N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P250-VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

90

ProASIC3

1.5000 V

-40 to 85 °C

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

2.625 V

Tray

APA300

活跃

This product may require additional documentation to export from the United States.

N

100 I/O

-40°C ~ 125°C (TJ)

Tray

APA300

2.375V ~ 2.625V

2.5 V

73728

300000

STD

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

ProASIC3

0.014110 oz

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P060-2FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

96 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

160

-40 to 85 °C

Tray

A3P060

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

2

1536

60000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

0.014110 oz

1.575 V

Tray

A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P1000-2FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

11000 LE

97 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

160

ProASIC3

-40°C ~ 100°C (TJ)

Tray

A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

-

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

2

-

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

0.014110 oz

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P125-2FG144

350 MHz

LBGA

5.24

MICROSEMI CORP

活跃

SQUARE

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

160

ProASIC3

0 to 70 °C

Tray

A3P125

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

2

3072

125000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

This product may require additional documentation to export from the United States.

N

119 I/O

0°C ~ 85°C (TJ)

Tray

M1AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

1

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

Tray

A54SX72

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

70 °C

无

A54SX72A-FFG256

156 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

203 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

156 MHz

有

90

Actel

0.014110 oz

2.75 V

0°C ~ 70°C (TA)

Tray

A54SX72A

e0

TIN LEAD/TIN LEAD SILVER

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

2 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

0.239083 oz

5.5 V

Tray

A42MX16

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX16-1PLG84M

108 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

72 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

198 MHz

有

16

Actel

-55°C ~ 125°C (TC)

Tube

A42MX16

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

MILITARY

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

160

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P250

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P250-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

0 to 70 °C

Tray

A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

A54SX32

活跃

2.75 V

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

有

A54SX32A-FTQG100

172 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

Details

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

172 MHz

有

90

Actel

0.023175 oz

Tray

0°C ~ 70°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

81

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.7 ns

2880

2880

48000

1.4 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PE1500-1FG676I

BGA

SQUARE

活跃

MICROSEMI CORP

1.77

272 MHz

有

40

ProASIC3

0.014110 oz

SMD/SMT

+ 85 C

- 40 C

1.425 V

444 I/O

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

A3PE1500

活跃

-40°C ~ 100°C (TJ)

Tray

A3PE1500

e0

锡铅

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

1500000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

1.575 V

1.575 V

Tray

A3PE1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

A3PE1500-1FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

0 to 70 °C

Tray

A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

1500000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

ProASIC3

0.014110 oz

Tray

A3P1000

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P1000-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

11000 LE

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

0°C ~ 85°C (TJ)

Tray

A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

A3PN250

活跃

1.575 V

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN250-2VQ100

TFQFP

SQUARE

活跃

FPGA - Field Programmable Gate Array ProASIC3

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

68 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

350 MHz

有

90

ProASIC3 nano

Tray

-20°C ~ 85°C (TJ)

Tray

A3PN250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

1.575 V

Tray

AGL600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

AGL600V5-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

7000 LE

97 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

892.86 MHz

有

160

IGLOOe

0.014110 oz

0°C ~ 70°C (TA)

Tray

AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

OTHER

-

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

-

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP

YES

100

100-VQFP (14x14)

100

微芯片技术

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

M1AGL250V2-VQ100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

3000 LE

68 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

有

90

IGLOOe

1.575 V

Tray

M1AGL250

活跃

-40°C ~ 85°C (TA)

Tray

M1AGL250V2

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.2 V to 1.5 V

INDUSTRIAL

1.575 V

1.14 V

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

有

-

微芯片技术

24

36864 bit

ProASIC3

1.5000 V

1.575 V

Tray

A3P250

活跃

5.24

MICROSEMI CORP

活跃

SQUARE

FQFP

350 MHz

A3P250-1PQG208

有

85 °C

40

1.5 V

PLASTIC/EPOXY

3

FLATPACK, FINE PITCH

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

This product may require additional documentation to export from the United States.

Details

3000 LE

151 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

0 to 70 °C

Tray

A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

3 mA

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

36864

250000

1

6144

250000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

526.32 MHz, 892.86 MHz

有

90

微芯片技术

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

40

85 °C

有

AGL1000V2-FGG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.41

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

AGL1000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.2 V to 1.5 V

OTHER

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

VTQFP-128

YES

128-VTQFP (14x14)

128

90

IGLOO PLUS

0.356852 oz

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGLP030

活跃

TFQFP, TQFP128,.63SQ,16

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP128,.63SQ,16

-40 °C

1.5 V

未说明

85 °C

有

AGLP030V5-VQG128I

250 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

330 LE

101 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

有

-40 to 85 °C

Tray

AGLP030V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.4 mm

compliant

S-PQFP-G128

101

不合格

1.5 V

1.5 V

INDUSTRIAL

-

101

792 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

792

30000

STD

-

792

792

30000

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 85 C

SMD/SMT

892.86 MHz

有

90

IGLOOe

VQFP

微芯片技术

1.5000 V

1.425 V

60000

71

60000

1.575 V

表面贴装

1.575 V

Tray

AGL060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

AGL060V5-VQ100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.28

Industrial grade

N

71 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

AGL060V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

100

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1536

18432

60000

Industrial

STD

1536

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P125-1VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

N

71 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

1.5000 V

0 to 70 °C

Tray

A3P125

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

1

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN060-2VQ100

TFQFP

SQUARE

活跃

FPGA - Field Programmable Gate Array ProASIC3

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

350 MHz

有

90

ProASIC3 nano

1.575 V

Tray

A3PN060

-20°C ~ 85°C (TJ)

Tray

A3PN060

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

2

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

AGL030

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AGL030V5-VQ100

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

330 LE

77 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

90

IGLOOe

1.575 V

Tray

0°C ~ 70°C (TA)

Tray

AGL030V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.5 V

OTHER

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

STD

768

30000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

896

微芯片技术

有

M2GL050T-1FGG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

1.57

BGA

This product may require additional documentation to export from the United States.

Details

有

27

IGLOO2

1.2000 V

377

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

1.14 V

-40 to 100 °C

Tray

M2GL050T

e1

有

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

377

不合格

1.2 V

1.2 V

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

1

56340

31 mm

31 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

Tray

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL090TS-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

IGLOO2

60

1.2 V

活跃

M2GL090

-40°C ~ 100°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

267

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

23 mm

23 mm