N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

56520 LE

267 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

Tray

M2GL060

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.2 V

有

M2GL060-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M2GL060

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

2.44 mm

现场可编程门阵列

56520

1869824

1

23 mm

23 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

12084 LE

233 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

Tray

M2GL010

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL010TS-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

233

2.44 mm

现场可编程门阵列

12084

933888

STD

4 Transceiver

12084

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

267 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

有

M2GL090TS-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

86184 LE

-40°C ~ 100°C (TJ)

Tray

M2GL090TS

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

1

4 Transceiver

86316

23 mm

23 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

N

56520 LE

267 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

20

无

M2GL060T-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL060T

e0

Tin/Lead (Sn63Pb37)

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

2.44 mm

现场可编程门阵列

56520

1869824

1

4 Transceiver

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

27696 LE

207 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

85 °C

有

M2GL025T-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

M2GL025T

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

207

不合格

1.2 V

OTHER

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

STD

4 Transceiver

27696

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

56520 LE

207 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL060-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M2GL060

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.51 mm

现场可编程门阵列

56520

1869824

17 mm

17 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

This product may require additional documentation to export from the United States.

Details

27696 LE

180 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

85 °C

有

M2GL025-1FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

0°C ~ 85°C (TJ)

Tray

M2GL025

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

27696

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

233 I/O

1.14 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

60

IGLOO2

Tray

M2GL010

活跃

1.26 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL010T-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.28

Details

12084 LE

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

114 kB

667 Mb/s

233

2.44 mm

现场可编程门阵列

12084

933888

STD

4 Transceiver

12084

23 mm

23 mm

无铅

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

N

12084 LE

195 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

Tray

M2GL010

活跃

1.2 V

活跃

MICROSEMI CORP

5.27

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

无

M2GL010T-VF400I

LFBGA

SQUARE

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL010T

CMOS

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

N

86184 LE

267 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000

Tray

M2GL090

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL090-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

M2GL090

e0

Tin/Lead (Sn/Pb)

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

1

86316

23 mm

23 mm

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484

484-FPBGA (23x23)

484

微芯片技术

Tray

M2GL050

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

有

M2GL050T-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

有

60

IGLOO2

267

-40°C ~ 100°C (TJ)

Tray

M2GL050T

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

1

56340

23 mm

23 mm

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

Details

56520 LE

387 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

Tray

M2GL060

活跃

1.2 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

85 °C

有

M2GL060TS-1FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

233 I/O

1.2 V

0 C

微芯片技术

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

30

85 °C

有

M2GL010-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.61

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

Details

12084 LE

0°C ~ 85°C (TJ)

Tray

M2GL010

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

256 kB

114 kB

667 Mb/s

233

2.44 mm

现场可编程门阵列

12084

933888

400 MHz

22

STD

4 Transceiver

12084

1.26 V

1.14 V

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

27696 LE

207 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

Tray

M2GL025

活跃

1.2 V

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL025-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

M2GL025

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

1

27696

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

27696 LE

267 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL025TS-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

Details

56520 LE

387 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

85 °C

有

M2GL060T-1FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

Details

6060 LE

171 I/O

1.14 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.26 V

Tray

M2GL005

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL005-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

87.9 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

6060

17 mm

17 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

This product may require additional documentation to export from the United States.

Details

56520 LE

200 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

85 °C

有

M2GL060TS-FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

260

compliant

S-PBGA-B325

OTHER

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

Tray

M2GL025

活跃

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

1.2 V

27696

1130496

2 Transceiver

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

N

56520 LE

200 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060-1FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL060

8542.39.00.01

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

OTHER

现场可编程门阵列

56520

1869824

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

有

SMD/SMT

+ 100 C

微芯片技术

- 40 C

1.2 V

200 I/O

56520 LE

N

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL060

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

1.2 V

20

无

M2GL060TS-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

IGLOO2

176

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

FBGA-676

676-FBGA (27x27)

微芯片技术

M2GL060

活跃

1.2 V

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

Tray

0°C ~ 85°C (TJ)

Tray

M2GL060

1.2 V

667 Mb/s

56520

1869824

4 Transceiver

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

27696 LE

138 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL025-VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M2GL025

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

27696

1130496

14 mm

14 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL060

1.2 V

56520

1869824

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

This product may require additional documentation to export from the United States.

N

27696 LE

207 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL025TS-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm