N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

YES

180

CHIP CARRIER, VERY THIN PROFILE

3

UNSPECIFIED

LGA180,20X20,20

-40 °C

1.5 V

30

1.425 V

85 °C

有

AFS090-QNG180I

350 MHz

VBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.31

VBCC, LGA180,20X20,20

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

260

0.5 mm

compliant

S-XBCC-B180

60

不合格

1.5,3.3 V

INDUSTRIAL

60

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

2304

2304

90000

10 mm

10 mm

N/A

-

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-BGA

484

M2GL150

活跃

FBGA,

微芯片技术

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

有

M2GL150TS-1FCVG484

5.27

1.26 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

FBGA

Compliant

248

Tray

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

1

19 mm

19 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

3.3, 5 V

3 V

5.25 V

69

Tray

A40MX04

微芯片技术

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

3 V

70 °C

有

A40MX04-FPQG100

48 MHz

QFP

RECTANGULAR

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

1.4

0 to 70 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

F

3.7 ns

547

6000

20 mm

14 mm

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (27X27)

484

2.5000 V

2.25 V

2.75 V

249

Tray

A54SX32

微芯片技术

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

40

2.25 V

70 °C

有

A54SX32A-FFGG484

172 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.75 V

5.25

0 to 70 °C

SX-A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

249

不合格

2.5,2.5/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.44 mm

现场可编程门阵列

48000

2880

F

1.7 ns

2880

2880

48000

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

676-BGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

1.5000 V

1.425 V

1.575 V

252

Compliant

Tray

AFS1500

活跃

0 to 70 °C

Fusion®

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1.5e+06

1.28205 GHz

1

38400

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

256-BFCQFP with Tie Bar

YES

256-CQFP (75x75)

256

Tray

A54SX32

活跃

QFF, TPAK256,3SQ,20

微芯片技术

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK256,3SQ,20

2.5 V

2.25 V

70 °C

无

A54SX32A-1CQ256

278 MHz

QFF

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.75 V

5.24

2.5000 V

203

0 to 70 °C

SX-A

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F256

228

不合格

2.5,3.3/5 V

COMMERCIAL

228

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

48000

2880

1

1.1 ns

2880

2880

48000

36 mm

36 mm

N/A

-

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

1.5000 V

1.425 V

1.575 V

34

Tray

A3PN010

微芯片技术

活跃

HQCCN,

CHIP CARRIER, HEAT SINK/SLUG

3

UNSPECIFIED

-40 °C

1.5 V

30

1.425 V

85 °C

有

A3PN010-QNG48I

HQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

-40 to 85 °C

ProASIC3 nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

INDUSTRIAL

260 CLBS, 10000 GATES

现场可编程门阵列

10000

STD

260

10000

6 mm

6 mm

N/A

-

表面贴装

81-WFBGA, CSBGA

81-CSP (5x5)

微芯片技术

1.5000 V

52

Tray

AGLN020

活跃

-20 to 70 °C

IGLOO nano

1.425V ~ 1.575V

520

20000

STD

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

113

Tray

A54SX32

微芯片技术

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

3.3 V

40

3 V

85 °C

有

A54SX32-2TQG144I

320 MHz

LFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.24

-40 to 85 °C

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

3.3,5 V

INDUSTRIAL

113

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

2

0.7 ns

2880

2880

32000

20 mm

20 mm

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (27X27)

484

2.5000 V

2.25 V

2.75 V

249

Tray

A54SX32

微芯片技术

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

30

2.25 V

70 °C

无

A54SX32A-2FG484

313 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.75 V

5.29

0 to 70 °C

SX-A

e0

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

249

不合格

2.5,2.5/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.44 mm

现场可编程门阵列

48000

2880

2

0.9 ns

2880

2880

48000

27 mm

27 mm

N/A

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

活跃

31 X 31 MM, 1 MM PITCH, FBGA-896

网格排列

微芯片技术

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

无

M2GL050T-FG896I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.27

377

Tray

M2GL050

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

3.3, 5 V

3 V

5.25 V

140

Tray

A42MX16

微芯片技术

活跃

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

3 V

70 °C

有

A42MX16-FPQG208

56 MHz

FQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

1.42

0 to 70 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

F

4 ns

1232

24000

28 mm

28 mm

N/A

-

表面贴装

676-BGA

676-FBGA (27x27)

微芯片技术

Microsemi Corporation

活跃

MICROSEMI CORP

5.8

1.2000 V

387

Tray

M2GL060

活跃

,

未说明

有

M2GL060TS-1FGG676T2

-40 to 125 °C

Automotive, AEC-Q100, IGLOO2

有

1.14V ~ 2.625V

未说明

compliant

现场可编程门阵列

56520

1869824

1

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

1.2, 1.5 V

1.14 V

1.575 V

97

Tray

AGL125

微芯片技术

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

无

AGL125V2-FG144

108 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.28

0 to 70 °C

IGLOO

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

OTHER

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

13 mm

13 mm

N/A

-

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

Tray

A3PN125

活跃

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

TQFP100,.63SQ

-20 °C

1.5 V

未说明

1.425 V

70 °C

有

A3PN125-Z2VQG100

TFQFP

SQUARE

Microsemi Corporation

不推荐

MICROSEMI CORP

1.575 V

5.32

71

-20°C ~ 85°C (TJ)

ProASIC3 nano

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

71

不合格

1.5,1.5/3.3 V

OTHER

71

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

3072

3072

125000

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

Obsolete

未说明

1.14 V

微芯片技术

85 °C

有

AGLN250V2-ZVQG100I

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

1.2 V

-40 °C

PLASTIC/EPOXY

FLATPACK, THIN PROFILE, FINE PITCH

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

68

Tray

AGLN250

-40°C ~ 100°C (TJ)

IGLOO nano

e3

TIN

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

6144

250000

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

AGLN125

Obsolete

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

1.14 V

85 °C

无

AGLN125V2-ZVQ100I

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.84

71

Tray

-40°C ~ 100°C (TJ)

IGLOO nano

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

3072

125000

14 mm

14 mm

N/A

-

YES

100

PLASTIC/EPOXY

-40 °C

1.2 V

30

1.14 V

85 °C

无

AGLN030V2-ZVQ100I

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.88

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

AGLN250

Obsolete

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

85 °C

无

AGLN250V5-ZVQ100I

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.89

68

Tray

-40°C ~ 100°C (TJ)

IGLOO nano

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

6144

250000

14 mm

14 mm