品牌是'Microchip' (873)

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品牌

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Rohs

生命周期状态

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表面安装

供应商器件包装

终端数量

Core

厂商

操作温度

包装

系列

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

总 RAM 位数

阀门数量

速度等级

主要属性

逻辑块数量

逻辑单元数

核数量

等效门数

闪光大小

长度

宽度

M2S090TS-1FCS325
M2S090TS-1FCS325
Microchip Technology 数据表

2177 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-325

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

180

微芯片技术

Tray

M2S090

活跃

TFBGA, BGA325,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

M2S090TS-1FCS325

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

176

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

M2S025-1VF400
M2S025-1VF400
Microchip Technology 数据表

2545 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

2308 LAB

90

1.2000 V

微芯片技术

1.14 V

1.26 V

207

Tray

M2S025

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

M2S025-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 25K Logic Modules

23988

1 Core

256KB

17 mm

17 mm

M2S050-1FGG896
M2S050-1FGG896
Microchip Technology 数据表

2982 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-896

YES

896-FBGA (31x31)

896

ARM Cortex M3

377

微芯片技术

Tray

M2S050

活跃

FBGA-896

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

1.14 V

85 °C

M2S050-1FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.26

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

27

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm

M2S060TS-FG676I
M2S060TS-FG676I
Microchip Technology 数据表

2748 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

676-FBGA (27x27)

ARM Cortex M3

微芯片技术

4710 LAB

40

SmartFusion2

387

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S025TS-VFG400I
M2S025TS-VFG400I
Microchip Technology 数据表

2594 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

M2S025

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

1.14 V

M2S025TS-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

90

207

Tray

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

40

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

17 mm

17 mm

M2S050TS-1FCS325
M2S050TS-1FCS325
Microchip Technology 数据表

2076 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

4695 LAB

176

200

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

M2S025TS-FCS325
M2S025TS-FCS325
Microchip Technology 数据表

2497 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

180

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S150TS-1FCV484I
M2S150TS-1FCV484I
Microchip Technology 数据表

889 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

YES

484-FBGA (19x19)

484

ARM Cortex M3

微芯片技术

VFBGA-484

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

M2S150TS-1FCV484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

12177 LAB

84

273

Tray

M2S150

活跃

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B484

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

1 Core

512KB

19 mm

19 mm

M2S150TS-1FCS536
M2S150TS-1FCS536
Microchip Technology 数据表

2543 In Stock

-

最小起订量: 1

最小包装量: 1

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

ARM Cortex M3

微芯片技术

146124 LE

64 kB

-

-

166 MHz

N

1.2000 V

1.14 V

1.26 V

293

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

90

12177 LAB

0 to 85 °C

Tray

SmartFusion2

536

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 150K Logic Modules

1 Core

512KB

M2S050T-1FGG484M
M2S050T-1FGG484M
Microchip Technology 数据表

2156 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

267

微芯片技术

Tray

M2S050

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

1.14 V

125 °C

M2S050T-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

60

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

40

S-PBGA-B484

267

不合格

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

M2S025-1FCSG325
M2S025-1FCSG325
Microchip Technology 数据表

6 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

2308 LAB

176

180

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

A2F200M3F-1CS288I
A2F200M3F-1CS288I
Microchip Technology 数据表

59 In Stock

-

最小起订量: 1

最小包装量: 1

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

ARM Cortex M3

MCU - 31, FPGA - 78

Tray

微芯片技术

A2F200

活跃

TFBGA, BGA288,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA288,21X21,20

-40 °C

1.5 V

20

1.425 V

100 °C

A2F200M3F-1CS288I

100 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

1.56

N

100 MHz

-

-

64 kB

2000 LE

-

176

SmartFusion

-40°C ~ 100°C (TJ)

Tray

A2F200

e0

锡铅银

8542.39.00.01

CMOS

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

4608 CLBS, 200000 GATES

1.05 mm

现场可编程门阵列

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

11 mm

11 mm

A2F200M3F-PQ208I
A2F200M3F-PQ208I
Microchip Technology 数据表

10 In Stock

-

最小起订量: 1

最小包装量: 1

208-BFQFP

YES

208-PQFP (28x28)

208

ARM Cortex M3

- 40 C

+ 100 C

-

微芯片技术

24

SmartFusion

Tray

A2F200

Obsolete

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

20

1.425 V

A2F200M3F-PQ208I

80 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.61

N

SMD/SMT

80 MHz

-

-

64 kB

2000 LE

113 I/O

-40°C ~ 100°C (TJ)

Tray

A2F200

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

66

不合格

1.5,1.8,2.5,3.3 V

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

4608 CLBS, 200000 GATES

4.1 mm

现场可编程门阵列

200000

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

28 mm

28 mm

M2S060TS-1VFG400I
M2S060TS-1VFG400I
Microchip Technology 数据表

2927 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

4710 LAB

90

SmartFusion2

207

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56520 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S060TS-VFG400I
M2S060TS-VFG400I
Microchip Technology 数据表

2486 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

Tray

M2S060

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

1.14 V

M2S060TS-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56520 LE

4710 LAB

90

SmartFusion2

207

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

40

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

M2S025T-FCSG325
M2S025T-FCSG325
Microchip Technology 数据表

164 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

ARM Cortex M3

176

0.111027 oz

2.5, 3.3 V

微芯片技术

MSL 3 - 168 hours

180

Tray

M2S025

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

M2S025T-FCSG325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

27696 LE

2308 LAB

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

592Kbit

STD

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

M2S050TS-1FGG484I
M2S050TS-1FGG484I
Microchip Technology 数据表

2434 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

56340 LE

4695 LAB

60

267

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

M2S005S-FG484I
M2S005S-FG484I
Microchip Technology 数据表

44 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

6060 LE

505 LAB

60

209

Tray

M2S005

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S150TS-FCVG484
M2S150TS-FCVG484
Microchip Technology 数据表

2226 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

484-FBGA (19x19)

ARM Cortex M3

微芯片技术

84

273

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

146124 LE

12177 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

M2S150T-FCS536
M2S150T-FCS536
Microchip Technology 数据表

2978 In Stock

-

最小起订量: 1

最小包装量: 1

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

ARM Cortex M3

微芯片技术

90

293

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

12177 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

M2S150TS-1FCVG484I
M2S150TS-1FCVG484I
Microchip Technology 数据表

2577 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

484-FBGA (19x19)

ARM Cortex M3

微芯片技术

84

273

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

146124 LE

12177 LAB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

M2S050TS-1FGG484M
M2S050TS-1FGG484M
Microchip Technology 数据表

2854 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

60

267

微芯片技术

Tray

M2S050

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

40

1.14 V

125 °C

M2S050TS-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

M2S025T-1FGG484M
M2S025T-1FGG484M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

2308 LAB

60

267

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S090TS-1FGG484T2
M2S090TS-1FGG484T2
Microchip Technology 数据表

2736 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

86316 LE

267 I/O

- 40 C

+ 125 C

2074 kbit

7193 LAB

60

2.110353 oz

Tray

M2S090

活跃

SMD/SMT

166 MHz

-

-

64 kB

-40°C ~ 125°C (TJ)

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

1 Core

512KB

A2F500M3G-CS288I
A2F500M3G-CS288I
Microchip Technology 数据表

9 In Stock

-

最小起订量: 1

最小包装量: 1

288-TFBGA, CSPBGA

288-CSP (11x11)

ARM Cortex M3

微芯片技术

-

176

SmartFusion

MCU - 31, FPGA - 78

Tray

A2F500

活跃

This product may require additional documentation to export from the United States.

N

80 MHz

-

-

64 kB

6000 LE

-40°C ~ 100°C (TJ)

Tray

A2F500

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB