对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

触点镀层

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

JESD-30代码

输出的数量

资历状况

电源

温度等级

内存大小

电流源

数据率

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

筛选水平

逻辑块数(LABs)

速度等级

收发器数量

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

电压 - 供电 (最大值)

电压 - 供电 (最小值)

等效门数

高度

长度

宽度

辐射硬化

无铅

A42MX09-VQG100I
A42MX09-VQG100I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

90

Actel

0.642332 oz

3 V

5.5 V

5.5 V

Tray

A42MX09

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A42MX09-VQG100I

117 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.51

Details

336 LE

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

-

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

STD

-

2.5 ns

684

14000

1 mm

14 mm

14 mm

AGL600V5-FG144I
AGL600V5-FG144I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

160

IGLOOe

0.014110 oz

1.5000 V

Tray

AGL600

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

AGL600V5-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

AGL600V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

A42MX24-2PLG84I
A42MX24-2PLG84I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

0.239083 oz

Tray

A42MX24

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A42MX24-2PLG84I

114.75 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

16

Actel

-40°C ~ 85°C (TA)

Tube

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

5.5 V

3 V

36000

3.68 mm

29.31 mm

29.31 mm

M7A3P1000-2FGG484I
M7A3P1000-2FGG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.5 V

310 MHz

18 kB

147456

1000000

310 MHz

2

24576

1.575 V

1.425 V

1.73 mm

23 mm

23 mm

A40MX02-PQG100A
A40MX02-PQG100A
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

+ 125 C

SMD/SMT

120 MHz

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A40MX02

活跃

QFP-100

FLATPACK

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

A40MX02-PQG100A

116 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.59

Details

57 I/O

4.75 V

- 40 C

-40°C ~ 125°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

AUTOMOTIVE

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

STD

2.2 ns

295

3000

2.7 mm

20 mm

14 mm

A42MX24-2PLG84
A42MX24-2PLG84
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

Tray

A42MX24

活跃

5.25 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX24-2PLG84

105 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

16

Actel

0.239083 oz

0°C ~ 70°C (TA)

Tube

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

5.25 V

3 V

36000

3.68 mm

29.31 mm

29.31 mm

A3P060-1VQ100I
A3P060-1VQ100I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

A3P060-1VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

N

71 I/O

-40 to 85 °C

Tray

A3P060

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

1

1536

60000

1 mm

14 mm

14 mm

A54SX32A-1BGG329I
A54SX32A-1BGG329I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-329

329-PBGA (31x31)

微芯片技术

2.75 V

Details

249 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

278 MHz

27

Actel

2.5000 V

2.25 V

2.75 V

Tray

A54SX32

活跃

-40 to 85 °C

Tray

A54SX32A

2.5 V

48000

2880

1

1.8 mm

31 mm

31 mm

A3P1000-2FGG484I
A3P1000-2FGG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

Details

11000 LE

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

310 MHz

60

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

A3P1000-2FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

23 mm

23 mm

A54SX32A-BGG329M
A54SX32A-BGG329M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-329

329-PBGA (31x31)

微芯片技术

This product may require additional documentation to export from the United States.

Details

249 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

238 MHz

27

Actel

Tray

A54SX32

活跃

2.75 V

-55°C ~ 125°C (TC)

Tray

A54SX32A

2.5 V

48000

2880

1.8 mm

31 mm

31 mm

A42MX09-2VQG100I
A42MX09-2VQG100I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

- 40 C

+ 85 C

SMD/SMT

微芯片技术

90

Actel

1 oz

5.5 V

Tray

A42MX09

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A42MX09-2VQG100I

146 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.58

Details

336 LE

83 I/O

3 V

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

-

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

2

-

1.8 ns

684

14000

1 mm

14 mm

14 mm

A54SX32A-CQ84
A54SX32A-CQ84
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

CQFP-84

84-CQFP (42x42)

微芯片技术

N

62 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

238 MHz

9

Actel

Tray

A54SX32

活跃

2.75 V

0°C ~ 70°C (TA)

A54SX32A

2.5 V

48000

2880

A42MX16-2PQG100
A42MX16-2PQG100
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

SMD/SMT

215 MHz

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX16-2PQG100

117 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

83 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

2.1 ns

1232

24000

2.7 mm

20 mm

14 mm

APA450-FGG484A
APA450-FGG484A
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

0.014110 oz

2.625 V

Tray

APA450

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

APA450-FGG484A

BGA

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

Details

344 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

60

Actel

-40°C ~ 125°C (TJ)

Tray

APA450

125 °C

-40 °C

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B484

344

不合格

2.5,2.5/3.3 V

13.5 kB

344

现场可编程门阵列

110592

450000

180 MHz

STD

12288

12288

2.625 V

2.375 V

1.73 mm

23 mm

23 mm

A3PE1500-FG484I
A3PE1500-FG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

Lead, Tin

表面贴装

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

350 MHz

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE1500

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

A3PE1500-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

N

280 I/O

1.425 V

- 40 C

+ 85 C

-40 to 85 °C

Tray

A3PE1500

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425 V to 1.575 V

BOTTOM

BALL

225

1 mm

compliant

231 MHz

S-PBGA-B484

280

不合格

1.5/3.3 V

INDUSTRIAL

33.8 kB

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

231 MHz

STD

38400

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

含铅

A3P600-1FGG144
A3P600-1FGG144
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

160

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

Tray

A3P600

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

A3P600-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.05 mm

13 mm

13 mm

A40MX02-3PLG68I
A40MX02-3PLG68I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

+ 85 C

SMD/SMT

188 MHz

微芯片技术

19

Actel

0.171777 oz

5.5 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A40MX02-3PLG68I

109 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

1.7 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

AX250-PQG208M
AX250-PQG208M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

115 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

微芯片技术

24

Actel

1.575 V

Tray

AX250

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

1.5 V

40

125 °C

AX250-PQG208M

649 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.6

Military grade

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TA)

Tray

AX250

e3

3A001.A.2.C

Matte Tin (Sn)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

248

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

248

2816 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

55296

250000

4224

MIL-STD-883 Class B

0.99 ns

2816

4224

250000

3.4 mm

28 mm

28 mm

A40MX04-FPLG84
A40MX04-FPLG84
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

3 V

0 C

+ 70 C

SMD/SMT

83 MHz

微芯片技术

-

16

Actel

0.239083 oz

5.25 V

Tray

A40MX04

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

未说明

70 °C

A40MX04-FPLG84

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.24

Details

547 LE

69 I/O

0°C ~ 70°C (TA)

Tube

A40MX04

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

未说明

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

3.7 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

A42MX24-PQG208M
A42MX24-PQG208M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Actel

5.5 V

Tray

A42MX24

活跃

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

A42MX24-PQG208M

FQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

176 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

24

-55°C ~ 125°C (TC)

Tray

A42MX24

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

MILITARY

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

1410

2.5 ns

1890

5.5 V

3 V

36000

3.4 mm

28 mm

28 mm

A40MX04-PQG100M
A40MX04-PQG100M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

3 V

- 55 C

+ 125 C

SMD/SMT

139 MHz

微芯片技术

66

Actel

0.062040 oz

5.5 V

Tray

A40MX04

活跃

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

A40MX04-PQG100M

80 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

69 I/O

-55°C ~ 125°C (TC)

Tray

A40MX04

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

MILITARY

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

2.7 ns

547

6000

2.7 mm

20 mm

14 mm

A3P1000-2PQG208I
A3P1000-2PQG208I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Details

11000 LE

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

310 MHz

-

24

147456 bit

ProASIC3

1.575 V

Tray

A3P1000

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

A3P1000-2PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

A3P1000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

75 mA

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

3.4 mm

28 mm

28 mm

A42MX16-FTQG176
A42MX16-FTQG176
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

103 MHz

微芯片技术

40

Actel

5.25 V

Tray

A42MX16

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX16-FTQG176

56 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

140 I/O

3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

4 ns

1232

24000

1.4 mm

24 mm

24 mm

A3P125-1FG144
A3P125-1FG144
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

A3P125-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

N

97 I/O

0 to 70 °C

Tray

A3P125

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

1

3072

125000

1.05 mm

13 mm

13 mm

A3P125-2VQ100
A3P125-2VQ100
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 70 C

SMD/SMT

310 MHz

微芯片技术

90

ProASIC3

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

A3P125-2VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

71 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

A3P125

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

2

3072

125000

1 mm

14 mm

14 mm