Microchip的片上系统（SoC）_正品采购_价格信息

品牌是'Microchip' (873)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量		Core															厂商																																	操作温度	包装	系列	JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	界面	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	数据总线宽度	输入数量
M2S010TS-VFG256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-256	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	M2S010	活跃			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	119	138	Tray	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 10K Logic Modules		1 Core	256KB
M2S025-VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃		-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 25K Logic Modules		1 Core	256KB
M2S050-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	200	Tray	微芯片技术	M2S050	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S050-FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	1.2000 V	1.14 V	1.26 V	0 to 85 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant		S-PBGA-B325	200	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200	1.01 mm	现场可编程门阵列			STD	FPGA - 50K Logic Modules	56340	1 Core	256KB		11 mm	11 mm
M2S005S-1VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	161	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	119	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 5K Logic Modules		1 Core	128KB
M2S025-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	Tray	M2S025	微芯片技术	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S025-FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	176	1.2000 V	1.26 V	180	0 to 85 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant		S-PBGA-B325	180	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.01 mm	现场可编程门阵列				FPGA - 25K Logic Modules	27696	1 Core	256KB		11 mm	11 mm
M2S005-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	505 LAB	60	MSL 3 - 168 hours	209	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					191Kbit			FPGA - 5K Logic Modules		1 Core	128KB
M2S010-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	1.2000 V	1.14 V	1.26 V	233	微芯片技术	Tray	M2S010	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S010-1FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	0 to 85 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B484	233	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233	2.44 mm	现场可编程门阵列			1	FPGA - 10K Logic Modules	9744	1 Core	256KB		23 mm	23 mm
M2S060T-1FG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	微芯片技术	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	85 °C	无	M2S060T-1FG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	40	SmartFusion2	387	Tray	M2S060	活跃	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B676	387	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		387	2.44 mm	现场可编程门阵列				FPGA - 60K Logic Modules	56520	1 Core	256KB		27 mm	27 mm
M2S060T-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	M2S060	活跃			SmartFusion2	60	4710 LAB	有	56520 LE	64 kB	-	-	166 MHz	N	This product may require additional documentation to export from the United States.	267	Tray	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 60K Logic Modules		1 Core	256KB
M2S025-VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LBGA	YES	256-FPBGA (17x17)	256	ARM Cortex M3	微芯片技术	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S025-VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	119	1.2000 V	138	Tray	M2S025	活跃	0 to 85 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant		S-PBGA-B256	138	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		138	1.56 mm	现场可编程门阵列			STD	FPGA - 25K Logic Modules	27696	1 Core	256KB		14 mm	14 mm
M2S050T-FG896	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-896	896-FBGA (31x31)	ARM Cortex M3	微芯片技术	166 MHz	-	-	64 kB	56340 LE	377 I/O	0 C	+ 85 C	1.314 Mbit	64 kB	有	4695 LAB	27	Tray	M2S050	Obsolete				This product may require additional documentation to export from the United States.	N	SMD/SMT	0°C ~ 85°C (TJ)	Tray	SmartFusion2																	1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 50K Logic Modules		1 Core	256KB
M2S010S-TQG144	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	-	64 kB	12084 LE	84 I/O	0 C	+ 85 C	400 kbit	1007 LAB	60	1.2000 V	Tray	M2S010	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	0 to 85 °C	Tray	SmartFusion2																	1.2 V				166MHz	64KB	ARM® Cortex®-M3	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 10K Logic Modules		1 Core	256KB
M2S060T-1FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	1314 kbit	4710 LAB	60	SmartFusion2	微芯片技术	Tray	M2S060	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	-55 °C	1.2 V	40	1.14 V	125 °C	有	M2S060T-1FGG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56520 LE	267 I/O	- 55 C	+ 125 C	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e1	有	3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01		BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B484			1.2 V		MILITARY		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			2.44 mm	现场可编程门阵列				FPGA - 60K Logic Modules		1 Core	256KB		23 mm	23 mm
M2S060TS-1FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	1314 kbit	4710 LAB	60	SmartFusion2	微芯片技术	Tray	M2S060	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	-55 °C	1.2 V	40	1.14 V	125 °C	有	M2S060TS-1FGG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56520 LE	267 I/O	- 55 C	+ 125 C	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e1	有	3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01		BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B484			1.2 V		MILITARY		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			2.44 mm	现场可编程门阵列				FPGA - 60K Logic Modules		1 Core	256KB		23 mm	23 mm
M2S150TS-1FCSG536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	536-CSPBGA (16x16)	ARM Cortex M3	微芯片技术	-	-	64 kB	146124 LE	有	12177 LAB	90	RISC	1.2, 1.5, 1.8, 2.5, 3.3 V	1	有	293	Tray	M2S150	活跃	Industrial grade				This product may require additional documentation to export from the United States.	Details	166 MHz	-40 to 100 °C	Tray	SmartFusion2													536				1.2 V			CAN/Ethernet/Serial	166MHz	64 KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	32 Bit					Industrial		FPGA - 150K Logic Modules		1 Core	512KB	ARM Cortex-M3
M2S090-1FGG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	YES	676-FBGA (27x27)	676	ARM Cortex M3	活跃	微芯片技术	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	85 °C	有	M2S090-1FGG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.27		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	40	425	Tray	M2S090	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B676	425	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		425	2.44 mm	现场可编程门阵列				FPGA - 90K Logic Modules	86316	1 Core	512KB		27 mm	27 mm
M2S050T-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	1.2000 V	1.14 V	1.26 V	267	微芯片技术	Tray	M2S050	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S050T-FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	60	0 to 85 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B484	267	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列			STD	FPGA - 50K Logic Modules	48672	1 Core	256KB		23 mm	23 mm
MPFS025TS-FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA	325-BGA (11x11)	RV64GC, RV64IMAC	微芯片技术		This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	23000 LE	108 I/O	- 40 C	+ 100 C	1	Tray	活跃			-40°C ~ 100°C	Tray	-																	1 V				-	230.4KB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 23K Logic Modules		5 Core	128KB
MPFS025TL-FCSG325E	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA	325-BGA (11x11)	RV64GC, RV64IMAC	微芯片技术		This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	23000 LE	108 I/O	0 C	+ 100 C	1	Tray	活跃			0°C ~ 100°C	Tray	-																	1 V				-	230.4KB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 23K Logic Modules		5 Core	128KB
MPFS025TL-FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA	325-BGA (11x11)	RV64GC, RV64IMAC	微芯片技术		This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	23000 LE	108 I/O	- 40 C	+ 100 C	1	Tray	活跃			-40°C ~ 100°C	Tray	-																	1 V				-	230.4KB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 23K Logic Modules		5 Core	128KB
MPFS025TS-1FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	RV64GC, RV64IMAC	微芯片技术		-	23000 LE	108 I/O	- 40 C	+ 100 C	1	This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	Tray	活跃			-40°C ~ 100°C	Tray	-																	1 V				-	230.4KB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 23K Logic Modules		5 Core	128KB
MPFS025T-1FCVG484E	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCVG-484	484-FCBGA (19x19)	RV64GC, RV64IMAC	微芯片技术	活跃				SMD/SMT	This product may require additional documentation to export from the United States.	1	+ 100 C	0 C	108 I/O	23000 LE	-	4 x 32 kB	16 kB, 4 x 32 kB	667 MHz, 667 MHz	MSL 3 - 168 hours	Tray	0°C ~ 100°C	Tray	-																	1 V				-	230.4KB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA					1843.2Kbit			FPGA - 23K Logic Modules		5 Core	128KB
MPFS025T-FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCSG-325	325-BGA (11x11)	RV64GC, RV64IMAC	微芯片技术		SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	23000 LE	108 I/O	0 C	+ 100 C	1	MSL 3 - 168 hours	Tray	活跃			-40°C ~ 100°C	Tray	-																	1 V				-	230.4KB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA					1843.2Kbit			FPGA - 23K Logic Modules		5 Core	128KB
MPFS095TL-FCSG536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-536	536-LFBGA	RV64GC, RV64IMAC	微芯片技术		This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	93000 LE	276 I/O	- 40 C	+ 100 C	1	Tray	活跃			-40°C ~ 100°C	Tray	PolarFire®																	1 V				-	857.6kB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 93K Logic Modules		5 Core	128kB
MPFS250TS-FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	484-FCBGA (19x19)	RV64GC, RV64IMAC	微芯片技术		This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	254000 LE	372 I/O	- 40 C	+ 100 C	1	Tray	活跃			-40°C ~ 100°C	Tray	PolarFire™																	1 V				-	2.2MB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 254K Logic Modules		5 Core	128kB