品牌是'Microchip' (5152)
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![]() | A54SX16P-1VQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | 微芯片技术 | None | Roller cam | None | 81 | Tray | A54SX16 | Obsolete | Other | 1 | 0 | Metal | IP67 | Other | 0 | 无 | 0°C ~ 70°C (TA) | SX | 3V ~ 3.6V, 4.75V ~ 5.25V | 24000 | 1452 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-PQ160M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | 160 | None | 125 | Tray | A42MX16 | Obsolete | 微芯片技术 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX16-PQ160M | 94 MHz | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | Other | 1 | 0 | Plastic | IP00 | Other | 0 | 无 | None | Plunger | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | 不合格 | MILITARY | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.8 ns | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-2TQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.27 | 20 | Transverse connector | 81 | Tray | A54SX08A | Obsolete | LFQFP, TQFP100,.63SQ | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | 无 | A54SX08A-2TQ100I | 313 MHz | -40°C ~ 85°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 81 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 81 | 768 CLBS, 12000 GATES | 1.6 mm | 现场可编程门阵列 | 12000 | 768 | 0.9 ns | 768 | 768 | 12000 | 有 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-3PL44I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | None | 34 | Tray | A40MX02 | Obsolete | 微芯片技术 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A40MX02-3PL44I | 109 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | LCC | Other | 1 | 0 | Plastic | IP00 | Other | 0 | 无 | None | Other | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 不合格 | INDUSTRIAL | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 1.7 ns | 295 | 3000 | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-PQ144M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-BQFP | 144-PQFP (28x28) | 微芯片技术 | 17.5 | Transverse connector | 95 | Tray | Obsolete | -55°C ~ 125°C (TC) | 42MX | 3V ~ 3.6V, 4.75V ~ 5.25V | 348 | 14000 | 有 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-PQ100M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-BQFP | YES | 100-PQFP (20x14) | 100 | None | 69 | Tray | A40MX04 | Obsolete | 微芯片技术 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A40MX04-PQ100M | 80 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | With cable preassembled | 1 | 0 | Metal | IP67 | Other | 0 | 无 | None | Roller lever | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | MILITARY | 547 CLBS, 6000 GATES | 3.4 mm | 现场可编程门阵列 | 6000 | 2.7 ns | 547 | 6000 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-VQ80A | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 80-TQFP | YES | 80-VQFP (14x14) | 80 | 微芯片技术 | 116 MHz | TQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.25 V | 5.54 | QFP | 1 | 0 | 0 | 57 | Tray | A40MX02 | Obsolete | TQFP, | FLATPACK, THIN PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 30 | 4.75 V | 125 °C | 无 | A40MX02-VQ80A | -40°C ~ 125°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | CAN ALSO BE OPERATED AT 3V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 80 | S-PQFP-G80 | 不合格 | AUTOMOTIVE | 295 CLBS, 3000 GATES | 1.2 mm | 现场可编程门阵列 | 3000 | 2.2 ns | 295 | 3000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX250-PQ208M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | Compliant | 115 | Tray | AX250 | Obsolete | -55°C ~ 125°C (TA) | Axcelerator | 1.425V ~ 1.575V | 55296 | 250000 | 4224 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-PL68M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | LCC | Non-Compliant | 57 | Tray | A40MX04 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A40MX04-PL68M | 80 MHz | QCCJ | SQUARE | Microsemi Corporation | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 68 | S-PQCC-J68 | 不合格 | MILITARY | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 2.7 ns | 547 | 6000 | 24.2316 mm | 24.2316 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-3PL44I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Cable | 表面贴装 | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | 微芯片技术 | MICROSEMI CORP | 3.6 V | 5.24 | LCC | Compliant | 34 | Tray | A40MX04 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A40MX04-3PL44I | 109 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | -40°C ~ 85°C (TA) | MX | e0 | Solder | 6 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 2.54 mm | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 不合格 | INDUSTRIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 1.7 ns | 547 | 6000 | 152.4 mm | 16.5862 mm | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | QFP | 176 | Tray | A42MX24 | Obsolete | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX24-1PQ208 | 96.6 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | COMMERCIAL | 1890 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 36000 | 2.1 ns | 1890 | 36000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 3.6 V | 5.24 | QFP | 140 | Tray | A42MX16 | Obsolete | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX16-2PQ208I | 117 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | INDUSTRIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.1 ns | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 147 | Compliant | Tray | A3PE3000L | Obsolete | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | A3PE3000L-PQ208I | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.61 | -40°C ~ 100°C (TJ) | ProASIC3L | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3e+06 | 781.25 MHz | 75264 | 75264 | 75264 | 3000000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-1TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 12084 | 933888 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-1TQG144T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | 84 | Tray | 活跃 | -40°C ~ 125°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 6060 | 719872 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-1VFG400 | Microchip | 数据表 | 27 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | 169 | Tray | M2GL005 | 活跃 | 1.26 V | 1.14 V | 5.28 | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | LFBGA | M2GL005S-1VFG400 | 有 | 85 °C | 30 | 1.2 V | BGA400,20X20,32 | PLASTIC/EPOXY | 3 | GRID ARRAY, LOW PROFILE, FINE PITCH | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B400 | 171 | 不合格 | 1.2 V | OTHER | 171 | 1.51 mm | 现场可编程门阵列 | 6060 | 719872 | 6060 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P600-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 154 | Tray | M1A3P600 | Obsolete | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | M1A3P600-PQ208 | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | 0°C ~ 85°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 110592 | 600000 | 13824 | 600000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS250-2PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | Autec 电力系统 | 93 | QFF, | FLATPACK | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AFS250-2PQG208 | QFF | RECTANGULAR | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | RoHS | Metal | 241x43x30 mm | e3 | 哑光锡 | 70 °C | 0 °C | 8542.39.00.01 | CMOS | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | 1.5 V | OTHER | 120-277Vac | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 250000 | 1.47059 GHz | 2 | 6144 | 6144 | 250000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1415A-1PQ100M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 100 | 80 | Compliant | QFP, | FLATPACK | PLASTIC/EPOXY | -55 °C | 5 V | 4.5 V | 125 °C | 无 | A1415A-1PQ100M | 150 MHz | QFP | RECTANGULAR | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | ROEDERSTEIN | 3A001.A.2.C | 125 °C | -55 °C | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 0.65 mm | compliant | 150 MHz | R-PQFP-G100 | 5 V | MILITARY | 5.5 V | 4.5 V | 2.6 ns | 2.6 ns | 200 CLBS, 1500 GATES | 3.4 mm | 现场可编程门阵列 | 200 | 1500 | 200 | 1 | 264 | 2.6 ns | 200 | 1500 | 20 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-FG676ESX423 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Glenair | 1 | Glenair | D38999 Series IV | Circular Connectors | 军规圆形连接器 | 军规圆形连接器 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE3000L-FGG896M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 896-BGA | YES | 896-FBGA (31x31) | 896 | 微芯片技术 | MICROSEMI CORP | 1.575 V | 5.3 | 620 | Tray | M1A3PE3000 | 活跃 | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | -55 °C | 1.2 V | 40 | 1.14 V | 125 °C | 有 | M1A3PE3000L-FGG896M | 250 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | -55°C ~ 125°C (TJ) | ProASIC3L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 620 | 不合格 | 1.2/1.5,1.2/3.3 V | MILITARY | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-TQG144ES | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 250 | SiTime | SiTime | Details | 切割胶带 | Oscillators | MEMS振荡器 | 标准时钟振荡器 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600L-PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | Term: ¼in Solder Lug Quick-Connect, w/Resistor | YES | 208 | 208 | Y | 154 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | A3P600L-PQG208 | 350 MHz | FQFP | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | BARKER MICROFARADS INC | 2.156in x 1.312in Oval Case | ±10% | e3 | 哑光锡 | 70 °C | 0 °C | 8542.39.00.01 | 106uF | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.2 V | 1.5/3.3 V | COMMERCIAL | 370VAC | 1.26 V | 1.14 V | 13.5 kB | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 781.25 MHz | 13824 | 13824 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-1PL68 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | 3.6 V | 5.23 | LCC | 150 V | 57 | Tray | A40MX02 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A40MX02-1PL68 | 92 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 0°C ~ 70°C (TA) | MX | 0.5 % | e0 | 25 ppm/°C | 24.4 kΩ | Tin/Lead (Sn/Pb) | 155 °C | -55 °C | Thin Film | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 125 mW | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 225 | 1.27 mm | compliant | 68 | S-PQCC-J68 | 不合格 | COMMERCIAL | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 2.3 ns | 295 | 3000 | 650 µm | 24.2316 mm | 24.2316 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-PL68 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | 68-PLCC (24.23x24.23) | 68 | Tray | 57 | 微芯片技术 | PLASTIC, LCC-68 | CHIP CARRIER | PLASTIC/EPOXY | 3.3 V | 未说明 | 3 V | 70 °C | 无 | A40MX04-PL68 | 80 MHz | QCCJ | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | LCC | 200 V | 1206 | 3216 | + 155 C | 0.000571 oz | - 55 C | 5000 | PCB 安装 | Vishay | Vishay / Dale | Details | Obsolete | A40MX04 | 0°C ~ 70°C (TA) | Reel | CRCW-C e3 | 1 % | e0 | 100 PPM / C | 5.11 Ohms | 锡铅 | 商用级 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | Resistors | 250 mW (1/4 W) | 厚膜 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 未说明 | 1.27 mm | compliant | 68 | SMD/SMT | S-PQCC-J68 | 不合格 | COMMERCIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 厚膜电阻器 | 6000 | 2.7 ns | 547 | 6000 | 贴片厚膜电阻器 | - | Thick Film Resistors - SMD | 0.55 mm | 3.2 mm | 1.6 mm |
A54SX16P-1VQ100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-PQ160M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08A-2TQ100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX02-3PL44I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX09-PQ144M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX04-PQ100M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX02-VQ80A
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX250-PQ208M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX04-PL68M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX04-3PL44I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-1PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-2PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE3000L-PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010-1TQ144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL005S-1TQG144T2
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL005S-1VFG400
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
148.576372
M1A3P600-PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS250-2PQG208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1415A-1PQ100M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2S090-FG676ESX423
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3PE3000L-FGG896M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2S010-TQG144ES
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600L-PQG208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX02-1PL68
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX04-PL68
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
