品牌是'Microchip' (5152)
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![]() | A42MX36-FPQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 3.6 V | 5.2 | QFP | 8 in | 100 | 面板安装 | BIVAR | Bivar | Round Lens, Dome Face | Details | 176 | Tray | A42MX36 | Obsolete | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX36-FPQ208 | 44 MHz | FQFP | SQUARE | Obsolete | MICROSEMI CORP | 0°C ~ 70°C (TA) | Bulk | MX | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | LED指示灯 | CMOS | 5 V | QUAD | Vertical | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 320 B | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | 1184 | LED灯管 | 2560 | 54000 | 79 MHz | 1184 | 1822 | 3.8 ns | 2438 | 5.25 V | 3 V | 54000 | 柔性光导管 | LED灯管 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-1FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 256 | 400.011771 mg | 256 | 30 | 1.425 V | 85 °C | 无 | AX125-1FG256I | 763 MHz | LBGA | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.84 | - 55 C | 1000 | PCB 安装 | 2-1879133-9 | TE Connectivity | TE Connectivity / Holsworthy | Details | 0.000071 oz | + 155 C | 1608 | 0603 | 100 V | 138 | 1 MM PITCH, FBGA-256 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.5 V | MouseReel | RN73 | 0.1 % | 10 PPM / C | 贴片大功率精密电阻器 | 1.69 kOhms | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Resistors | 62.5 mW (1/16 W) | Thin Film | 1.5 V | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | SMD/SMT | S-PBGA-B256 | 168 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 2.3 kB | 850 ps | 850 ps | 168 | 1344 CLBS, 125000 GATES | 1.7 mm | 现场可编程门阵列 | 1344 | 薄膜电阻器 | - 55 C to + 155 C | 125000 | 763 MHz | 1344 | 1 | 1344 | 0.84 ns | 1344 | 2016 | 1.575 V | 1.425 V | 125000 | 精密薄膜贴片电阻器 | - | Thin Film Resistors - SMD | 0.45 mm | 1.55 mm | 0.8 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1415A-1PQ100M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 100 | PLASTIC/EPOXY | -55 °C | 5 V | 4.5 V | 125 °C | 无 | A1415A-1PQ100M | 150 MHz | QFP | RECTANGULAR | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | ROEDERSTEIN | 80 | Compliant | QFP, | FLATPACK | 3A001.A.2.C | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 5 V | QUAD | 鸥翼 | 0.65 mm | compliant | 150 MHz | R-PQFP-G100 | MILITARY | 2.6 ns | 2.6 ns | 200 CLBS, 1500 GATES | 3.4 mm | 现场可编程门阵列 | 200 | 1500 | 200 | 1 | 264 | 2.6 ns | 200 | 5.5 V | 4.5 V | 1500 | 20 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS250-2PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AFS250-2PQG208 | QFF | RECTANGULAR | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | Autec 电力系统 | RoHS | 93 | QFF, | FLATPACK | Metal | 241x43x30 mm | e3 | 哑光锡 | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.5 V | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | OTHER | 120-277Vac | 4.5 kB | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 250000 | 1.47059 GHz | 2 | 6144 | 6144 | 1.575 V | 1.425 V | 250000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-FPQG240 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 240 | 240 | Compliant | FQFP, QFP240,1.3SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP240,1.3SQ,20 | 3.3 V | 40 | 3 V | 70 °C | 有 | A42MX36-FPQG240 | 44 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.81 | 202 | e3 | 哑光锡 | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G240 | 202 | 不合格 | 3.3,3.3/5,5 V | COMMERCIAL | 320 B | 202 | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | 1184 | 54000 | 79 MHz | 1184 | 1822 | 3.8 ns | 2438 | 2438 | 5.25 V | 3 V | 54000 | 3.4 mm | 32 mm | 32 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-PL68 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | 68 | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | 70 °C | 无 | A40MX04-PL68 | 80 MHz | QCCJ | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | LCC | - 55 C | 5000 | PCB 安装 | Vishay | Vishay / Dale | Details | 200 V | 1206 | + 155 C | 0.000571 oz | 3216 | 57 | Tray | A40MX04 | Obsolete | PLASTIC, LCC-68 | CHIP CARRIER | PLASTIC/EPOXY | 3.3 V | 未说明 | 3 V | 0°C ~ 70°C (TA) | Reel | CRCW-C e3 | 1 % | e0 | 100 PPM / C | 5.11 Ohms | 锡铅 | 商用级 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | Resistors | 250 mW (1/4 W) | 厚膜 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 未说明 | 1.27 mm | compliant | SMD/SMT | S-PQCC-J68 | 不合格 | COMMERCIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 厚膜电阻器 | 6000 | 2.7 ns | 547 | 6000 | 贴片厚膜电阻器 | - | Thick Film Resistors - SMD | 0.55 mm | 3.2 mm | 1.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | A3PE3000L | Obsolete | Compliant | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | A3PE3000L-1PQ208I | 250 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.6 | 147 | Tray | -40°C ~ 100°C (TJ) | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 1.26 V | 1.14 V | 3000000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090T-FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 267 | Tray | M2GL090 | 活跃 | 86184 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | AEC-Q200 | -40°C ~ 100°C (TJ) | IGLOO2 | 100 ppm/K | 165 Ohm | 0.125 W | 1.14V ~ 2.625V | 通用型 | 86184 | 2648064 | STD | 4 Transceiver | 1 | 2 mm | 1.25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-3PL68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | 68 | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | 57 | Tray | A40MX02 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A40MX02-3PL68I | 109 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | LCC | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J68 | 不合格 | INDUSTRIAL | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 1.7 ns | 295 | 3000 | 24.2316 mm | 24.2316 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 法兰安装 | Contactor | 147 | Tray | A3PE3000 | Obsolete | Compliant | 5.6 | 1.575 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | FQFP | 350 MHz | A3PE3000-PQ208I | 无 | 85 °C | 1.425 V | 30 | 1.5 V | -40 °C | QFP208,1.2SQ,20 | PLASTIC/EPOXY | 3 | FLATPACK, FINE PITCH | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | -40°C ~ 100°C (TJ) | ProASIC3E | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 231 MHz | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 231 MHz | 75264 | 75264 | 75264 | 1.575 V | 1.425 V | 3000000 | SPST-NO-DM | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 1 month ago) | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | Obsolete | 5.82 | 2.75 V | ACTEL CORP | Transferred | Actel Corporation | SQUARE | FQFP | 230.8 MHz | A54SX72A-PQ208I | 无 | 85 °C | 2.25 V | 30 | 2.5 V | -40 °C | QFP208,1.2SQ,20 | PLASTIC/EPOXY | 3 | FLATPACK, FINE PITCH | PLASTIC, QFP-208 | Compliant | 171 | Tray | A54SX72A | -40°C ~ 85°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 72000 TYPICAL GATES AVAILABLE | 现场可编程门阵列 | CMOS | 2.5 V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 217 MHz | S-PQFP-G208 | 171 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 1.5 ns | 1.5 ns | 171 | 6036 CLBS, 108000 GATES | 4.1 mm | 现场可编程门阵列 | 6036 | 108000 | 217 MHz | 6036 | 6036 | 4024 | 1.3 ns | 6036 | 6036 | 2.75 V | 2.25 V | 108000 | 3.4 mm | 28 mm | 28 mm | 无 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-FPL84 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | YES | 84 | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | Ceramic | 微芯片技术 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX24-FPL84 | 50.4 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.2 | LCC | 表面贴装 | 72 | Compliant | Tray | A42MX24 | Obsolete | -55°C to +125°C | MX | 0.05 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 5 V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | COMMERCIAL | Pb | 1890 CLBS, 36000 GATES | 4.572 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 3.4 ns | 1890 | 5.25 V | 3 V | 36000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050-VFG400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFBGA-400 | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | 有 | M2GL050-VFG400I | LFBGA | SQUARE | 活跃 | FPGA - Field Programmable Gate Array IGLOO 2 | MICROSEMI CORP | 1.53 | 有 | 56340 LE | 207 I/O | + 100 C | 1.26 V | - 40 C | 90 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | Details | Tray | M2GL050 | 活跃 | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | -40°C ~ 100°C (TJ) | Tray | M2GL050 | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.2 V | BOTTOM | BALL | 260 | 0.8 mm | compliant | 30 | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 667 Mb/s | 207 | 1.51 mm | 现场可编程门阵列 | 56340 | FPGA - Field Programmable Gate Array | 1869824 | STD | 4 Transceiver | 56340 | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL1000V5-CS281I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 281-TFBGA, CSBGA | YES | 281 | 281-CSP (10x10) | 281 | 微芯片技术 | 活跃 | MICROSEMI CORP | 1.575 V | 5.28 | Industrial grade | 表面贴装 | 1000000 | 215 | 1000000 | 1.5000 V | CSP | 215 | Tray | AGL1000 | 活跃 | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | -40 °C | 1.5 V | 未说明 | 1.425 V | 100 °C | 无 | AGL1000V5-CS281I | 108 MHz | TFBGA | SQUARE | Microsemi Corporation | -40 to 85 °C | IGLOO | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.5 mm | unknown | S-PBGA-B281 | 不合格 | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.05 mm | 现场可编程门阵列 | 24576 | 147456 | 1000000 | Industrial | STD | 24576 | 24576 | 1000000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000-1FG484T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 484 | 微芯片技术 | 350 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 1.47 | Automotive grade | 表面贴装 | 1000000 | 300 | 1000000 | 1.5000 V | FBGA | 300 | Tray | A3P1000 | 活跃 | 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.5 V | 20 | 1.425 V | 125 °C | 无 | A3P1000-1FG484T | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e0 | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 300 | 不合格 | 1.5/3.3 V | AUTOMOTIVE | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 1000000 | AEC-Q100 | 1 | 24576 | 24576 | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16P-1VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100 | 100-VQFP (14x14) | 100 | 微芯片技术 | 3 V | 70 °C | 有 | A54SX16P-1VQG100 | 280 MHz | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.24 | Commercial grade | 1452 | VQFP | 3.3, 5 V | 2.97, 4.75 V | 24000 | 81 | 16000 | 3.63, 5.25 V | 表面贴装 | 81 | Tray | A54SX16 | 活跃 | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | 3.3 V | 40 | 0 to 70 °C | SX | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 81 | 不合格 | 3.3,3.3/5 V | COMMERCIAL | 81 | 1452 CLBS, 16000 GATES | 1.2 mm | 现场可编程门阵列 | 24000 | 1452 | Commercial | 1 | 528 | 0.8 ns | 1452 | 1452 | 16000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA750-FG896 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | 微芯片技术 | APA750-FG896 | 180 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.26 | Commercial grade | FBGA | 2.5000 V | 2.3 V | 750000 | 562 | 750000 | 2.7 V | 表面贴装 | 562 | Compliant | Tray | APA750 | 活跃 | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 2.5 V | 30 | 2.3 V | 70 °C | 无 | 0 to 70 °C | ProASICPLUS | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.5 V | BOTTOM | BALL | 225 | 1 mm | unknown | 180 MHz | S-PBGA-B896 | 562 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 18 kB | 562 | 750000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 750000 | 180 MHz | Commercial | STD | 32768 | 32768 | 2.7 V | 2.3 V | 750000 | 1.73 mm | 31 mm | 31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000-2PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | FQFP | 350 MHz | 有 | 85 °C | 1.425 V | 01551 | Greenlee | 1.5000 V | 1.425 V | 1.575 V | 147 | Tray | A3PE3000 | 活跃 | 8542310000/8542310000/8542310000/8542310000/8542310000, 8542390000 | Compliant | FLASH | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.5 V | 40 | 5.58 | 1.575 V | MICROSEMI CORP | 活跃 | SQUARE | -40 to 85 °C | ProASIC3E | e3 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 310 MHz | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 128 B | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 310 MHz | 2 | 75264 | 75264 | 100 °C | 75264 | 1.575 V | 1.4 V | 85 °C | 3000000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-TQG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 84 | Tray | M2GL010 | 活跃 | 12084 LE | + 100 C | 1.26 V | - 40 C | 1.14 V | SMD/SMT | PLASTIC/EPOXY | 3 | FLATPACK, LOW PROFILE, FINE PITCH | LFQFP, | 1.2 V | 30 | 有 | M2GL010-TQG144I | LFQFP | SQUARE | Microsemi Corporation | 活跃 | FPGA - Field Programmable Gate Array IGLOO 2 | MICROSEMI CORP | 5.57 | -40°C ~ 100°C (TJ) | IGLOO2 | e3 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | - | 1.6 mm | 现场可编程门阵列 | 12084 | 933888 | STD | - | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-2PL84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 84 | 6.777889 g | 84 | 无 | A54SX08-2PL84I | 320 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.27 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 69 | Compliant | QCCJ, | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 5 V | QUAD | J BEND | 225 | 1.27 mm | compliant | 320 MHz | S-PQCC-J84 | 不合格 | INDUSTRIAL | 700 ps | 700 ps | 768 CLBS, 8000 GATES | 4.572 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 2 | 256 | 0.7 ns | 768 | 5.5 V | 4.5 V | 8000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-2VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 100 | Compliant | 1 MM HEIGHT, MO-136, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.28 | SQUARE | TFQFP | 320 MHz | A54SX08-2VQ100I | 无 | 85 °C | 3 V | 30 | 3.3 V | -40 °C | 81 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 320 MHz | S-PQFP-G100 | 不合格 | INDUSTRIAL | 700 ps | 700 ps | 768 CLBS, 8000 GATES | 1.2 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 2 | 256 | 0.7 ns | 768 | 5.5 V | 4.5 V | 8000 | 1 mm | 14 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P125-2VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 活跃 | 微芯片技术 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 350 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.37 | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P125-2VQG100 | 有 | 1500 LE | 36864 bit | 71 I/O | + 85 C | 1.575 V | 0.257182 oz | 0 C | 90 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | Tray | A3P125 | 0°C ~ 85°C (TJ) | Tray | A3P125 | e3 | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | COMMERCIAL | 2 mA | - | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 125000 | 2 | - | 3072 | 125000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-2PLG84 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 84 | 6.777889 g | 84 | PLASTIC/EPOXY | 3.3 V | 40 | 3 V | 70 °C | 有 | A54SX08-2PLG84 | 320 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.27 | 69 | Compliant | QCCJ, | CHIP CARRIER | 3 | e3 | 哑光锡 | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 5 V | QUAD | J BEND | 245 | 1.27 mm | compliant | 320 MHz | S-PQCC-J84 | 不合格 | COMMERCIAL | 700 ps | 700 ps | 768 CLBS, 8000 GATES | 4.572 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 2 | 256 | 0.7 ns | 768 | 5.25 V | 4.75 V | 8000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025-FCSG325I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | BGA325,21X21,20 | 1.2 V | 30 | 有 | M2GL025-FCSG325I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | 有 | 27696 LE | 180 I/O | + 100 C | 1.26 V | 0.740878 oz | - 40 C | 176 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | Details | Tray | M2GL025 | 活跃 | 11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325 | 网格排列 | 3 | PLASTIC/EPOXY | -40°C ~ 100°C (TJ) | Tray | M2GL025 | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.2 V | BOTTOM | BALL | 260 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 667 Mb/s | 180 | 现场可编程门阵列 | 27696 | SoC FPGA | 1130496 | STD | 2 Transceiver | 27696 | FPGA - Field Programmable Gate Array | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-FG324I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 324-BGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | 微芯片技术 | 1.2000 V | 1.14 V | 1.26 V | 023708617 | Entrelec | 221 | Tray | A3PE3000 | 活跃 | Compliant | 19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, FBGA-324 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | 250 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | -40 to 85 °C | ProASIC3L | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B324 | 221 | 不合格 | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | 现场可编程门阵列 | 516096 | 3000000 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 1.26 V | 1.14 V | 3000000 | 1.25 mm | 19 mm | 19 mm | 无 |
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Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000-1FG484T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
APA750-FG896
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08-2PL84I
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P125-2VQG100
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE3000L-FG324I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
