N/A

-

表面贴装

FCBGA-325

325-FCBGA (11x11)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

-40°C ~ 100°C (TJ)

Tray

M2GL090TS

1.2 V

86184

2648064

4 Transceiver

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

M2GL060-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

-40°C ~ 100°C (TJ)

Tray

M2GL060

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.51 mm

现场可编程门阵列

56520

1869824

17 mm

17 mm

N/A

-

表面贴装

FBGA-256

256-FPBGA (17x17)

微芯片技术

144 kbit

350 MHz

-

90

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

活跃

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.5 V

8 mA

700 Mb/s

147456

1000000

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

20

无

M2GL060-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.7

This product may require additional documentation to export from the United States.

N

56520 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

0.082541 oz

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL060

e0

Tin/Lead (Sn63Pb37)

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

2.44 mm

现场可编程门阵列

56520

1869824

STD

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

1.2 V

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

Tray

M2GL025

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL025T

1.2 V

27696

1130496

STD

2 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

Tray

M2GL025

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

有

M2GL025TS-1FGG484I

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

138 kB

267

2.44 mm

现场可编程门阵列

27696

1130496

1

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FBGA-484

484-FPBGA (23x23)

微芯片技术

144 kbit

350 MHz

-

60

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

活跃

This product may require additional documentation to export from the United States.

11000 LE

300 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.5 V

8 mA

700 Mb/s

147456

1000000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

MICROSEMI CORP

活跃

SQUARE

BGA

M2GL090-1FG676I

无

20

1.2 V

BGA676,26X26,40

PLASTIC/EPOXY

3

网格排列

27 X 27 MM, 1 MM PITCH, FBGA-676

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2000 V

1.14 V

1.26 V

Tray

M2GL090

活跃

1.2 V

5.27

-40 to 100 °C

Tray

M2GL090

e0

Tin/Lead (Sn/Pb)

100 °C

-40 °C

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

1

86316

27 mm

27 mm

含铅

N/A

-

表面贴装

FBGA-256

256-FBGA (17x17)

微芯片技术

144 kbit

350 MHz

-

90

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

活跃

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.5 V

8 mA

700 Mb/s

147456

1000000

1

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

Tray

M2GL005

活跃

This product may require additional documentation to export from the United States.

Details

6060 LE

209 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

-

60

703 kbit

IGLOO2

1.26 V

-40°C ~ 100°C (TJ)

Tray

M2GL005

100 °C

-40 °C

1.2 V

87.9 kB

87.9 kB

6060

719872

1

23 mm

23 mm

N/A

-

表面贴装

FPBGA-896

YES

896-FBGA (31x31)

896

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

85 °C

有

M2GL050-FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

56340 LE

377 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

-

27

1826 kbit

IGLOO2

1.2 V

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

0°C ~ 85°C (TJ)

Tray

M2GL050

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

VFBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

30

有

M2GL010-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.57

Details

12084 LE

195 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

0.034371 oz

1.26 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

667 Mb/s

195

1.51 mm

现场可编程门阵列

12084

933888

STD

4 Transceiver

12084

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

TQFP-144

YES

144

微芯片技术

有

M2GL005-TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.54

SMD/SMT

有

60

IGLOO2

0.578352 oz

Details

6060 LE

84 I/O

1.14 V

- 40 C

+ 100 C

1.26 V

Tray

M2GL005

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

-40°C ~ 100°C (TJ)

Tray

M2GL005

e3

Matte Tin (Sn)

8542.39.00.01

1.2 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

-

1.6 mm

现场可编程门阵列

6060

719872

STD

-

20 mm

20 mm

N/A

-

TQFP-144

微芯片技术

IGLOO2

1.26 V

Tray

M2GL010

活跃

This product may require additional documentation to export from the United States.

Details

12084 LE

84 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

60

-40°C ~ 100°C (TJ)

Tray

M2GL010S

1.2 V

-

12084

933888

-

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

56520 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

M2GL060T

1.2 V

56520

1869824

4 Transceiver

N/A

-

TQFP-144

微芯片技术

活跃

1.2 V

This product may require additional documentation to export from the United States.

Details

12084 LE

84 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

60

IGLOO2

Tray

M2GL010

0°C ~ 85°C (TJ)

Tray

M2GL010S

1.2 V

12084

933888

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

512 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

0°C ~ 100°C (TJ)

Tray

MPF300T

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

244 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

0°C ~ 100°C (TJ)

Tray

MPF300TL

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

Details

192000 LE

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

364

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

MPF200T

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

284 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

0°C ~ 100°C (TJ)

Tray

MPF300T

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

1.08 V

This product may require additional documentation to export from the United States.

Details

192000 LE

284 I/O

0.97 V

- 40 C

+ 100 C

SMD/SMT

有

1

PolarFire

Tray

MPF200

活跃

-40°C ~ 100°C (TJ)

Tray

MPF200T

1 V, 1.05 V

12.5 Gb/s

192000

13619200

4 Transceiver

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

20.6 Mbit

PolarFire

0.452847 oz

Tray

MPF300

活跃

1.08 V

This product may require additional documentation to export from the United States.

Details

300000 LE

284 I/O

0.97 V

- 40 C

+ 100 C

SMD/SMT

有

1

-40°C ~ 100°C (TJ)

Tray

MPF300T

1 V, 1.05 V

12.5 Gb/s

300000

21094400

4 Transceiver

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

有

1

PolarFire

1.03 V/1.08 V

388

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

MPF500TLS

1.05 V

481000

33792000

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

Details

192000 LE

244 I/O

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

0°C ~ 100°C (TJ)

Tray

MPF200T

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-784

784

784-FCBGA (29x29)

微芯片技术

无

0C

有

300000

表面贴装

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

388 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

POLARFIRE

100C

Commercial

FCBGA

0C to 100C

388

300000

28NM

0°C ~ 100°C (TJ)

Tray

MPF300T

1.05 V

12.7 Gb/s

300000

21094400