N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

350 MHz

SMD/SMT

+ 85 C

0 C

1.425 V

100 I/O

微芯片技术

1500 LE

Details

ProASIC3

0.046530 oz

1.5000 V

1.575 V

Tray

A3P125

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P125-1TQG144

350 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

60

有

0 to 70 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

1.5 V

COMMERCIAL

-

3072 CLBS, 125000 GATES

1.6 mm

现场可编程门阵列

36864

125000

1

-

3072

125000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-1VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

0 to 70 °C

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

Details

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

AFS1500

70 °C

0 °C

1.425V ~ 1.575V

1.0989 GHz

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.0989 GHz

38400

1.73 mm

23 mm

23 mm

无

无铅

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.14 V

- 40 C

IGLOO nano

90

有

微芯片技术

250 MHz

SMD/SMT

+ 85 C

1.2, 1.5 V

Tray

AGLN125

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

85 °C

无

AGLN125V2-VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

N

1500 LE

71 I/O

-40 to 85 °C

Tray

AGLN125V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.2 V to 1.5 V

INDUSTRIAL

18 uA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

A3PE1500

活跃

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

-40 to 85 °C

Tray

A3PE1500

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

310 MHz

2

38400

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

Tray

微芯片技术

M1A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-FGG256I

BGA

SQUARE

活跃

5.24

1.575 V

MICROSEMI CORP

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

90

ProASIC3

178

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Details

151 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

24

ProASIC3

1.425 V

1.575 V

1.575 V

Tray

A3P250

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P250-2PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.35

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

36864

250000

2

6144

250000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

310 MHz

SMD/SMT

+ 85 C

- 40 C

1.425 V

微芯片技术

151 I/O

Details

This product may require additional documentation to export from the United States.

Tray

A3P400

活跃

1.575 V

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P400-2PQG208I

5.24

MICROSEMI CORP

活跃

SQUARE

FQFP

350 MHz

ProASIC3

24

有

-40°C ~ 100°C (TJ)

Tray

A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

2

9216

400000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

Copper, Silver, Tin

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

310 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.575 V

8542390000

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PE3000-2FGG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.58

This product may require additional documentation to export from the United States.

Details

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN060

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PN060-2VQG100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

71 I/O

1.425 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

A3PN060

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.425 V to 1.575 V

INDUSTRIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

2

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

0 to 70 °C

Tray

M7A3P1000

70 °C

0 °C

1.425V ~ 1.575V

231 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

231 MHz

STD

24576

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

Tray

A3PN060

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PN060-1VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

A3PN060

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

1

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PN060-2VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

A3PN060

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

2

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-1FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

0 to 70 °C

Tray

M1A3P600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

N

11000 LE

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

310 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P1000-2FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

FBGA-256

256-FPBGA (17x17)

微芯片技术

1.425 V

1.575 V

1.575 V

Tray

A3P250

活跃

This product may require additional documentation to export from the United States.

N

157 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

0 to 70 °C

Tray

A3P250

1.425V ~ 1.575V

1.5 V

36864

250000

2

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

SMD/SMT

198 MHz

有

微芯片技术

40

Actel

5.25 V

Tray

A42MX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-1TQG176

108 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

140 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-2FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

A3P600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

SMD/SMT

296 MHz

有

微芯片技术

40

Actel

5.25 V

Tray

A42MX09

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-3TQG176

161 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

104 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

COMMERCIAL

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

14000

1.6 ns

684

14000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

+ 70 C

SMD/SMT

215 MHz

有

微芯片技术

24

Actel

0.196363 oz

5.25 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

5.3

MICROSEMI CORP

活跃

SQUARE

QFP

117 MHz

A42MX16-2PQG160

有

70 °C

Details

125 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.1 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

YES

208

208-CQFP (75x75)

208

SMD/SMT

有

微芯片技术

1

Actel

3.3 V

Tray

A42MX36

活跃

CERAMIC, QFP-208

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

无

A42MX36-1CQ208B

83 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

Military grade

This product may require additional documentation to export from the United States.

N

176 I/O

3.3 V

- 55 C

+ 125 C

-55°C ~ 125°C (TJ)

A42MX36

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

FLAT

225

0.5 mm

compliant

208

S-CQFP-F208

不合格

3.3 V

MILITARY

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

2560

54000

MIL-STD-883

1

1822

2.3 ns

2438

2414

54000

29.21 mm

29.21 mm

无

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

+ 70 C

SMD/SMT

198 MHz

有

微芯片技术

24

Actel

0.196363 oz

5.25 V

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-1PQG160

108 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

125 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

+ 85 C

SMD/SMT

198 MHz

有

微芯片技术

40

Actel

5.5 V

Tray

A42MX16

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-1TQG176I

108 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

140 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

Tray

A3PN125

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN125-VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 20 C

+ 70 C

-20°C ~ 85°C (TJ)

Tray

A3PN125

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN125-2VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 20 C

+ 70 C

-20°C ~ 85°C (TJ)

Tray

A3PN125

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

2

3072

125000

1 mm

14 mm

14 mm