N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

3.3 V

40

85 °C

有

A42MX24-1PLG84I

105.57 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

16

Actel

0.239083 oz

Tray

A42MX24

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

-40°C ~ 85°C (TA)

Tube

A42MX24

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

36000

2.1 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

微芯片技术

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX02-1PLG68M

92 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

57 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

160 MHz

有

19

Actel

0.171777 oz

Tray

A40MX02

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, LCC-68

CHIP CARRIER

3

-55°C ~ 125°C (TC)

Tube

A40MX02

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

MILITARY

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

微芯片技术

3.3 V

40

85 °C

有

A42MX09-2PQG160I

146 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

101 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

269 MHz

有

24

Actel

0.196363 oz

5.5 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

-40 °C

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

1.8 ns

684

14000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

微芯片技术

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

AGL125V5-VQ100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

N

1500 LE

71 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

90

IGLOOe

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

AGL125

-40 to 85 °C

Tray

AGL125V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P125-2VQG100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

71 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

TFQFP,

-40 to 85 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

2

3072

125000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

40

85 °C

有

A3PE600-1FGG256I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

165 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3PE600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

-40 to 85 °C

Tray

A3PE600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

1.575 V

1.425 V

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P060-2VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.53

N

71 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

A3P060

活跃

1.575 V

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

-40 to 85 °C

Tray

A3P060

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

2

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

0.014110 oz

1.575 V

1.425 V

1.5000 V

Tray

M7A3P1000

活跃

1.575 V

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0 to 70 °C

Tray

M7A3P1000

70 °C

0 °C

1.5 V

18 kB

147456

1000000

272 MHz

1

24576

1.575 V

1.425 V

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PE3000-1FG896I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

-40 to 85 °C

Tray

A3PE3000

e0

锡铅

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

不合格

INDUSTRIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P1000-PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

154 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

24

ProASIC3

0.225753 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3P1000

-40 to 85 °C

Tray

M1A3P1000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

28 mm

28 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

Details

186 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.625 V

Tray

APA450

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 125°C (TJ)

Tray

APA450

125 °C

-40 °C

2.5 V

13.5 kB

110592

450000

180 MHz

STD

12288

2.625 V

2.375 V

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

M7A3P1000-2PQG208

350 MHz

FQFP

SQUARE

不推荐

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

24

ProASIC3

Tray

M7A3P1000

活跃

1.575 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

0°C ~ 85°C (TJ)

Tray

M7A3P1000

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

18 kB

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1.575 V

1.425 V

1000000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

活跃

1.575 V

Details

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

Tray

M7AFS600

0°C ~ 70°C (TA)

Tray

M7AFS600

1.5 V

110592

600000

STD

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

通孔

通孔

CCGA-624

624

624-CCGA (32.5x32.5)

微芯片技术

This product may require additional documentation to export from the United States.

N

440 I/O

SMD/SMT

150 MHz

有

1

Actel

Tray

APA600

活跃

-55°C ~ 125°C (TJ)

APA600

125 °C

-55 °C

2.5 V

15.8 kB

5 mA

129024

600000

150 MHz

21504

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

Details

186 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

0.014110 oz

Actel

90

2.625 V

Tray

APA600

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

有

APA600-FGG256A

-40°C ~ 125°C (TJ)

Tray

APA600

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B256

186

不合格

2.5,2.5/3.3 V

186

现场可编程门阵列

129024

600000

STD

21504

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

活跃

MICROSEMI CORP

5.61

Actel

24

有

180 MHz

SMD/SMT

+ 125 C

- 40 C

2.375 V

158 I/O

Details

This product may require additional documentation to export from the United States.

Tray

APA150

活跃

2.625 V

QFP, QFP208,1.2SQ,20

FLATPACK

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

有

APA150-PQG208A

QFP

SQUARE

-40°C ~ 125°C (TJ)

Tray

APA150

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

158

现场可编程门阵列

36864

150000

STD

6144

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA-144

YES

144

144-FPBGA (13x13)

144

N

3000 LE

97 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

892.86 MHz

有

160

IGLOOe

0.014110 oz

微芯片技术

1.5000 V

1.425 V

1.575 V

IGLOO

85C

INDUSTRIALC

FBGA

250000

-40C to 85C

97

250000

130NM

1.575(V)

1.5(V)

无

1.425(V)

-40C

有

6144

表面贴装

1.575 V

Tray

AGL250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

AGL250V5-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

AGL250V5

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

INDUSTRIAL

-

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P1000-FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

-55 °C

1.5 V

40

125 °C

有

AX1000-FGG484M

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

Details

317 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55°C ~ 125°C (TA)

Tray

AX1000

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B484

516

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

MIL-STD-883 Class B

12096

12096

0.99 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P600-2PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

0 to 70 °C

Tray

A3P600

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

13.5 kB

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

310 MHz

2

13824

13824

1.575 V

1.425 V

600000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

Tray

AGL250

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AGL250V5-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

有

892.86 MHz

SMD/SMT

+ 70 C

0 C

1.425 V

97 I/O

3000 LE

N

This product may require additional documentation to export from the United States.

160

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

0 to 70 °C

Tray

AGL250V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

OTHER

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PE600-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

270 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

Tray

A3PE600

活跃

1.575 V

BGA,

网格排列

-40 to 85 °C

Tray

A3PE600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

1.575 V

Tray

AGL600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

AGL600V5-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

7000 LE

177 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

892.86 MHz

有

90

IGLOOe

0.014110 oz

1.5000 V

1.425 V

-40 to 85 °C

Tray

AGL600V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

INDUSTRIAL

-

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

-

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

活跃

1.575 V

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

Tray

M7A3P1000

0 to 70 °C

Tray

M7A3P1000

70 °C

0 °C

1.5 V

18 kB

147456

1000000

272 MHz

1

24576

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

125 °C

40

1.5 V

-55 °C

BGA896,30X30,40

PLASTIC/EPOXY

3

Military grade

This product may require additional documentation to export from the United States.

Details

516 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

有

27

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA896,30X30,40

网格排列

有

AX1000-1FGG896M

763 MHz

-55°C ~ 125°C (TA)

Tray

AX1000

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

763 MHz

S-PBGA-B896

516

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

MIL-STD-883 Class B

12096

1

12096

0.84 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

31 mm

31 mm

无