)

微芯片技术

68

Tray

A3P250

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

90

ProASIC3

-55°C ~ 125°C (TJ)

Tray

A3P250

125 °C

-55 °C

1.425V ~ 1.575V

4.5 kB

36864

250000

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

IGLOO2

60

有

1.14 V

Details

This product may require additional documentation to export from the United States.

1.26 V

209

Tray

M2GL005

活跃

0°C ~ 85°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

6060

719872

N/A

-

表面贴装

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

IGLOO2

200

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

N

有

176

-40°C ~ 100°C (TJ)

Tray

M2GL050

1.14V ~ 2.625V

56340

1869824

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

IGLOO2

293

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

有

90

0°C ~ 85°C (TJ)

Tray

M2GL150

1.14V ~ 2.625V

146124

5120000

1

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

Tray

M2GL150

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL150TS-FCSG536I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

IGLOO2

90

有

293

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B536

现场可编程门阵列

146124

5120000

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

无

M2GL150TS-1FC1152I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

24

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

IGLOO2

微芯片技术

377

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

无

M2GL050-FG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

27

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

24

IGLOO2

微芯片技术

1.2000 V

574

Tray

M2GL150

活跃

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

1.14 V

85 °C

有

M2GL150T-FCG1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

有

0 to 85 °C

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

STD

146124

35 mm

35 mm

N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

1.26 V

161

Tray

M2GL005

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL005S-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

119

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

N/A

-

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

293

Tray

M2GL150

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL150-FCS536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

IGLOO2

微芯片技术

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

有

M2GL050-FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

1.53

This product may require additional documentation to export from the United States.

Details

有

176

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

STD

56340

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

M2GL050

活跃

This product may require additional documentation to export from the United States.

N

56340 LE

267 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.26 V

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL050

1.14V ~ 2.625V

667 Mb/s

56340

1869824

STD

4 Transceiver

含铅

N/A

-

表面贴装

896-BGA

896-FBGA (31x31)

微芯片技术

IGLOO2

377

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

有

27

0°C ~ 85°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

200

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

无

M2GL050T-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

STD

56340

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

176

IGLOO2

微芯片技术

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

有

M2GL050TS-FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

200

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

有

M2GL050TS-1FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

IGLOO2

248

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

有

84

0°C ~ 85°C (TJ)

Tray

M2GL150

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

400-LFBGA

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

1.14 V

有

90

IGLOO2

1.26 V

169

Tray

M2GL005

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

6060

719872

N/A

-

表面贴装

400-LFBGA

400-VFBGA (17x17)

微芯片技术

IGLOO2

207

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

N

有

90

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

293

Tray

M2GL150

活跃

16 X 16 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-536

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

有

M2GL150T-FCSG536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

Tray

M2GL050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

85 °C

无

M2GL050-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

STD

56340

17 mm

17 mm