N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

有

微芯片技术

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

125 °C

无

A3PE3000L-FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

- 55 C

+ 125 C

-55°C ~ 125°C (TJ)

Tray

A3PE3000L

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

341

不合格

1.2/1.5,1.2/3.3 V

MILITARY

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

75264

1.575 V

1.14 V

3000000

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

30

85 °C

无

M1A3PE3000L-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000L

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 85 C

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PN125-2VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

A3PN125

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

2

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

- 20 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

90

IGLOO nano

Tray

AGLN125

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

AGLN125V5-VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

N

1500 LE

71 I/O

-20°C ~ 85°C (TJ)

Tray

AGLN125V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

OTHER

18 uA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

90

IGLOOe

Tray

M1AGL1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1AGL1000V5-FGG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

0 C

0°C ~ 70°C (TA)

Tray

M1AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

18 kB

127 uA

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 85 C

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PN125-1VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

A3PN125

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

1

3072

125000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

- 55 C

+ 125 C

SMD/SMT

350 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

Tray

A3PE3000

活跃

1.575 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.2 V

40

125 °C

有

A3PE3000L-1FGG896M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

620 I/O

1.14 V

-55°C ~ 125°C (TJ)

Tray

A3PE3000L

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.2/1.5,1.2/3.3 V

MILITARY

63 kB

25 mA

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

350 MHz

1

75264

75264

75264

1.575 V

1.14 V

3000000

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

60

IGLOOe

Tray

M1AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1AGL1000V5-FG484

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

300 I/O

0 C

0°C ~ 70°C (TA)

Tray

M1AGL1000V5

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

OTHER

18 kB

127 uA

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

260

ProASIC3

1.575 V

Tray

A3P030

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

1.5 V

30

85 °C

有

A3P030-2QNG68

350 MHz

HVQCCN

SQUARE

活跃

MICROSEMI CORP

5.24

Details

49 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

A3P030

8542.39.00.01

CMOS

1.5 V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

COMMERCIAL

2 mA

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

30000

2

768

30000

0.88 mm

8 mm

8 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

A3P600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

A3P600L-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

0 to 70 °C

Tray

A3P600L

e0

锡铅银

70 °C

0 °C

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

COMMERCIAL

13.5 kB

5 mA

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

892.86 MHz

1

13824

13824

13824

1.26 V

1.14 V

600000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

CSP-201

YES

201

201-CSP (8x8)

201

157 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

348

IGLOO PLUS

1.2, 1.5 V

1.14 V

1.575 V

Tray

AGLP060

活跃

1.575 V

VFBGA, BGA201,15X15,20

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA201,15X15,20

1.5 V

未说明

70 °C

有

AGLP060V2-CSG201

160 MHz

VFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

0 to 70 °C

Tray

AGLP060V2

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B201

157

不合格

1.2/1.5 V

COMMERCIAL

157

1584 CLBS, 60000 GATES

0.99 mm

现场可编程门阵列

1584

18432

60000

STD

1584

1584

60000

0.66 mm

8 mm

8 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE3000

活跃

1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

125 °C

无

M1A3PE3000L-1FG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-55°C ~ 125°C (TJ)

Tray

M1A3PE3000L

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

not_compliant

S-PBGA-B484

341

不合格

1.2/1.5,1.2/3.3 V

MILITARY

25 mA

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

0 C

+ 70 C

0.014110 oz

ProASIC3

微芯片技术

60

有

781.25 MHz

SMD/SMT

1.2000 V

1.26 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

70 °C

无

M1A3PE3000L-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE3000L

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

This product may require additional documentation to export from the United States.

N

3000 LE

143 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

250 MHz

有

348

IGLOOe

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL250

活跃

5.3

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

100 °C

无

AGL250V2-CS196I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

-40 to 85 °C

Tray

AGL250V2

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B196

不合格

INDUSTRIAL

20 uA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

0.7 mm

8 mm

8 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

1.2 V

微芯片技术

1.5 V

215

1.5 V

Tray

M1AGL600

活跃

10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, CSP-281

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

100 °C

有

M1AGL600V2-CSG281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

1.2 V

有

184

IGLOOe

1.2, 1.5 V

-40 to 85 °C

Tray

M1AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

260

0.5 mm

compliant

30

S-PBGA-B281

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

10 mm

10 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

11000 LE

97 I/O

0 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

160

IGLOOe

1.575 V

1.475 V

1.5000 V

Tray

M1AGL1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1AGL1000V5-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

0 to 70 °C

Tray

M1AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

OTHER

18 kB

127 uA

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

STD

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

- 20 C

+ 70 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.575 V

Tray

A3PN250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN250-1VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

68 I/O

-20°C ~ 85°C (TJ)

Tray

A3PN250

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 70 C

SMD/SMT

1282.05 MHz

有

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS1500-1FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

119 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

38400 CLBS, 1500000 GATES

1.68 mm

现场可编程门阵列

276480

1500000

1

38400

1500000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

VQFP-176

YES

176-VQFP (20x20)

176

Details

137 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

60

IGLOO PLUS

1.2, 1.5 V

1.14 V

1.575 V

Tray

AGLP060

活跃

1.575 V

TFQFP, TQFP176,.87SQ,16

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP176,.87SQ,16

1.5 V

未说明

70 °C

有

AGLP060V2-VQG176

160 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

0 to 70 °C

Tray

AGLP060V2

8542.39.00.01

CMOS

1.2 V to 1.5 V

QUAD

鸥翼

未说明

0.4 mm

compliant

S-PQFP-G176

137

不合格

1.2/1.5 V

COMMERCIAL

20 uA

137

1584 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1584

18432

60000

STD

1584

1584

60000

20 mm

20 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

90

Fusion

0.014110 oz

Tray

M1AFS1500

活跃

1.575 V

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS1500-1FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

0°C ~ 85°C (TJ)

Tray

M1AFS1500

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

33.8 kB

38400 CLBS, 1500000 GATES

1.68 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1.575 V

1.425 V

1500000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P600

活跃

This product may require additional documentation to export from the United States.

Details

235 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

60

ProASIC3

0.014110 oz

0 to 70 °C

Tray

M1A3P600L

1.2 V

110592

600000

1

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

- 40 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

有

160

IGLOOe

Tray

M1AGL1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1AGL1000V5-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

97 I/O

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

18 kB

127 uA

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

896

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

Details

620 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.2 V

40

85 °C

有

M1A3PE3000L-FGG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.5/3.3 V

INDUSTRIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 85 C

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

5.26

MICROSEMI CORP

活跃

SQUARE

TFQFP

A3PN125-VQ100I

无

N

71 I/O

1.425 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

A3PN125

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.14 V

1.26 V

1.26 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

70 °C

有

M1A3PE3000L-FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0°C ~ 85°C (TJ)

Tray

M1A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm