品牌是'Microchip' (5152)
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![]() | 5962-0422113VXC | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RT4G150-1CQG352B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 352-BFCQFP Exposed Pad | 352-QFP (48x48) | 微芯片技术 | Bulk | 活跃 | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P600L-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M1A3P600L-1PQG208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | e3 | 哑光锡 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P400-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 100 °C | 有 | M1A3P400-1FGG484I | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | BGA, | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 不合格 | INDUSTRIAL | 9216 CLBS, 400000 GATES | 2.44 mm | 现场可编程门阵列 | 9216 | 400000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P600L-PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M1A3P600L-PQG208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | e3 | 哑光锡 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS250-2PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 1.575 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | RECTANGULAR | QFF | M1AFS250-2PQG208I | 有 | 85 °C | 1.425 V | 40 | 1.5 V | -40 °C | PLASTIC/EPOXY | 3 | FLATPACK | QFF, | 5.82 | e3 | 哑光锡 | 8542.39.00.01 | CMOS | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 6144 | 250000 | 30.6 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | M1AFS600-1PQG208I | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | QFF, | e3 | 哑光锡 | 8542.39.00.01 | CMOS | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 600000 | 30.6 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS250-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | M1AFS250-1PQG208I | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | QFF, | e3 | 哑光锡 | 8542.39.00.01 | CMOS | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 6144 | 250000 | 30.6 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS250-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | M1AFS250-2PQ208I | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | QFF, | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | QUAD | FLAT | 225 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 6144 | 250000 | 30.6 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-1PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 1.425 V | 85 °C | 有 | M1AFS600-1PQG208 | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | QFF, | FLATPACK | e3 | 哑光锡 | 8542.39.00.01 | CMOS | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | OTHER | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 600000 | 30.6 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M7AFS600-PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 5.8 | 1.575 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | FQFP | M7AFS600-PQG208I | 有 | 85 °C | 1.425 V | 40 | 1.5 V | -40 °C | FQFP, | e3 | 哑光锡 | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-TQ144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 20 X 20 MM, 0.50 MM PITCH, TQFP-144 | FLATPACK, LOW PROFILE, FINE PITCH | 微芯片技术 | 3 | PLASTIC/EPOXY | 1.2 V | 20 | 1.14 V | 无 | M2GL005S-TQ144I | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.26 V | 5.57 | 84 | Tray | Obsolete | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | 鸥翼 | 240 | 0.5 mm | compliant | S-PQFP-G144 | 1.6 mm | 现场可编程门阵列 | 6060 | 719872 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P600L-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.2 V | 30 | 1.14 V | 70 °C | 无 | M1A3P600L-PQ208 | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | COMMERCIAL | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | M1AFS600-1PQ208 | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | QFF, | FLATPACK | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | QUAD | FLAT | 225 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | OTHER | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 600000 | 30.6 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000L-FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M1A3P1000L-FGG484I | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 300 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 24576 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000L-1FGG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | M1A3P1000L-1FGG484 | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 300 | 不合格 | 1.5/3.3 V | COMMERCIAL | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 24576 | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P600L-1FGG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M1A3P600L-1FGG256I | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.26 | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005-1TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | Obsolete | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 微芯片技术 | 3 | PLASTIC/EPOXY | 1.2 V | 20 | 1.14 V | 85 °C | 无 | M2GL005-1TQ144 | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.26 V | 5.57 | 84 | Tray | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | 鸥翼 | 240 | 0.5 mm | compliant | S-PQFP-G144 | OTHER | 1.6 mm | 现场可编程门阵列 | 6060 | 719872 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL100-FC1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.88 | 网格排列 | PLASTIC | BGA1152,34X34,40 | 1.2 V | 无 | M2GL100-FC1152 | 现场可编程门阵列 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 现场可编程门阵列 | 99512 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-FG896ES | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RT4G150-CGG1657M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 1657-BFCPGA | 1657-CCGA (42.5x42.5) | 微芯片技术 | Bulk | 活跃 | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RT4G150-LGG1657R | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1657-BCLGA | 1657-CLGA (42.5x42.5) | 微芯片技术 | 活跃 | Bulk | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RT4G150L-CGG1657E | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 1657-BFCPGA | 1657-CCGA (42.5x42.5) | 微芯片技术 | Bulk | 活跃 | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600L-1FGG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 1206 (3216 Metric) | YES | 144 | 1206 | 400.011771 mg | 144 | RS73F2BRT | 活跃 | 8542390000/8542390000/8542390000/8542390000/8542390000 | 97 | KOA Speer Electronics, Inc. | Compliant | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | A3P600L-1FGG144 | 350 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 1.37 | Tape & Reel (TR) | -55°C ~ 155°C | RS73-RT | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.25% | e1 | 2 | ±25ppm/°C | 360 Ohms | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 厚膜 | 0.333W, 1/3W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | 不合格 | - | 1.5/3.3 V | COMMERCIAL | 13.5 kB | 5 mA | 97 | 13824 CLBS, 600000 GATES | 1.55 mm | 现场可编程门阵列 | 110592 | 600000 | 892.86 MHz | 1 | 13824 | 13824 | 13824 | 1.26 V | 1.14 V | 600000 | Automotive AEC-Q200 | 1.05 mm | 0.028 (0.70mm) | 13 mm | 13 mm | 无 | AEC-Q200 | |||||
![]() | A3P600-FG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | 97 | Compliant | A3P600 | PEI-Genesis | 5.23 | 1.575 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | LBGA | 350 MHz | A3P600-FG144I | 无 | 100 °C | 1.425 V | 30 | 1.5 V | -40 °C | PLASTIC/EPOXY | 3 | GRID ARRAY, LOW PROFILE | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | 活跃 | Bulk | -40°C ~ 100°C (TJ) | * | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 225 | 1 mm | compliant | 231 MHz | S-PBGA-B144 | 不合格 | INDUSTRIAL | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | 现场可编程门阵列 | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 1.575 V | 1.425 V | 600000 | 1.05 mm | 13 mm | 13 mm | 无 |
5962-0422113VXC
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
RT4G150-1CQG352B
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600L-1PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P400-1FGG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600L-PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS250-2PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS600-1PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS250-1PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS250-2PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS600-1PQG208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M7AFS600-PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL005S-TQ144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600L-PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS600-1PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P1000L-FGG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P1000L-1FGG484
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600L-1FGG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL005-1TQ144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL100-FC1152
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2S050T-FG896ES
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
RT4G150-CGG1657M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
RT4G150-LGG1657R
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
RT4G150L-CGG1657E
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600L-1FGG144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600-FG144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
