品牌是'Microchip' (5152)
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![]() | A42MX09-VQG100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 83 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 有 | 微芯片技术 | 90 | Actel | 0.642332 oz | 3 V | 5.5 V | 5.5 V | Tray | A42MX09 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX09-VQG100I | 117 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.51 | Details | 336 LE | -40°C ~ 85°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | - | 684 CLBS, 14000 GATES | 1.2 mm | 现场可编程门阵列 | 14000 | STD | - | 2.5 ns | 684 | 14000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||
![]() | AGL600V5-FG144I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 144-FPBGA (13x13) | 144 | 97 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 892.86 MHz | 微芯片技术 | 有 | 160 | IGLOOe | 0.014110 oz | 1.5000 V | Tray | AGL600 | 活跃 | 1.575 V | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | AGL600V5-FG144I | 108 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | This product may require additional documentation to export from the United States. | N | -40 to 85 °C | Tray | AGL600V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | 不合格 | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.55 mm | 现场可编程门阵列 | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||
![]() | A42MX24-2PLG84I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | PLCC-84 | YES | 84 | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | 微芯片技术 | 0.239083 oz | Tray | A42MX24 | 活跃 | 5.5 V | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX24-2PLG84I | 114.75 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Details | 72 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 有 | 16 | Actel | -40°C ~ 85°C (TA) | Tube | A42MX24 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | INDUSTRIAL | 1890 CLBS, 36000 GATES | 4.572 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 2 | 1410 | 1.8 ns | 1890 | 5.5 V | 3 V | 36000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | ||||||||||||||||||||||||||||
![]() | M7A3P1000-2FGG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | 微芯片技术 | M7A3P1000 | 活跃 | This product may require additional documentation to export from the United States. | Details | 300 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 310 MHz | 有 | 60 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | -40 to 85 °C | Tray | M7A3P1000 | 85 °C | -40 °C | 1.5 V | 310 MHz | 18 kB | 147456 | 1000000 | 310 MHz | 2 | 24576 | 1.575 V | 1.425 V | 1.73 mm | 23 mm | 23 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-PQG100A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | + 125 C | SMD/SMT | 120 MHz | 有 | 微芯片技术 | 66 | Actel | 0.062040 oz | 5.25 V | Tray | A40MX02 | 活跃 | QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 40 | 125 °C | 有 | A40MX02-PQG100A | 116 MHz | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 5.59 | Details | 57 I/O | 4.75 V | - 40 C | -40°C ~ 125°C (TA) | Tray | A40MX02 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5.0V SUPPLY | 8542.39.00.01 | CMOS | 5 V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | AUTOMOTIVE | 295 CLBS, 3000 GATES | 3.4 mm | 现场可编程门阵列 | 3000 | STD | 2.2 ns | 295 | 3000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-2PLG84 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | PLCC-84 | YES | 84 | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | 微芯片技术 | Tray | A42MX24 | 活跃 | 5.25 V | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX24-2PLG84 | 105 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Details | 72 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 有 | 16 | Actel | 0.239083 oz | 0°C ~ 70°C (TA) | Tube | A42MX24 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | COMMERCIAL | 1890 CLBS, 36000 GATES | 4.572 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 2 | 1410 | 1.8 ns | 1890 | 5.25 V | 3 V | 36000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | |||||||||||||||||||||||||||||
![]() | A3P060-1VQ100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP | YES | 100-VQFP (14x14) | 100 | 1.425 V | - 40 C | + 85 C | SMD/SMT | 272 MHz | 有 | 微芯片技术 | 90 | ProASIC3 | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3P060 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | A3P060-1VQ100I | 350 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.23 | N | 71 I/O | -40 to 85 °C | Tray | A3P060 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.5 V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | 18432 | 60000 | 1 | 1536 | 60000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1BGG329I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-329 | 329-PBGA (31x31) | 微芯片技术 | 2.75 V | Details | 249 I/O | 2.25 V | - 40 C | + 85 C | SMD/SMT | 278 MHz | 有 | 27 | Actel | 2.5000 V | 2.25 V | 2.75 V | Tray | A54SX32 | 活跃 | -40 to 85 °C | Tray | A54SX32A | 2.5 V | 48000 | 2880 | 1 | 1.8 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000-2FGG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 484-FPBGA (23x23) | 484 | Details | 11000 LE | 300 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 微芯片技术 | 310 MHz | 有 | 60 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.575 V | Tray | A3P1000 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 有 | A3P1000-2FGG484I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.23 | This product may require additional documentation to export from the United States. | -40 to 85 °C | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 不合格 | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-BGG329M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-329 | 329-PBGA (31x31) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 249 I/O | 2.25 V | - 55 C | + 125 C | SMD/SMT | 238 MHz | 有 | 27 | Actel | Tray | A54SX32 | 活跃 | 2.75 V | -55°C ~ 125°C (TC) | Tray | A54SX32A | 2.5 V | 48000 | 2880 | 1.8 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-2VQG100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | - 40 C | + 85 C | SMD/SMT | 有 | 微芯片技术 | 90 | Actel | 1 oz | 5.5 V | Tray | A42MX09 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX09-2VQG100I | 146 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.58 | Details | 336 LE | 83 I/O | 3 V | -40°C ~ 85°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | - | 684 CLBS, 14000 GATES | 1.2 mm | 现场可编程门阵列 | 14000 | 2 | - | 1.8 ns | 684 | 14000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-CQ84 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-84 | 84-CQFP (42x42) | 微芯片技术 | N | 62 I/O | 2.25 V | 0 C | + 70 C | SMD/SMT | 238 MHz | 有 | 9 | Actel | Tray | A54SX32 | 活跃 | 2.75 V | 0°C ~ 70°C (TA) | A54SX32A | 2.5 V | 48000 | 2880 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-2PQG100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | SMD/SMT | 215 MHz | 有 | 微芯片技术 | 66 | Actel | 0.062040 oz | 5.25 V | Tray | A42MX16 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-2PQG100 | 117 MHz | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 5.3 | Details | 83 I/O | 3 V | 0 C | + 70 C | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 3.4 mm | 现场可编程门阵列 | 24000 | 2.1 ns | 1232 | 24000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | APA450-FGG484A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 微芯片技术 | 0.014110 oz | 2.625 V | Tray | APA450 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 有 | APA450-FGG484A | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.61 | This product may require additional documentation to export from the United States. | Details | 344 I/O | 2.375 V | - 40 C | + 125 C | SMD/SMT | 180 MHz | 有 | 60 | Actel | -40°C ~ 125°C (TJ) | Tray | APA450 | 125 °C | -40 °C | 8542.39.00.01 | CMOS | 2.5 V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 344 | 不合格 | 2.5,2.5/3.3 V | 13.5 kB | 344 | 现场可编程门阵列 | 110592 | 450000 | 180 MHz | STD | 12288 | 12288 | 2.625 V | 2.375 V | 1.73 mm | 23 mm | 23 mm | 无 | |||||||||||||||||||||||||||||||||||
![]() | A3PE1500-FG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | Lead, Tin | 表面贴装 | 表面贴装 | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | SMD/SMT | 350 MHz | 有 | 微芯片技术 | 60 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3PE1500 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.5 V | 30 | 85 °C | 无 | A3PE1500-FG484I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | N | 280 I/O | 1.425 V | - 40 C | + 85 C | -40 to 85 °C | Tray | A3PE1500 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425 V to 1.575 V | BOTTOM | BALL | 225 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 280 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 33.8 kB | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | 现场可编程门阵列 | 276480 | 1500000 | 231 MHz | STD | 38400 | 38400 | 38400 | 1.575 V | 1.425 V | 1500000 | 1.73 mm | 23 mm | 23 mm | 无 | 含铅 | ||||||||||||||||
![]() | A3P600-1FGG144 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 144-FPBGA (13x13) | 144 | Details | 97 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 272 MHz | 微芯片技术 | 有 | 160 | ProASIC3 | 0.014110 oz | 1.575 V | 1.425 V | 1.5000 V | Tray | A3P600 | 活跃 | 1.575 V | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P600-1FGG144 | 350 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | 0 to 70 °C | Tray | A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | COMMERCIAL | 13824 CLBS, 600000 GATES | 1.55 mm | 现场可编程门阵列 | 110592 | 600000 | 1 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||
![]() | A40MX02-3PLG68I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | + 85 C | SMD/SMT | 188 MHz | 有 | 微芯片技术 | 19 | Actel | 0.171777 oz | 5.5 V | Tray | A40MX02 | 活跃 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A40MX02-3PLG68I | 109 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Details | 57 I/O | 3 V | - 40 C | -40°C ~ 85°C (TA) | Tube | A40MX02 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | 不合格 | INDUSTRIAL | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 1.7 ns | 295 | 3000 | 3.68 mm | 24.23 mm | 24.23 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | AX250-PQG208M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | 115 I/O | 1.425 V | - 55 C | + 125 C | SMD/SMT | 649 MHz | 微芯片技术 | 有 | 24 | Actel | 1.575 V | Tray | AX250 | 活跃 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -55 °C | 1.5 V | 40 | 125 °C | 有 | AX250-PQG208M | 649 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.6 | Military grade | This product may require additional documentation to export from the United States. | Details | -55°C ~ 125°C (TA) | Tray | AX250 | e3 | 3A001.A.2.C | Matte Tin (Sn) | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.5 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 248 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 248 | 2816 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 0.99 ns | 2816 | 4224 | 250000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||
![]() | A40MX04-FPLG84 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PLCC-84 | YES | 84-PLCC (29.31x29.31) | 84 | 3 V | 0 C | + 70 C | SMD/SMT | 83 MHz | 微芯片技术 | 有 | - | 16 | Actel | 0.239083 oz | 5.25 V | Tray | A40MX04 | 活跃 | ROHS COMPLIANT, PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 未说明 | 70 °C | 有 | A40MX04-FPLG84 | 48 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Details | 547 LE | 69 I/O | 0°C ~ 70°C (TA) | Tube | A40MX04 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | J BEND | 未说明 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | COMMERCIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 3.7 ns | 547 | 6000 | 3.68 mm | 29.31 mm | 29.31 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-PQG208M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | Actel | 5.5 V | Tray | A42MX24 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 40 | 125 °C | 有 | A42MX24-PQG208M | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | This product may require additional documentation to export from the United States. | Details | 176 I/O | 3 V | - 55 C | + 125 C | SMD/SMT | 有 | 24 | -55°C ~ 125°C (TC) | Tray | A42MX24 | e3 | 3A001.A.2.C | Matte Tin (Sn) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | MILITARY | 1890 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 5.5 V | 3 V | 36000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||
![]() | A40MX04-PQG100M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | 3 V | - 55 C | + 125 C | SMD/SMT | 139 MHz | 微芯片技术 | 有 | 66 | Actel | 0.062040 oz | 5.5 V | Tray | A40MX04 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 40 | 125 °C | 有 | A40MX04-PQG100M | 80 MHz | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 5.29 | This product may require additional documentation to export from the United States. | Details | 69 I/O | -55°C ~ 125°C (TC) | Tray | A40MX04 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | MILITARY | 547 CLBS, 6000 GATES | 3.4 mm | 现场可编程门阵列 | 6000 | 2.7 ns | 547 | 6000 | 2.7 mm | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
![]() | A3P1000-2PQG208I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | Details | 11000 LE | 154 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 微芯片技术 | 310 MHz | 有 | - | 24 | 147456 bit | ProASIC3 | 1.575 V | Tray | A3P1000 | 活跃 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P1000-2PQG208I | 350 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | A3P1000 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.5 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 75 mA | 24576 CLBS, 1000000 GATES | 4.1 mm | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1000000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||
![]() | A42MX16-FTQG176 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | 103 MHz | 有 | 微芯片技术 | 40 | Actel | 5.25 V | Tray | A42MX16 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-FTQG176 | 56 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | Details | 140 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3.3 V, 5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 4 ns | 1232 | 24000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | A3P125-1FG144 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 144-FPBGA (13x13) | 144 | 1.425 V | 0 C | + 70 C | SMD/SMT | 272 MHz | 有 | 微芯片技术 | 160 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3P125 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | A3P125-1FG144 | 350 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.23 | N | 97 I/O | 0 to 70 °C | Tray | A3P125 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 不合格 | COMMERCIAL | 3072 CLBS, 125000 GATES | 1.55 mm | 现场可编程门阵列 | 36864 | 125000 | 1 | 3072 | 125000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||
![]() | A3P125-2VQ100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP | YES | 100-VQFP (14x14) | 100 | + 70 C | SMD/SMT | 310 MHz | 有 | 微芯片技术 | 90 | ProASIC3 | 1.425 V | 1.575 V | 1.575 V | Tray | A3P125 | 活跃 | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | A3P125-2VQ100 | 350 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | N | 71 I/O | 1.425 V | 0 C | 0°C ~ 85°C (TJ) | Tray | A3P125 | e0 | 锡铅 | 8542.39.00.01 | CMOS | 1.5 V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | COMMERCIAL | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 36864 | 125000 | 2 | 3072 | 125000 | 1 mm | 14 mm | 14 mm |
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