22 In Stock

• 1: ¥74.299269
• 10: ¥70.093651
• 100: ¥66.126081
• 500: ¥62.383099
查看所有的价格

-

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

68

微芯片技术

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

HVQCCN

AGLN020V2-QNG68

有

70 °C

1.14 V

未说明

1.2 V

-20 °C

1.2, 1.5 V

1.14 V

1.575 V

49

Tray

AGLN020

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

5.59

1.575 V

-20 to 70 °C

IGLOO nano

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N68

不合格

OTHER

520 CLBS, 20000 GATES

1 mm

现场可编程门阵列

520

20000

STD

520

20000

8 mm

8 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

1.2 V

40

1.14 V

85 °C

有

A3PE3000L-FGG896I

250 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.29

1.2000 V

1.14 V

1.26 V

620

Compliant

Tray

A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

-40 to 85 °C

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.2 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3e+06

781.25 MHz

STD

75264

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

2812 In Stock

• 1: ¥2,955.095123
• 10: ¥2,787.825587
• 100: ¥2,630.024135
• 500: ¥2,481.154852
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

2.75 V

2.25 V

2.5000 V

203

Tray

A54SX32

活跃

-40 to 85 °C

SX-A

2.25V ~ 5.25V

48000

2880

STD

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-UCSP (4x4)

81

微芯片技术

Obsolete

MICROSEMI CORP

1.575 V

5.31

Miscellaneous

66

Tray

AGLN030

Obsolete

4 X 4 MM, 0.80 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, UCSP-81

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

1.425 V

85 °C

有

AGLN030V5-ZUCG81I

VFBGA

SQUARE

-40°C ~ 100°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.4 mm

compliant

S-PBGA-B81

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

0.8 mm

现场可编程门阵列

768

30000

768

30000

4 mm

4 mm

N/A

-

Polystyrene

132078

Brady

Safety Signs

Fall Hazard

Yellow

English

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

Aluminum

81

微芯片技术

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.8

None

P-Q7Q29-B3RX

Grace Technologies

60

Tray

AGLN125

Obsolete

5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-20 °C

1.2 V

未说明

1.14 V

70 °C

有

VFBGA

-20°C ~ 85°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

OTHER

3072 CLBS, 125000 GATES

0.8 mm

现场可编程门阵列

3072

36864

125000

3072

125000

IP65

5 mm

5 mm

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

微芯片技术

Obsolete

MICROSEMI CORP

1.575 V

5.81

1SNA020043R2100

ABB

60

Tray

AGLN250

Obsolete

5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-20 °C

1.5 V

未说明

1.425 V

70 °C

有

VFBGA

SQUARE

-20°C ~ 85°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

OTHER

6144 CLBS, 250000 GATES

0.8 mm

现场可编程门阵列

6144

36864

250000

6144

250000

5 mm

5 mm

N/A

-

YES

313

BGA

SQUARE

活跃

MICROSEMI CORP

3.6 V

5.24

Cutler Hammer, Div of Eaton Corp

STS363NP3

BGA, BGA313,25X25,50

网格排列

3

PLASTIC/EPOXY

BGA313,25X25,50

-40 °C

3.3 V

30

3 V

85 °C

无

320 MHz

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B313

249

不合格

3.3,5 V

INDUSTRIAL

249

2880 CLBS, 32000 GATES

2.52 mm

现场可编程门阵列

0.7 ns

2880

2880

32000

35 mm

35 mm

N/A

-

T678A1445/U

CSA, UL

Honeywell

Remote Bulb

2 SPDT

N/A

-

Surface

24D10MST2-10AMP

Amperite

10

0.250 in Flat Blade

24 VDC

Interval

固态

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

微芯片技术

Obsolete

MICROSEMI CORP

1.575 V

5.81

Miscellaneous

60

Tray

AGLN250

Obsolete

5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

1.425 V

85 °C

有

AGLN250V5-ZCSG81I

VFBGA

SQUARE

-40°C ~ 100°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

0.8 mm

现场可编程门阵列

6144

36864

250000

6144

250000

5 mm

5 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

3.3 V

40

3 V

70 °C

有

A54SX32-1TQG144

280 MHz

LFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.24

3.3, 5 V

2.97, 4.75 V

3.63, 5.25 V

113

Tray

A54SX32

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

0 to 70 °C

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

3.3,5 V

COMMERCIAL

113

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1

0.8 ns

2880

2880

32000

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

729-BBGA

YES

729

729-PBGA (35x35)

729

微芯片技术

-40 °C

1.5 V

30

1.425 V

85 °C

无

AX1000-1BG729I

5.3

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

BGA

763 MHz

1.5000 V

1.425 V

1.575 V

516

Compliant

Tray

AX1000

活跃

BGA, BGA729,27X27,50

网格排列

3

PLASTIC/EPOXY

BGA729,27X27,50

-40 to 85 °C

Axcelerator

e0

锡铅

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1.27 mm

unknown

763 MHz

729

S-PBGA-B729

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.54 mm

现场可编程门阵列

12096

165888

1e+06

763 MHz

18144

12096

1

12096

0.84 ns

12096

18144

1000000

1.73 mm

35 mm

35 mm

无

N/A

-

微芯片技术

195

Tray

M2GL010

活跃

,

未说明

有

M2GL010TS-1VFG400T2

Microsemi Corporation

活跃

MICROSEMI CORP

5.82

-40°C ~ 125°C (TJ)

Automotive, AEC-Q100, IGLOO2

有

1.14V ~ 2.625V

未说明

compliant

现场可编程门阵列

12084

933888

1

2469 In Stock

• 1: ¥3,887.802172
• 10: ¥3,667.737900
• 100: ¥3,460.130093
• 500: ¥3,264.273672
查看所有的价格

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

BGA

M1AFS1500-FG676I

无

85 °C

1.425 V

30

1.5 V

-40 °C

PLASTIC/EPOXY

3

网格排列

BGA,

1.5000 V

1.425 V

1.575 V

252

Tray

M1AFS1500

活跃

5.3

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

-40 to 85 °C

Fusion®

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

不合格

INDUSTRIAL

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

25 mm

25 mm

N/A

-

表面贴装

YES

172

172

SQUARE

Actel Corporation

Transferred

ACTEL CORP

5.25 V

5.87

8542390000/8542390000/8542390000/8542390000/8542390000

140

Non-Compliant

CERAMIC, CQFP-172

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK172,2.5SQ,25

5 V

30

4.75 V

70 °C

无

A1280A-1CQ172C

60 MHz

QFF

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

MAX 140 I/OS

现场可编程门阵列

CMOS

QUAD

FLAT

225

0.635 mm

compliant

90 MHz

S-CQFP-F172

140

不合格

5 V

5 V

COMMERCIAL

5.25 V

4.75 V

4.3 ns

140

1232 CLBS, 8000 GATES

2.9464 mm

现场可编程门阵列

1232

8000

1232

1

998

4.3 ns

1232

1232

8000

29.972 mm

29.972 mm

无

989 In Stock

-

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

微芯片技术

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.19

LCC

72

Tray

A42MX09

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A42MX09-FPL84

70 MHz

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

COMMERCIAL

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

3.5 ns

684

14000

29.3116 mm

29.3116 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

MICROSEMI CORP

1.575 V

5.27

154

Compliant

Tray

M7A3P1000

Obsolete

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

1.425 V

85 °C

无

M7A3P1000-2PQ208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

-40°C ~ 100°C (TJ)

ProASIC3

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1e+06

310 MHz

2

24576

24576

1000000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

115

Tray

AX500

Obsolete

0°C ~ 70°C (TA)

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.7 V

5.3

158

Compliant

Tray

APA1000

Obsolete

0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

30

2.3 V

70 °C

无

APA1000-PQ208

180 MHz

0°C ~ 70°C (TA)

ProASICPLUS

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

180 MHz

S-PQFP-G208

158

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

2.7 V

2.3 V

24.8 kB

158

1000000 GATES

4.1 mm

现场可编程门阵列

202752

1e+06

180 MHz

56320

56320

1000000

3.4 mm

28 mm

28 mm

无

35 In Stock

• 1: ¥154.371671
• 10: ¥145.633652
• 100: ¥137.390236
• 500: ¥129.613433
查看所有的价格

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

1.425 V

85 °C

有

AGL125V5-VQG100

108 MHz

TFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.58

1.575 V

1.425 V

1.5000 V

71

Tray

AGL125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

未说明

0 to 70 °C

IGLOO

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

14 mm

14 mm

N/A

-

表面贴装

676-BGA

676-FBGA (27x27)

微芯片技术

1.575 V

1.425 V

1.5000 V

336

Tray

AX500

活跃

-40 to 85 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

STD

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

1.425 V

85 °C

有

M1A3PE3000-2PQG208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.6

1.5000 V

147

Tray

M1A3PE3000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

40

-40 to 85 °C

ProASIC3E

e3

Matte Tin (Sn)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

2

75264

75264

3000000

28 mm

28 mm

600 In Stock

• 1: ¥642.070181
• 10: ¥605.726584
• 100: ¥571.440173
• 500: ¥539.094507
查看所有的价格

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

1.425 V

1.575 V

154

Tray

A3P1000

活跃

有

11000 LE

147456 bit

+ 85 C

微芯片技术

1.575 V

2 oz

0 C

24

1.425 V

SMD/SMT

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P1000-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

0.74

1.5000 V

0 to 70 °C

Tray

ProASIC3

e3

3A991.D

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

8 mA

-

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

147456

1000000

STD

-

24576

1000000

FPGA - Field Programmable Gate Array

3.4 mm

28 mm

28 mm

N/A

-