N/A

-

YES

624

CERAMIC, METAL-SEALED COFIRED

CGA

CGA624,25X25,50

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

活跃

MICROCHIP TECHNOLOGY INC

125 °C

-55 °C

9A515.E

125000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

UNSPECIFIED

1.27 mm

compliant

S-CBGA-X624

418

418

12096 CLBS, 1000000 GATES

5.41 mm

现场可编程门阵列

0.93 ns

12096

18144

1000000

300k Rad(Si) V

32.5 mm

32.5 mm

N/A

-

YES

624

CERAMIC, CGA-624

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

CGA

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

9A515.E

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

UNSPECIFIED

未说明

1.27 mm

compliant

未说明

S-CBGA-X624

不合格

MILITARY

21504 CLBS, 2000000 GATES

5.37 mm

现场可编程门阵列

0.95 ns

21504

2000000

32.5 mm

32.5 mm

N/A

-

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

125 °C

-55 °C

9A515.E

8542.39.00.01

1.27 mm

compliant

248

248

2816 CLBS, 250000 GATES

现场可编程门阵列

MIL-STD-883 Class B

0.93 ns

250000

32.5 mm

32.5 mm

N/A

-

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

125 °C

-55 °C

9A515.E

8542.39.00.01

1 mm

compliant

684

684

19712 CLBS, 2000000 GATES

现场可编程门阵列

MIL-STD-883 Class S (Modified)

1.1 ns

2000000

37.5 mm

37.5 mm

N/A

-

YES

256

CERAMIC, QFP-256

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK256,3SQ,20

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

e0

3A001.A.2.C

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F256

227

不合格

MILITARY

227

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535

1.2 ns

2880

2880

48000

36 mm

36 mm

N/A

-

NO

1152

CERAMIC, CGA-1152

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

CGA

CGA1152,34X34,40

SQUARE

网格排列

1.5 V

1.425 V

1.575 V

无

活跃

MICROCHIP TECHNOLOGY INC

3A001.A.2.C

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

PERPENDICULAR

UNSPECIFIED

未说明

1 mm

compliant

未说明

S-CPGA-X1152

684

不合格

MILITARY

684

21504 CLBS, 2000000 GATES

3.575 mm

现场可编程门阵列

MIL-STD-883 Class S (Modified)

1.1 ns

21504

32256

2000000

35 mm

35 mm

N/A

-

YES

208

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK208,2.9SQ,20

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-208

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F208

173

不合格

MILITARY

173

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535 Class V

1.2 ns

2880

2880

48000

100k Rad(Si) V

29.21 mm

29.21 mm

N/A

-

N/A

-

YES

1152

CERAMIC, METAL-SEALED COFIRED

CGA

CGA1152,34X34,40

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

活跃

MICROCHIP TECHNOLOGY INC

125 °C

-55 °C

3A001.A.2.C

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

UNSPECIFIED

1 mm

compliant

S-CBGA-X1152

684

684

21504 CLBS, 2000000 GATES

5.935 mm

现场可编程门阵列

1.1 ns

21504

32256

2000000

300k Rad(Si) V

35 mm

35 mm

N/A

-

YES

624

-55 °C

LGA

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

活跃

MICROCHIP TECHNOLOGY INC

649 MHz

125 °C

9A515.E

8542.39.00.01

BOTTOM

BUTT

compliant

S-XBGA-X624

418

418

21504 CLBS, 2000000 GATES

现场可编程门阵列

0.93 ns

2000000

300k Rad(Si) V

N/A

-

YES

624

LGA-624

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

LGA

LGA624,25X25,50

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

3A001.A.2.C

125000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

无铅

未说明

1.27 mm

compliant

未说明

S-CBGA-N624

418

不合格

MILITARY

418

12096 CLBS, 1000000 GATES

2.96 mm

现场可编程门阵列

MIL-STD-883 Class S (Modified)

1.1 ns

12096

18144

1000000

32.5 mm

32.5 mm

N/A

-

YES

256

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

LGA

BGA256,16X16,40

SQUARE

网格排列

2.75 V

2.25 V

2.5 V

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, CCLG-256

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

无铅

1 mm

compliant

S-CBGA-N256

202

不合格

MILITARY

202

2880 CLBS, 48000 GATES

1.778 mm

现场可编程门阵列

MIL-PRF-38535

1.2 ns

2880

2880

48000

17 mm

17 mm

N/A

-

YES

256

QFP-256

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK256,3SQ,20

SQUARE

FLATPACK, GUARD RING

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

e0

9A515.E

锡铅

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F256

136

不合格

MILITARY

136

21504 CLBS, 2000000 GATES

3.3 mm

现场可编程门阵列

MIL-STD-883 Class S (Modified)

0.93 ns

21504

32256

2000000

36 mm

36 mm

N/A

-

YES

1152

CERAMIC, METAL-SEALED COFIRED

CGA

CGA1152,34X34,40

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

活跃

MICROCHIP TECHNOLOGY INC

125 °C

-55 °C

9A515.E

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

UNSPECIFIED

1 mm

compliant

S-CBGA-X1152

684

684

21504 CLBS, 2000000 GATES

5.935 mm

现场可编程门阵列

0.93 ns

21504

32256

2000000

300k Rad(Si) V

35 mm

35 mm

N/A

-

YES

352

CERAMIC, QFP-352

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK352,2.9SQ,20

SQUARE

FLATPACK

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

e0

3A001.A.2.C

锡铅

125000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F352

198

不合格

MILITARY

198

12096 CLBS, 1000000 GATES

2.89 mm

现场可编程门阵列

MIL-STD-883 Class B

1.1 ns

12096

18144

1000000

48 mm

48 mm

N/A

-

MICROCHIP TECHNOLOGY INC

活跃

无

1.5 V

1.425 V

1.575 V

-55 °C

125 °C

3A001.A.2.C

8542.39.00.01

1.27 mm

compliant

248

248

2816 CLBS, 250000 GATES

现场可编程门阵列

MIL-STD-883 Class S (Modified)

1.1 ns

250000

32.5 mm

32.5 mm

N/A

-

4 Days

YES

256

CERAMIC, QFP-256

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK256,3SQ,20

SQUARE

FLATPACK

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

e0

9A515.E

锡铅

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F256

136

不合格

MILITARY

136

21504 CLBS, 2000000 GATES

3.3 mm

现场可编程门阵列

MIL-STD-883 Class B

1.1 ns

21504

32256

2000000

36 mm

36 mm

N/A

-

YES

84

CERAMIC, QFP-84

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK84,1.63SQ,25

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

未说明

0.635 mm

compliant

未说明

S-CQFP-F84

62

不合格

MILITARY

62

2880 CLBS, 48000 GATES

2.4 mm

现场可编程门阵列

MIL-PRF-38535 Class V

1.2 ns

2880

2880

48000

100k Rad(Si) V

16.51 mm

16.51 mm

N/A

-

YES

352

CERAMIC, QFP-352

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK352,2.9SQ,20

SQUARE

FLATPACK

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

e0

3A001.A.2.C

锡铅

125000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F352

198

不合格

MILITARY

198

12096 CLBS, 1000000 GATES

2.89 mm

现场可编程门阵列

MIL-STD-883 Class S (Modified)

1.1 ns

12096

1000000

48 mm

48 mm

N/A

-

gold-plated

YES

94

208

2x47

2.54mm

THT

8.93 g

female

-55 °C

CERAMIC, METAL-SEALED COFIRED

HGQFF

TPAK208,2.9SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, GUARD RING

2.75 V

2.25 V

2.5 V

socket

无

活跃

2.54mm

straight

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-208

310 MHz

pin strips

125 °C

-40...163°C

e0

3A001.A.2.C

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

1.5A

20

S-CQFP-F208

360

不合格

MILITARY

360

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

MIL-STD-883 Class B

1.2 ns

6036

6036

60V

108000

beryllium copper

100k Rad(Si) V

29.21 mm

29.21 mm

0.75µm

UL94V-0

N/A

-

gold-plated

YES

1

208

1x1

2.54mm

THT

0.05 g

female

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK208,2.9SQ,20

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

socket

无

活跃

straight

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-208

310 MHz

pin strips

125 °C

-40...163°C

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

未说明

0.5 mm

compliant

3A

未说明

S-CQFP-F208

227

不合格

MILITARY

227

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535

1.4 ns

2880

2880

150V

48000

beryllium copper

29.21 mm

29.21 mm

0.75µm

UL94V-0

N/A

-

gold-plated

YES

8

208

2x4

2.54mm

THT

0.76 g

female

SQUARE

FLATPACK, GUARD RING

socket

无

活跃

MICROCHIP TECHNOLOGY INC

238 MHz

125 °C

-55 °C

2.54mm

straight

CERAMIC

GQFF

pin strips

TPAK208,2.9SQ,20

-40...163°C

3A001.A.2.C

8542.39.00.01

QUAD

FLAT

0.5 mm

unknown

1.5A

S-XQFP-F208

173

不合格

MILITARY

173

现场可编程门阵列

38535V;38534K;883S

2880

60V

beryllium copper

0.75µm

UL94V-0

N/A

-

YES

208

CERAMIC, QFP-208

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

HGQFF

TPAK208,2.9SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, GUARD RING

2.75 V

2.25 V

2.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

3A001.A.2.C

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

未说明

0.5 mm

compliant

未说明

S-CQFP-F208

360

不合格

MILITARY

360

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535

1.4 ns

6036

6036

108000

29.21 mm

29.21 mm

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

微芯片技术

Obsolete

113

Tray

A54SX16A

-40°C ~ 125°C (TA)

SX-A

2.25V ~ 5.25V

24000

1452

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

96

Tray

A3P060

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

微芯片技术

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.5 V

20

1.425 V

125 °C

无

A3P060-FG144T

350 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.23

Automotive grade

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

1 mm

compliant

S-PBGA-B144

96

不合格

1.5/3.3 V

AUTOMOTIVE

96

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

AEC-Q100

STD

1536

1536

60000

13 mm

13 mm