品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 触点形状 | 供应商器件包装 | 材料 | 房屋材料 | 质量 | 本体材质 | 终端数量 | PCB安装方向 | 厂商 | 操作温度 | 包装 | 系列 | 容差 | JESD-609代码 | 终端 | ECCN 代码 | 温度系数 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 颜色 | 应用 | 行数 | 附加功能 | HTS代码 | 紧固类型 | 子类别 | 额定功率 | 螺距 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 深度 | Reach合规守则 | 额定电流 | 频率 | 终端样式 | JESD-30代码 | 输出的数量 | 资历状况 | 接头数量 | 触点性别 | 房屋颜色 | 引线长度 | 工作电源电压 | 引线间距 | 电源 | 温度等级 | 配置 | 弱电 | 最大电源电压 | 最小电源电压 | 内存大小 | 电阻数 | 传播延迟 | 接通延迟时间 | 最大浪涌电流 | 输入数量 | 组织结构 | 电路型态 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 配套立柱长度 | 产品类别 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 恢复时间 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 外壳电镀 | 逻辑单元数 | 等效门数 | 产品 | 安装角 | 特征 | Vf-正向电压 | 触点配接长度 | 产品类别 | 高度 | 长度 | 宽度 | 辐射硬化 | 可燃性等级 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | A54SX32A-CQ256M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Gold | 通孔 | 表面贴装 | 256-BFCQFP with Tie Bar | Round | 256-CQFP (75x75) | Polyester | Vertical | 微芯片技术 | 600 V | 600 V | Compliant | 无 | 228 | Tray | A54SX32 | 活跃 | -55°C ~ 125°C (TC) | Bulk | SX-A | Solder | Header, Pin, Plug | 12 | Natural | 1 | Friction | 3.96 mm | 2.25V ~ 5.25V | Vertical | 7 A | 12 | Male | White | 4.45 mm | Compliant | 10.16 mm | 48000 | 2880 | 10.16 mm | 无 | UL94 V-0 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-1FG324I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 324 | 400.011771 mg | 324 | 无 | AX125-1FG324I | 763 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.84 | Non-Compliant | 168 | 1 MM PITCH, FBGA-324 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | S-PBGA-B324 | 168 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 2.3 kB | 850 ps | 850 ps | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | 现场可编程门阵列 | 1344 | 125000 | 763 MHz | 1344 | 1 | 1344 | 0.84 ns | 1344 | 2016 | 125000 | 1.25 mm | 19 mm | 19 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS090-2FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 3.2 mm x 1.6 mm x 0.5 mm | YES | 8 | 400.011771 mg | 256 | - 55 C | 5000 | Royalohm | Royalohm | Details | 75 | FBGA-256 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | AFS090-2FG256I | LBGA | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.89 | 63.4 Ohms | 50 V | + 155 C | 0.000293 oz | Reel | Chip Resistor Array | 1 % | 200 PPM / C | Chip Resistor Array | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | Resistors | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | SMD/SMT | S-PBGA-B256 | 不合格 | 1.5 V | 0.8 mm | INDUSTRIAL | 1.575 V | 1.425 V | 3.4 kB | 4 | 2304 CLBS, 90000 GATES | Jumper | 1.68 mm | 现场可编程门阵列 | Resistor Networks & Arrays | 90000 | 1.47059 GHz | 2 | 2304 | 2304 | 90000 | Arrays | Resistor Networks & Arrays | 0.5 mm | 3.2 mm | 1.6 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLP125V2-CSG289I | Microchip | 数据表 | 2715 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 289-TFBGA, CSBGA | 289-CSP (14x14) | 微芯片技术 | 200 V | 2512 | 6432 | + 155 C | 0.001379 oz | - 55 C | 4000 | PCB 安装 | Royalohm | Royalohm | Details | 212 | Tray | AGLP125 | Obsolete | -40°C ~ 100°C (TJ) | Reel | High Precision Thin Film | 0.1 % | 25 PPM / C | High-Precision Thin Film Chip Resistors | 60.4 Ohms | Resistors | 750 mW (3/4 W) | Thin Film | 1.14V ~ 1.575V | SMD/SMT | 3120 | 薄膜电阻器 | 36864 | 125000 | STD | 精密薄膜贴片电阻器 | Thin Film Resistors - SMD | 0.55 mm | 6.35 mm | 3.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-1FGG324 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | Silver | 表面贴装 | YES | 324 | 400.011771 mg | 324 | 14S | 箱体安装 | MIL-DTL-5015 | 1.05 kV | 1 | Panel | 14S-02 | Copper Alloy | Amphenol | Amphenol Air LB Germany | Details | 168 | BGA, BGA324,18X18,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.5 V | 40 | 1.425 V | 70 °C | 有 | AX125-1FGG324 | 763 MHz | BGA | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.8 | e1 | 4 Position | 锡银铜 | 70 °C | 0 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Circular Connectors | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | 763 MHz | Crimp | S-PBGA-B324 | 168 | 不合格 | Socket (Female) | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 2.3 kB | 850 ps | 850 ps | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | 现场可编程门阵列 | 1344 | 军规圆形连接器 | 125000 | 763 MHz | 1344 | 1 | 1344 | 0.84 ns | 1344 | Nickel | 2016 | 125000 | Receptacles | Straight | 军规圆形连接器 | 1.25 mm | 19 mm | 19 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-FFGG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | ITT Cannon | ITT Cannon | Details | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | 2.5 V | 40 | 2.25 V | 70 °C | 有 | A54SX08A-FFGG144 | 172 MHz | LBGA | SQUARE | Obsolete | MICROSEMI CORP | 2.75 V | 5.27 | 1 | 155302-0031 | e1 | 锡银铜 | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | Circular Connectors | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 111 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 111 | 768 CLBS, 12000 GATES | 1.55 mm | 现场可编程门阵列 | 军规圆形连接器 | 1.7 ns | 768 | 768 | 12000 | 军规圆形连接器 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-1CQ256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | Polypropylene (PP) | 256 | FLATPACK | CERAMIC, METAL-SEALED COFIRED | TPAK256,3SQ,20 | 3.3 V | 20 | 2.97 V | 70 °C | 无 | A54SX16-1CQ256 | 240 MHz | QFF | SQUARE | Obsolete | MICROSEMI CORP | 3.63 V | 5.27 | 1 | SE710XCC, YL | SERPAC | SERPAC | Details | QFF, TPAK256,3SQ,20 | SE710 | e0 | 锡铅 | Yellow | 24000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Supplies | CMOS | QUAD | FLAT | 225 | 0.5 mm | compliant | S-CQFP-F256 | 172 | 不合格 | 3.3,5 V | COMMERCIAL | 172 | 1452 CLBS, 16000 GATES | 3.06 mm | 现场可编程门阵列 | Storage Boxes & Cases | 0.9 ns | 1452 | 1452 | 16000 | Cases | Storage Boxes & Cases | 5.5 in | 20.1 in | 15.5 in | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-1VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 100 | Details | 81 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 3 V | 85 °C | 有 | A54SX08-1VQG100I | 280 MHz | TFQFP | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.32 | DC | 48 | NMB技术 | NMB技术 | 11925SA | e3 | 哑光锡 | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | Fans, Blowers & Accessories | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 280 MHz | S-PQFP-G100 | 不合格 | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 800 ps | 800 ps | 768 CLBS, 8000 GATES | 1.2 mm | 现场可编程门阵列 | 768 | DC 风扇 | 12000 | 280 MHz | 768 | 1 | 256 | 0.8 ns | 768 | 8000 | DC 风扇 | 1 mm | 14 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-2FG324 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | SOT-23-3 | YES | 324 | 400.011771 mg | 324 | 50 uA | 350 mW | + 150 C | 0.000282 oz | - 55 C | 3000 | SMD/SMT | Micro Commercial Components (MCC) | Micro Commercial Components (MCC) | 150 mA | 100 V | Details | 168 | 1 MM PITCH, FBGA-324 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.5 V | 30 | 1.425 V | 70 °C | 无 | AX125-2FG324 | 870 MHz | BGA | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.84 | MouseReel | AECQ-HE3 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Diodes & Rectifiers | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | 870 MHz | S-PBGA-B324 | 168 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | Single | 1.575 V | 1.425 V | 2.3 kB | 740 ps | 740 ps | 4 A | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | 现场可编程门阵列 | 1344 | Diodes - General Purpose, Power, Switching | 125000 | 870 MHz | 1344 | 2 | 4 ns | 1344 | 0.74 ns | 1344 | 2016 | 125000 | 开关二极管 | 1.25 V | Diodes - General Purpose, Power, Switching | 1.25 mm | 19 mm | 19 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-VQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Silver | YES | 100 | 1 | Panel | 16S-01 | Copper Alloy | Amphenol | Amphenol Air LB Germany | Details | FLATPACK | PLASTIC/EPOXY | TQFP100,.63SQ | 70 °C | 无 | A54SX08-VQ100 | 240 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 5.88 | 16S | 箱体安装 | MIL-DTL-5015 | 1.6 kV | 7 Position | Circular Connectors | CMOS | QUAD | 鸥翼 | 0.5 mm | unknown | Crimp | S-PQFP-G100 | 81 | 不合格 | Pin (Male) | 3.3,5 V | COMMERCIAL | 81 | 现场可编程门阵列 | 军规圆形连接器 | Nickel | 768 | Receptacles | Straight | 军规圆形连接器 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-1TQG176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 176 | 176 | 200 V | 2512 | 6432 | + 155 C | 0.000353 oz | - 55 C | 4000 | PCB 安装 | Royalohm | Royalohm | Details | 128 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 3 V | 70 °C | 有 | A54SX08-1TQG176 | 280 MHz | LFQFP | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.6 | Reel | Anti-Sulfurized Automotive Thick Film | 5 % | e3 | 100 PPM / C | 68 Ohms | 哑光锡 | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | Resistors | 1 W | 厚膜 | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 280 MHz | SMD/SMT | S-PQFP-G176 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 800 ps | 800 ps | 768 CLBS, 8000 GATES | 1.6 mm | 现场可编程门阵列 | 768 | 厚膜电阻器 | 12000 | 280 MHz | 768 | 1 | 256 | 0.8 ns | 768 | 8000 | 贴片厚膜电阻器 | Thick Film Resistors - SMD | 0.55 mm | 6.35 mm | 3.2 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 75 V | 0603 | 1608 | + 155 C | 0.000071 oz | - 55 C | 5000 | PCB 安装 | 302-41.2-RC | Royalohm | Royalohm | Details | 1 MM HEIGHT, MO-136, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A54SX08-VQ100I | 240 MHz | TFQFP | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.28 | Reel | General Purpose Thick Film | 1 % | e0 | 100 PPM / C | 41.2 Ohms | Tin/Lead (Sn/Pb) | 通用型 | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | Resistors | 100 mW (1/10 W) | 厚膜 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | SMD/SMT | S-PQFP-G100 | 不合格 | INDUSTRIAL | 768 CLBS, 8000 GATES | 1.2 mm | 现场可编程门阵列 | 厚膜电阻器 | 0.9 ns | 768 | 8000 | Wrap-Around Termination | Thick Film Resistors - SMD | 0.45 mm | 1.6 mm | 0.8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-2FGG324I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 324 | 400.011771 mg | 324 | BGA, BGA324,18X18,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AX125-2FGG324I | 870 MHz | BGA | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.8 | 1 | 111452-0289 | ITT Cannon | ITT Cannon | Details | 168 | e1 | 锡银铜 | 85 °C | -40 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Circular Connectors | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | 870 MHz | S-PBGA-B324 | 168 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 2.3 kB | 740 ps | 740 ps | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | 现场可编程门阵列 | 1344 | 军规圆形连接器 | 125000 | 870 MHz | 1344 | 2 | 1344 | 0.74 ns | 1344 | 2016 | 125000 | 军规圆形连接器 | 1.25 mm | 19 mm | 19 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-1PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | Details | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 3 V | 70 °C | 有 | A54SX16-1PQG208 | 280 MHz | FQFP | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | 1 | 143-3648-000 MS | ITT Cannon | ITT Cannon | e3 | 哑光锡 | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | D-Sub Connectors | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 1452 CLBS, 16000 GATES | 4.1 mm | 现场可编程门阵列 | D-Sub Connectors - Standard Density | 0.8 ns | 1452 | 16000 | D-Sub Standard Connectors | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-1FG324 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 324 | 400.011771 mg | 324 | 无 | 70 °C | 1.425 V | 30 | 1.5 V | BGA324,18X18,40 | PLASTIC/EPOXY | 3 | 网格排列 | 1 MM PITCH, FBGA-324 | Glenair | Glenair | 168 | Compliant | 5.84 | 1.575 V | MICROSEMI CORP | Obsolete | SQUARE | BGA | 763 MHz | AX125-1FG324 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | S-PBGA-B324 | 168 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 2.3 kB | 850 ps | 850 ps | 168 | 1344 CLBS, 125000 GATES | 1.78 mm | 现场可编程门阵列 | 1344 | 125000 | 763 MHz | 1344 | 1 | 1344 | 0.84 ns | 1344 | 2016 | 125000 | Glenair | 1.25 mm | 19 mm | 19 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000L-1FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 1.14 V | 85 °C | 无 | M1A3P1000L-1FG484I | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.2 V | 30 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 300 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 24576 | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010TS-1VF400I | Microchip | 数据表 | 25 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 20 | 1.14 V | 无 | M2GL010TS-1VF400I | LFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | 12084 LE | + 100 C | - 40 C | SMD/SMT | 4X, 12 | 195 | Non-Compliant | Tray | M2GL010 | 活跃 | LFBGA, BGA400,20X20,32 | -40°C ~ 100°C (TJ) | IGLOO2 | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | 1.2 V | 114 kB | 195 | 1.51 mm | 现场可编程门阵列 | 12084 | 933888 | 4 Transceiver | 12084 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-1TQ144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 1 - 25 | 2 | 3 | 1 - 25 | 84 | Tray | Obsolete | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.2 V | 20 | 1.14 V | 无 | M2GL005S-1TQ144I | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.26 V | 5.57 | 70.5 | AC | IP20 | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | 鸥翼 | 240 | 0.5 mm | compliant | 50 - 60 | S-PQFP-G144 | 1.6 mm | 现场可编程门阵列 | 6060 | 719872 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | Plastic | 208 | 0 | Cable screw gland | 95 | Compliant | QFP-208 | FLATPACK | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | M1AFS600-PQ208 | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | Untreated | 有 | Other | Metric | e0 | Straight | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | QUAD | FLAT | 225 | 0.5 mm | 23 | compliant | 1.0989 GHz | R-PQFP-F208 | 不合格 | 1.5 V | OTHER | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 1.0989 GHz | 13824 | 13824 | 600000 | 116 | 28 mm | 204 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS250-2PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | 有 | 93 | QFP-208 | FLATPACK | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | AFS250-2PQ208 | QFF | RECTANGULAR | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | QUAD | FLAT | 225 | 0.5 mm | unknown | R-PQFP-F208 | 不合格 | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 250000 | 1.47059 GHz | 2 | 6144 | 6144 | 250000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M7A3P1000-2PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | Zinc | 微芯片技术 | Compliant | 154 | Tray | M7A3P1000 | Obsolete | 0°C ~ 85°C (TJ) | ProASIC3 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1e+06 | 310 MHz | 2 | 24576 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE3000L-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M1A3PE3000L-1PQ208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.61 | Non-Compliant | 147 | Tray | M1A3PE3000L | Obsolete | -40°C ~ 100°C (TJ) | Bulk | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 28 V | 1.5/3.3 V | INDUSTRIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 3 GHz | 75264 | 75264 | 3000000 | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200T-FCG484T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 244 | Tray | 活跃 | -40°C ~ 125°C (TJ) | PolarFire™ | 0.97V ~ 1.08V | 192000 | 13946061 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EX128-PTQ64I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | YES | 64-TQFP (10x10) | 64 | 微芯片技术 | MICROSEMI CORP | 2.7 V | 5.61 | Cable with connector | -25 - 55 | 100 | Plastic | DC | IP67 | Other | 无 | None | 10 - 30 | None | 46 | Tray | EX128 | Obsolete | TQFP-64 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 30 | 2.3 V | 85 °C | 无 | EX128-PTQ64I | 357 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | -40°C ~ 85°C (TA) | EX | e0 | Tin/Lead (Sn/Pb) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G64 | INDUSTRIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | 0.7 ns | 6000 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX2000-FGG1152M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 1152-BGA | YES | 1152 | 1152-FPBGA (35x35) | 400.011771 mg | 1152 | 微芯片技术 | 活跃 | MICROSEMI CORP | 1.575 V | 5.29 | Military grade | Cable entry metrical | 0 | 1 | Plastic | IP67 | Other | 2 | 有 | None | Plunger | None | 684 | Compliant | Tray | AX2000 | 活跃 | BGA, BGA1152,34X34,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA1152,34X34,40 | -55 °C | 1.5 V | 40 | 1.425 V | 125 °C | 有 | AX2000-FGG1152M | 649 MHz | BGA | SQUARE | Microsemi Corporation | -55°C ~ 125°C (TA) | Axcelerator | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 245 | 1 mm | compliant | 649 MHz | S-PBGA-B1152 | 684 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 36 kB | 990 ps | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | 现场可编程门阵列 | 21504 | 294912 | 2e+06 | 649 MHz | 32256 | MIL-STD-883 Class B | 21504 | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 35 mm | 35 mm | 无 |
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
368.682496
M2GL005S-1TQ144I
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
