N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PN250

活跃

30

1.5 V

-40 °C

PLASTIC/EPOXY

3

FLATPACK, THIN PROFILE, FINE PITCH

TFQFP,

85 °C

无

A3PN250-1VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

A3PN250

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

Details

3000 LE

143 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

有

348

36864 bit

IGLOOe

0.260886 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

AGL250

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

未说明

85 °C

有

AGL250V5-CSG196

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

AGL250V5

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

OTHER

20 uA

-

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

8 mm

8 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

Tray

M1A3P1000

活跃

1.575 V

5.23

MICROSEMI CORP

活跃

SQUARE

LBGA

350 MHz

M1A3P1000-FGG144M

有

125 °C

40

1.5 V

-55 °C

BGA144,12X12,40

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE

LBGA, BGA144,12X12,40

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

e1

3A001.A.2.C

锡银铜

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5,1.5/3.3 V

MILITARY

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 70 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.575 V

Tray

A3PN250

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN250-2VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

68 I/O

1.425 V

- 20 C

-20°C ~ 85°C (TJ)

Tray

A3PN250

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

CSP

YES

196-CSP (8x8)

196

0 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

348

IGLOOe

1.575 V

1.14 V

1.2, 1.5 V

1.575 V

Tray

AGL400

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

未说明

85 °C

无

AGL400V2-CS196

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

143 I/O

1.14 V

0 to 70 °C

Tray

AGL400V2

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B196

不合格

OTHER

27 uA

9216 CLBS, 400000 GATES

1.2 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

0.7 mm

8 mm

8 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 70 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.575 V

Tray

A3PN250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN250-1VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

68 I/O

1.425 V

- 20 C

-20°C ~ 85°C (TJ)

Tray

A3PN250

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

- 20 C

1.425 V

微芯片技术

71 I/O

Details

Tray

A3PN060

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN060-2VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

ProASIC3 nano

90

有

350 MHz

SMD/SMT

+ 70 C

-20°C ~ 85°C (TJ)

Tray

A3PN060

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

2

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

+ 100 C

SMD/SMT

250 MHz

微芯片技术

有

90

IGLOO nano

1.575 V

Tray

AGLN060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

85 °C

无

AGLN060V2-VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

N

700 LE

71 I/O

1.14 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

AGLN060V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.2 V to 1.5 V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

INDUSTRIAL

-

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1536

18432

60000

STD

-

1536

60000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

有

60

ProASIC3

微芯片技术

0.014110 oz

35000 LE

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

125 °C

无

A3PE3000L-1FG484M

250 MHz

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array ProASIC3 Military ProASIC3/EL Low Power Flash FPGAs with Flash*Freeze Technology

MICROSEMI CORP

5.29

341 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TJ)

Tray

A3PE3000L

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.2/1.5,1.2/3.3 V

MILITARY

63 kB

-

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

-

75264

75264

75264

1.575 V

1.14 V

3000000

23 mm

23 mm

无

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

N

微芯片技术

This product may require additional documentation to export from the United States.

90

IGLOOe

Tray

M1AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1AGL1000V5-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

有

250 MHz

SMD/SMT

+ 70 C

0 C

177 I/O

11000 LE

0°C ~ 70°C (TA)

Tray

M1AGL1000V5

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

18 kB

127 uA

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

- 40 C

+ 100 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

0.017637 oz

1.575 V

Tray

A3PN060

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PN060-VQG100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.4

Details

700 LE

71 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

A3PN060

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425 V to 1.575 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

-

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

STD

-

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060T

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FCBGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.2 V

27696

1130496

2 Transceiver

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

SMD/SMT

微芯片技术

有

176

IGLOO2

Tray

M2GL025

活跃

1.2 V

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

5.27

MICROSEMI CORP

活跃

SQUARE

BGA

M2GL025-1FCSG325I

有

1.2 V

BGA325,21X21,20

This product may require additional documentation to export from the United States.

Details

27696 LE

180 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL025

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

180

不合格

1.2 V

180

现场可编程门阵列

27696

1130496

27696

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

0 C

+ 85 C

SMD/SMT

微芯片技术

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL010TS-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

+ 100 C

SMD/SMT

微芯片技术

有

60

IGLOO2

0.711955 oz

1.26 V

Tray

M2GL010

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL010-1TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

This product may require additional documentation to export from the United States.

Details

12084 LE

84 I/O

1.14 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

1.2 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

-

1.6 mm

现场可编程门阵列

12084

933888

-

20 mm

20 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

1.2 V

Tray

M2GL090

活跃

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090T-1FCSG325I

活跃

MICROSEMI CORP

5.8

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL090T

8542.39.00.01

CMOS

1.2 V

compliant

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

12084 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL010

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

1.2 V

12084

933888

2 Transceiver

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

+ 85 C

SMD/SMT

微芯片技术

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

387 I/O

1.2 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

2.3 V

186 I/O

Details

This product may require additional documentation to export from the United States.

180 MHz

有

90

Actel

0.014110 oz

2.7 V

Tray

APA600

活跃

SMD/SMT

+ 125 C

- 55 C

-55°C ~ 125°C (TC)

Tray

APA600

125 °C

-55 °C

2.5 V

180 MHz

15.8 kB

129024

600000

180 MHz

21504

2.7 V

2.3 V

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

Details

有

90

微芯片技术

Actel

0.023175 oz

2.7 V

Tray

EX128

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

40

85 °C

有

EX128-PTQG100I

357 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

70 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

eX128

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

INDUSTRIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

0.7 ns

6000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

微芯片技术

有

27

Actel

0.014110 oz

Tray

APA1000

活跃

2.7 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

2.5 V

30

70 °C

无

APA1000-FG896

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

642 I/O

0°C ~ 70°C (TA)

Tray

APA1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

642

不合格

2.5,2.5/3.3 V

COMMERCIAL

642

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

STD

56320

1000000

1.73 mm

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

870 MHz

微芯片技术

有

60

Actel

0.014110 oz

Tray

AX1000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

AX1000-2FG484I

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 85°C (TA)

Tray

AX1000

e0

锡铅

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

870 MHz

S-PBGA-B484

516

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

649 MHz

微芯片技术

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

30

70 °C

无

AX1000-FG676

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

AX1000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

649 MHz

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

60

Actel

0.014110 oz

Tray

APA600

活跃

2.625 V

This product may require additional documentation to export from the United States.

N

370 I/O

-40°C ~ 125°C (TJ)

Tray

APA600

125 °C

-40 °C

2.5 V

15.8 kB

129024

600000

180 MHz

STD

21504

2.625 V

2.375 V

1.73 mm

23 mm

23 mm

无