品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 导体材料 | 厂商 | 操作温度 | 系列 | JESD-609代码 | 无铅代码 | 端子表面处理 | 颜色 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 额定电流 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 导线/电缆规格 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | LABs数量/ CLBs数量 | 速度等级 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 长度 | 宽度 | |||||||||||||||||||||||||||||||
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![]() | MPF500T-1FCG784IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL125V5-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | AGL125 | 活跃 | 微芯片技术 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.5 V | 未说明 | 1.425 V | 85 °C | 有 | AGL125V5-VQG100 | 108 MHz | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 1.58 | 1.575 V | 1.425 V | 1.5000 V | 71 | Tray | 0 to 70 °C | IGLOO | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | OTHER | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 14 mm | 14 mm | |||||||||||||||||||||
![]() | AX500-FGG676I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | 1.425 V | 1.5000 V | 336 | Tray | AX500 | 活跃 | 1.575 V | -40 to 85 °C | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE3000-2PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 微芯片技术 | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | M1A3PE3000-2PQG208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.6 | 1.5000 V | 147 | Tray | M1A3PE3000 | 活跃 | -40 to 85 °C | ProASIC3E | e3 | Matte Tin (Sn) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 2 | 75264 | 75264 | 3000000 | 28 mm | 28 mm | |||||||||||||||||
![]() | MPF300TS-1FCG484IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060-1FGG484T1 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | Tray | M2GL060 | 活跃 | , | 未说明 | 有 | M2GL060-1FGG484T1 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.81 | 267 | -40°C ~ 135°C (TJ) | Automotive, AEC-Q100, IGLOO2 | 有 | 1.14V ~ 2.625V | 未说明 | compliant | 现场可编程门阵列 | 56520 | 1869824 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF100TL-FCVG484E | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BFBGA | 484-FPBGA (19x19) | Copper | 微芯片技术 | 600 V | Compliant | PVC | 284 | Tray | MPF100 | 活跃 | 600 V | 0°C ~ 100°C (TJ) | PolarFire™ | Blue | 0.97V ~ 1.08V | 12 A | 20 AWG | 109000 | 7782400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL400V2-CSG196 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 196-TFBGA, CSBGA | YES | 196-CSP (8x8) | 196 | 活跃 | 微芯片技术 | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.2 V | 未说明 | 1.14 V | 85 °C | 有 | AGL400V2-CSG196 | TFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.25 | 1.2, 1.5 V | 1.14 V | 1.575 V | 143 | Tray | AGL400 | 0 to 70 °C | IGLOO | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B196 | 不合格 | OTHER | 9216 CLBS, 400000 GATES | 1.2 mm | 现场可编程门阵列 | 9216 | 55296 | 400000 | STD | 9216 | 400000 | 8 mm | 8 mm | ||||||||||||||||||||||||
![]() | AGLN020V2-QNG68 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | AGLN020 | 活跃 | 微芯片技术 | HVQCCN, | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 | UNSPECIFIED | 5.59 | 1.575 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | HVQCCN | AGLN020V2-QNG68 | 有 | 70 °C | 1.14 V | 未说明 | 1.2 V | -20 °C | 1.2, 1.5 V | 1.14 V | 1.575 V | 49 | Tray | -20 to 70 °C | IGLOO nano | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 无铅 | 未说明 | 0.4 mm | compliant | S-XQCC-N68 | 不合格 | OTHER | 520 CLBS, 20000 GATES | 1 mm | 现场可编程门阵列 | 520 | 20000 | STD | 520 | 20000 | 8 mm | 8 mm | ||||||||||||||||||||||||
![]() | A54SX32A-FGG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | 2.25 V | 2.5000 V | 203 | Tray | A54SX32 | 活跃 | 2.75 V | -40 to 85 °C | SX-A | 2.25V ~ 5.25V | 48000 | 2880 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060TS-1FGG484T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 1.2000 V | 267 | Tray | M2GL060 | 活跃 | , | 未说明 | 有 | M2GL060TS-1FGG484T2 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.8 | -40 to 125 °C | Automotive, AEC-Q100, IGLOO2 | 有 | 1.14V ~ 2.625V | 未说明 | compliant | 现场可编程门阵列 | 56520 | 1869824 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS600-FGG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 活跃 | 微芯片技术 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AFS600-FGG484 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | 1.5000 V | 1.425 V | 1.575 V | 172 | Tray | AFS600 | 0 to 70 °C | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 不合格 | OTHER | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | STD | 13824 | 600000 | 23 mm | 23 mm | |||||||||||||||||||||||
![]() | EX128-TQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 2.7 V | 70 | Tray | 微芯片技术 | EX128 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 40 | 2.3 V | 85 °C | 有 | 250 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 2.7 V | 5.32 | F485-G | Ocal, a T & B Brand | 2.5000 V | 2.3 V | -40 to 85 °C | EX | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | INDUSTRIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | STD | 1 ns | 6000 | 14 mm | 14 mm | |||||||||||||||||||||
![]() | A54SX16-2PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 无 | A54SX16-2PQ208 | 320 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | e0 | Tin/Lead (Sn/Pb) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 1452 CLBS, 16000 GATES | 4.1 mm | 现场可编程门阵列 | 0.7 ns | 1452 | 16000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||
![]() | AGLN030V5-ZVQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | AGLN030V5-ZVQG100I | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.31 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | -40 °C | 1.5 V | 未说明 | 1.425 V | 85 °C | 有 | e3 | TIN | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | 768 | 30000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | AGLN030V2-ZVQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | AGLN030V2-ZVQG100I | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | -40 °C | 1.2 V | 未说明 | 1.14 V | 85 °C | 有 | e3 | TIN | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | 768 | 30000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | AGLP125V2-CS289I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 289-TFBGA, CSBGA | YES | 289-CSP (14x14) | 289 | 微芯片技术 | BGA289,17X17,32 | -40 °C | 1.5 V | 未说明 | 1.425 V | 85 °C | 无 | AGLP125V2-CS289I | 160 MHz | TFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.28 | 212 | Tray | AGLP125 | Obsolete | TFBGA, BGA289,17X17,32 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | -40°C ~ 100°C (TJ) | IGLOO PLUS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.8 mm | unknown | S-PBGA-B289 | 212 | 不合格 | 1.2/1.5 V | INDUSTRIAL | 212 | 3120 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3120 | 36864 | 125000 | STD | 3120 | 3120 | 125000 | 14 mm | 14 mm | ||||||||||||||||||||
![]() | A54SX08A-FPQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 2.25 V | 70 °C | 有 | A54SX08A-FPQG208 | 172 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 7.1 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 2.5 V | 40 | e3 | 哑光锡 | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 130 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 130 | 768 CLBS, 12000 GATES | 4.1 mm | 现场可编程门阵列 | 1.7 ns | 768 | 768 | 12000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||
![]() | A54SX16A-1FGG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 40 | 2.25 V | 85 °C | 有 | A54SX16A-1FGG144I | 263 MHz | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.32 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | -40 °C | 2.5 V | e1 | 锡银铜 | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 111 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 111 | 1452 CLBS, 24000 GATES | 1.55 mm | 现场可编程门阵列 | 1.2 ns | 1452 | 1452 | 24000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||
![]() | A3PN030-ZVQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | -20 °C | 1.5 V | 30 | 1.425 V | 70 °C | 无 | A3PN030-ZVQ100 | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | 77 | Tray | A3PN030 | Obsolete | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -20°C ~ 85°C (TJ) | ProASIC3 nano | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | OTHER | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | 30000 | 768 | 30000 | 14 mm | 14 mm | |||||||||||||||||||||||||||
![]() | A3PN030-ZVQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | PLASTIC/EPOXY | TQFP100,.63SQ | -20 °C | 1.5 V | 40 | 1.425 V | 70 °C | 有 | A3PN030-ZVQG100 | TFQFP | SQUARE | Actel Corporation | Transferred | ACTEL CORP | 1.575 V | 5.77 | 77 | Tray | A3PN030 | 活跃 | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | -20°C ~ 85°C (TJ) | ProASIC3 nano | e3 | 哑光锡 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 77 | 不合格 | 1.5,1.5/3.3 V | OTHER | 77 | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | 30000 | STD | 768 | 768 | 30000 | 14 mm | 14 mm | |||||||||||||||||||||
![]() | A3PN030-ZQNG68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-VFQFN Exposed Pad | 68-QFN (8x8) | 微芯片技术 | 活跃 | 49 | Tray | A3PN030 | -40°C ~ 100°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 30000 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P125-FG144T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | 144-FPBGA (13x13) | 微芯片技术 | 活跃 | 97 | Tray | A3P125 | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | 1.425V ~ 1.575V | 36864 | 125000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN125V2-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | -20 °C | 1.2 V | 未说明 | 1.14 V | 70 °C | 有 | AGLN125V2-VQG100 | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 2.04 | 71 | Tray | AGLN125 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -20°C ~ 85°C (TJ) | IGLOO nano | e3 | Tin (Sn) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | OTHER | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 14 mm | 14 mm | ||||||||||||||||||||||||
![]() | AGLN020V5-UCG81 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 81 | AGLN020V5-UCG81 | VFBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 8 | VFBGA, | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | -20 °C | 1.5 V | 未说明 | 1.425 V | 70 °C | 有 | 8542.39.00.01 | CMOS | BOTTOM | BALL | 未说明 | 0.4 mm | compliant | S-PBGA-B81 | 不合格 | OTHER | 520 CLBS, 20000 GATES | 0.8 mm | 现场可编程门阵列 | 520 | 20000 | 4 mm | 4 mm |
MPF500T-1FCG784IPP
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL125V5-VQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX500-FGG676I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3PE3000-2PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF300TS-1FCG484IPP
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060-1FGG484T1
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF100TL-FCVG484E
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL400V2-CSG196
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN020V2-QNG68
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-FGG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060TS-1FGG484T2
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS600-FGG484
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
EX128-TQG100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16-2PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN030V5-ZVQG100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN030V2-ZVQG100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLP125V2-CS289I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08A-FPQG208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16A-1FGG144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PN030-ZVQ100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PN030-ZVQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PN030-ZQNG68I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P125-FG144T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN125V2-VQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN020V5-UCG81
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
