Microchip的片上系统（SoC）_正品采购_价格信息

品牌是'Microchip' (873)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	供应商器件包装	材料	终端数量																									厂商																																		操作温度	包装	系列	JESD-609代码	无铅代码	终端	端子表面处理	组成	应用	附加功能	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	深度	Reach合规守则	时间@峰值回流温度-最大值(s)	输出量	引脚数量	JESD-30代码	资历状况	输出类型	工作电源电压	电源	温度等级	速度
M2S010-1TQG144I	Microchip	数据表	2685 In Stock	1: ¥304.228509 10: ¥287.008030 100: ¥270.762289 500: ¥255.436124 查看所有的价格 -	最小起订量: 1 最小包装量: 1	144-LQFP	144-TQFP (20x20)	Steel	微芯片技术	1.2000 V	84	Tray	M2S010	活跃	-	166 MHz	12084 LE	SMD/SMT	-	64 kB					30.18 mm	25.4 mm	Straight	CGB399	cUL, UL	Round	Crouse-Hinds Industrial Produc	Bushing Grip with Strain Relief	无	-40 to 100 °C		SmartFusion®2					Metallic																								166MHz	64KB	ARM® Cortex®-M3	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1	FPGA - 10K Logic Modules			1 Core		256KB
M2S025T-1VFG256I	Microchip	数据表	2853 In Stock	1: ¥995.282804 10: ¥938.946045 100: ¥885.798154 500: ¥835.658639 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LBGA	256-FPBGA (17x17)	微芯片技术	SMD/SMT	-	64 kB					1.2000 V	Compliant	138	Tray	M2S025	活跃	-	166 MHz	27696 LE	-40 to 100 °C		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1	FPGA - 25K Logic Modules			1 Core		256KB
A2F060M3E-TQG144I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	144	80 MHz	LFQFP	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.575 V	8.63						LFQFP, QFP144,.87SQ,20		FLATPACK, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	QFP144,.87SQ,20	1.5 V	30	1.425 V	有	A2F060M3E-TQG144I				e3			PURE MATTE TIN (394)				8542.39.00.01	现场可编程门阵列	CMOS	QUAD	鸥翼	250	0.5 mm		compliant				S-PQFP-G144		33	不合格				1.5,1.8,2.5,3.3 V									33	1536 CLBS, 60000 GATES	1.6 mm	现场可编程门阵列					1536	1536		60000										20 mm	20 mm
M2S005-TQG144	Microchip	数据表	221 In Stock	1: ¥132.988923 10: ¥125.461247 100: ¥118.359670 500: ¥111.660063 查看所有的价格 -	最小起订量: 1 最小包装量: 1	144-LQFP	144-TQFP (20x20)	微芯片技术	166 MHz	6060 LE	+ 85 C	0.035380 oz	0 C	60	SMD/SMT	505 LAB	Microchip	Microchip Technology / Atmel	Details	-	64 kB						84	Tray	M2S005	活跃	有	-	191 kbit	0°C ~ 85°C (TJ)	Tray	SmartFusion®2									SOC - Systems on a Chip																	1.2 V			166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					SoC FPGA			FPGA - 5K Logic Modules			1 Core		128KB				SoC FPGA
A2F060M3E-CSG288	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	288		TFBGA,	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	1.5 V	1.425 V		85 °C	A2F060M3E-CSG288	TFBGA	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.575 V	8.46															8542.39.00.01		CMOS	BOTTOM	BALL		0.5 mm		compliant				S-PBGA-B288								OTHER									1536 CLBS, 60000 GATES	1.05 mm	现场可编程门阵列					1536			60000										11 mm	11 mm
A2F060M3E-1FGG256	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	256	85 °C	有	A2F060M3E-1FGG256	100 MHz	LBGA	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.575 V	5.8							LBGA, BGA256,16X16,40	GRID ARRAY, LOW PROFILE	3	PLASTIC/EPOXY	BGA256,16X16,40	1.5 V	30	1.425 V				e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	1 mm		compliant				S-PBGA-B256		66	不合格				1.5,1.8,2.5,3.3 V	OTHER								66	1536 CLBS, 60000 GATES	1.7 mm	现场可编程门阵列					1536	1536		60000										17 mm	17 mm
M2S050T-FG484I	Microchip	数据表	2861 In Stock	1: ¥1,695.468226 10: ¥1,599.498324 100: ¥1,508.960688 500: ¥1,423.547814 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	微芯片技术				267	Tray	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB			-40°C ~ 100°C (TJ)		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 50K Logic Modules			1 Core		256KB
A2F060M3E-1CSG288I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	288	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.575 V	5.25						TFBGA, BGA288,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH		PLASTIC/EPOXY	BGA288,21X21,20	1.5 V	30	1.425 V	有	A2F060M3E-1CSG288I	100 MHz	TFBGA	SQUARE				e1			锡银铜				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	260	0.5 mm		compliant				S-PBGA-B288		68	不合格				1.5,1.8,2.5,3.3 V									68	1536 CLBS, 60000 GATES	1.05 mm	现场可编程门阵列					1536	1536		60000										11 mm	11 mm
M2S060T-VFG400I	Microchip	数据表	2184 In Stock	1: ¥1,693.197188 10: ¥1,597.355841 100: ¥1,506.939472 500: ¥1,421.641007 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	400-VFBGA (17x17)	微芯片技术	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB					1.2000 V	1.14 V	1.26 V	Non-Compliant	207	Tray	-40 to 100 °C		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 60K Logic Modules			1 Core		256KB
M2S025-VFG400I	Microchip	数据表	2874 In Stock	1: ¥873.658185 10: ¥824.205833 100: ¥777.552674 500: ¥733.540259 查看所有的价格 -	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	微芯片技术	207	Tray	M2S025	活跃						有	-	166 MHz	27696 LE	0.227784 oz	90	SMD/SMT	2308 LAB	Microchip	Microchip Technology / Atmel	Details	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2									SOC - Systems on a Chip																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					SoC FPGA		STD	FPGA - 25K Logic Modules			1 Core		256KB				SoC FPGA
A2F060M3E-CS288I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	288	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.575 V	5.84						11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, BGA-288	GRID ARRAY, THIN PROFILE, FINE PITCH		PLASTIC/EPOXY	BGA288,21X21,20	1.5 V	20	1.425 V	无	A2F060M3E-CS288I	80 MHz	TFBGA	SQUARE				e0			Tin/Lead/Silver (Sn/Pb/Ag)				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	235	0.5 mm		compliant				S-PBGA-B288		68	不合格				1.5,1.8,2.5,3.3 V									68	1536 CLBS, 60000 GATES	1.05 mm	现场可编程门阵列					1536	1536		60000										11 mm	11 mm
A2F060M3E-1FG256	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	256	85 °C	无	A2F060M3E-1FG256	100 MHz	LBGA	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.575 V	5.84							1 MM PITCH, FBGA-256	GRID ARRAY, LOW PROFILE	3	PLASTIC/EPOXY	BGA256,16X16,40	1.5 V	20	1.425 V				e0			Tin/Lead (Sn/Pb)				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	225	1 mm		unknown				S-PBGA-B256		66	不合格				1.5,1.8,2.5,3.3 V	OTHER								66	1536 CLBS, 60000 GATES	1.7 mm	现场可编程门阵列					1536	1536		60000										17 mm	17 mm
M2S025TS-FG484I	Microchip	数据表	2532 In Stock	1: ¥1,335.655032 10: ¥1,260.051918 100: ¥1,188.728228 500: ¥1,121.441722 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	微芯片技术				Non-Compliant	267	Tray	M2S025	活跃	-	166 MHz	27696 LE	SMD/SMT	-	64 kB		-40°C ~ 100°C (TJ)		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 25K Logic Modules			1 Core		256KB
M2S060T-VF400I	Microchip	数据表	2189 In Stock	1: ¥1,704.714192 10: ¥1,608.220935 100: ¥1,517.189562 500: ¥1,431.310906 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	微芯片技术	207	Tray	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S060T-VF400I	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.88			Non-Compliant	-40°C ~ 100°C (TJ)		SmartFusion®2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	0.8 mm		not_compliant				S-PBGA-B400		207	不合格				1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207		1.51 mm	现场可编程门阵列				FPGA - 60K Logic Modules		56520	1 Core		256KB						17 mm	17 mm
M2S150T-FCV484I	Microchip	数据表	2893 In Stock	1: ¥1,773.954838 10: ¥1,673.542303 100: ¥1,578.813492 500: ¥1,489.446685 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	微芯片技术	Tray	M2S150	活跃	-	166 MHz	146124 LE	-	64 kB	VFBGA-484	GRID ARRAY, FINE PITCH	5.81	1.26 V	MICROSEMI CORP	活跃	Microsemi Corporation	SQUARE	FBGA	M2S150T-FCV484I	无	1.14 V	30	1.2 V	BGA484,22X22,32	PLASTIC/EPOXY				273	-40°C ~ 100°C (TJ)		SmartFusion®2	e0			Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	0.8 mm		not_compliant				S-PBGA-B484		273	不合格				1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	273		3.15 mm	现场可编程门阵列				FPGA - 150K Logic Modules		146124	1 Core		512KB						19 mm	19 mm
M2S025-1FG484I	Microchip	数据表	2525 In Stock	1: ¥1,256.226786 10: ¥1,185.119609 100: ¥1,118.037369 500: ¥1,054.752233 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	微芯片技术				Clarostat-Honeywell	73JA500	1.2000 V	1.14 V	1.26 V	267	Tray	M2S025	活跃	-	166 MHz	27696 LE	SMD/SMT	-	64 kB			-40 to 100 °C		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1	FPGA - 25K Logic Modules			1 Core		256KB
M2S060T-FCSG325I	Microchip	数据表	2922 In Stock	1: ¥1,142.164631 10: ¥1,077.513808 100: ¥1,016.522458 500: ¥958.983450 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	DIN Rail,Surface	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	微芯片技术	CSA, UL	Syrelec, Brand of Crouzet Control	无	1	1.2000 V	1.14 V	1.26 V	8542390000	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	1.14 V	有	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	2.36		SHS1S24A	-40 to 100 °C		SmartFusion®2	e1		0.250 in Flat Blade	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN		现场可编程门阵列	CMOS	BOTTOM	BALL	250	0.5 mm		compliant	40			S-PBGA-B325		200	不合格				1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200		1.01 mm	现场可编程门阵列			STD	FPGA - 60K Logic Modules		56520			256KB	Interval		固态	IP66		11 mm	11 mm	无铅
M2S150-FCG1152	Microchip	数据表	2281 In Stock	1: ¥2,910.647054 10: ¥2,745.893448 100: ¥2,590.465517 500: ¥2,443.835394 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)	微芯片技术	Hollowshaft	Hollow	Danaher Controls	1.2000 V	574	Tray	M2S150	活跃						HS350100G134C	-40 to 70 Degrees C		SmartFusion®2			6 ft Cable																					5~26 VDC	Differential				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 150K Logic Modules					512KB			5~26 VDC			有	IP67	不包括
M2S150T-FCS536I	Microchip	数据表	2937 In Stock	1: ¥1,977.561596 10: ¥1,865.624151 100: ¥1,760.022782 500: ¥1,660.398848 查看所有的价格 -	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	微芯片技术	1.26 V	5.81				1.2000 V	1.14 V	1.26 V	293	Tray	M2S150	活跃	-	166 MHz	146124 LE	-	64 kB	FBGA-536	网格排列	PLASTIC/EPOXY	BGA536,30X30,20	1.2 V	30	1.14 V	无	M2S150T-FCS536I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	-40 to 100 °C		SmartFusion®2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240			not_compliant			536	S-PBGA-B536		293	不合格				1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	293			现场可编程门阵列			STD	FPGA - 150K Logic Modules		146124	1 Core		512KB
M2S060TS-1VFG400T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	微芯片技术	Tray	M2S060	活跃	,	3	40	有	活跃	MICROSEMI CORP	5.8						IRTR68	Miscellaneous	207	-40°C ~ 125°C (TJ)		Automotive, AEC-Q100, SmartFusion®2	e1	有		Tin/Silver/Copper (Sn/Ag/Cu)									250			compliant													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				现场可编程门阵列			1	FPGA - 60K Logic Modules					256KB
M2S060TS-1FGG676T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	676-FBGA (27x27)	微芯片技术				JHSN_DRIV_VSD-II	VS027431B-SM1P3	Johnson Controls	Panel	387	M2S060	活跃			-40°C ~ 125°C (TJ)		Automotive, AEC-Q100, SmartFusion®2															15.3125														166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						320 Hz	1	FPGA - 60K Logic Modules					256KB		480 VAC								9.40625
M2S025TS-1VFG256T2	Microchip	数据表	2219 In Stock	1: ¥1,498.019979 10: ¥1,413.226393 100: ¥1,333.232447 500: ¥1,257.766458 查看所有的价格 -	最小起订量: 1 最小包装量: 1	256-LBGA	256-FPBGA (17x17)	微芯片技术	Tray	M2S025	活跃						C7772G1004/U	Honeywell	无显示	1.2000 V	138	0 to 85 °C		Automotive, AEC-Q100, SmartFusion®2						Indoor												10 kOhm NTC			Temperature								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1	FPGA - 25K Logic Modules					256KB
M2S050T-VFG400	Microchip	数据表	2787 In Stock	1: ¥965.192790 10: ¥910.559236 100: ¥859.018148 500: ¥810.394475 查看所有的价格 -	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	微芯片技术	56340 LE	SMD/SMT	-	64 kB						1/4 NPT	2.5	25-410-1500-psi/kg/cm2	Lower Mount	0-1,500 psi	NOSHOK	1.2000 V	207	Tray	M2S050	活跃	-	166 MHz	0 to 85 °C		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 50K Logic Modules			1 Core		256KB
M2S050-1FG896I	Microchip	数据表	2902 In Stock	1: ¥1,612.871780 10: ¥1,521.577152 100: ¥1,435.450145 500: ¥1,354.198251 查看所有的价格 -	最小起订量: 1 最小包装量: 1	896-BGA	896-FBGA (31x31)	微芯片技术	-	166 MHz	56340 LE	SMD/SMT	-	64 kB						Electri-Flex	1.2000 V	377	Tray	M2S050	活跃	-40 to 100 °C		SmartFusion®2																			896										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1	FPGA - 50K Logic Modules			1 Core		256KB
A2F200M3F-1PQG208I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	208-BFQFP	YES	208-PQFP (28x28)	208	微芯片技术		1.5000 V	1.425 V	200000	1.575 V	MCU - 22, FPGA - 66	Tray	A2F200	活跃	28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208	FLATPACK, FINE PITCH	3	PLASTIC/EPOXY	QFP208,1.2SQ,20	1.5 V	30	1.425 V	有	A2F200M3F-1PQG208I	100 MHz	FQFP	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.575 V	5.59			-40 to 100 °C		SmartFusion®		有		Pure Matte Tin (Sn)				8542.39.00.01	现场可编程门阵列	CMOS	QUAD	鸥翼	245	0.5 mm		compliant				S-PQFP-G208		66	不合格				1.5,1.8,2.5,3.3 V		100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	66	4608 CLBS, 200000 GATES	4.1 mm	现场可编程门阵列			1	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	4608	4608		200000	256KB						28 mm	28 mm