Microchip的片上系统（SoC）_正品采购_价格信息

品牌是'Microchip' (873)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量			Core										厂商																													操作温度	包装	系列	JESD-609代码	端子表面处理	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	JESD-30代码	输出的数量	资历状况	电源	温度等级	界面	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	速度等级	主要属性	逻辑块数量	逻辑单元数
M2S060-1FG676	Microchip Technology	数据表	2095 In Stock	1: ¥1,726.996656 10: ¥1,629.242131 100: ¥1,537.020876 500: ¥1,450.019697 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	有	4710 LAB	40	SmartFusion2	微芯片技术	活跃	M2S060	Tray	387	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	85 °C	无	M2S060-1FG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B676	387	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	387		2.44 mm	现场可编程门阵列		FPGA - 60K Logic Modules		56520	1 Core	256KB	27 mm	27 mm
M2S025-1VFG256	Microchip Technology	数据表	9 In Stock	1: ¥733.912501 10: ¥692.370282 100: ¥653.179510 500: ¥616.207082 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-256	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2																		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 25K Logic Modules			1 Core	256KB
M2S050TS-1VF400I	Microchip Technology	数据表	2514 In Stock	1: ¥1,462.714718 10: ¥1,379.919547 100: ¥1,301.810893 500: ¥1,228.123487 查看所有的价格 -	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	N	This product may require additional documentation to export from the United States.	微芯片技术	207	Tray	M2S050	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S050TS-1VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		90	4695 LAB	有	56340 LE	64 kB	-	-	166 MHz	SMD/SMT	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)		8542.39.00.01		BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B400						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			1.51 mm	现场可编程门阵列	1	FPGA - 50K Logic Modules			1 Core	256KB	17 mm	17 mm
M2S090T-FG484I	Microchip Technology	数据表	2012 In Stock	1: ¥2,915.775096 10: ¥2,750.731219 100: ¥2,595.029455 500: ¥2,448.140996 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	86316 LE	有	7193 LAB	60	微芯片技术	267	Tray	M2S090	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	无	M2S090T-FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.83		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B484	267	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267		2.44 mm	现场可编程门阵列		FPGA - 90K Logic Modules		86316	1 Core	512KB	23 mm	23 mm
M2S150-FC1152	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	ARM Cortex M3	有	12177 LAB	24	1.2000 V	微芯片技术	574	Tray	M2S150	活跃	FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	30	1.14 V	85 °C	无	M2S150-FC1152	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	0 to 85 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B1152	574	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	574		2.9 mm	现场可编程门阵列	STD	FPGA - 150K Logic Modules		146124	1 Core	512KB	35 mm	35 mm
M2S090TS-FCSG325I	Microchip Technology	数据表	2187 In Stock	1: ¥2,182.227919 10: ¥2,058.705585 100: ¥1,942.175083 500: ¥1,832.240638 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	64 kB	86316 LE	有	7193 LAB	176	微芯片技术	1.2, 1.5, 1.8, 2.5, 3.3 V	180	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S090TS-FCSG325I	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.8		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant		R-PBGA-B325	180	不合格	1.2 V		CAN/Ethernet/Serial	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180		1.16 mm	现场可编程门阵列		FPGA - 90K Logic Modules		86316	1 Core	512KB	13.5 mm	11 mm
M2S060T-FG676I	Microchip Technology	数据表	2413 In Stock	1: ¥1,877.192593 10: ¥1,770.936405 100: ¥1,670.694724 500: ¥1,576.127098 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	676-FBGA (27x27)	ARM Cortex M3	微芯片技术	64 kB	56520 LE	有	4710 LAB	40	SmartFusion2	387	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 60K Logic Modules			1 Core	256KB
M2S050TS-1VFG400	Microchip Technology	数据表	2280 In Stock	1: ¥1,804.957423 10: ¥1,702.790023 100: ¥1,606.405684 500: ¥1,515.477060 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	-	64 kB	56340 LE	有	4695 LAB	90	207	Tray	M2S050	活跃			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2																		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 50K Logic Modules			1 Core	256KB
M2S060-1FGG484I	Microchip Technology	数据表	2453 In Stock	1: ¥1,853.393512 10: ¥1,748.484446 100: ¥1,649.513624 500: ¥1,556.144934 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	64 kB	56520 LE	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 60K Logic Modules			1 Core	256KB
M2S025T-1VF400I	Microchip Technology	数据表	2335 In Stock	1: ¥1,198.489814 10: ¥1,130.650765 100: ¥1,066.651671 500: ¥1,006.275158 查看所有的价格 -	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	-	64 kB	27696 LE	有	2308 LAB	90	微芯片技术	1.2000 V	1.14 V	1.26 V	207	Tray	M2S025	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S025T-1VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-40 to 100 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B400	160	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160		1.51 mm	现场可编程门阵列	1	FPGA - 25K Logic Modules		23988	1 Core	256KB	17 mm	17 mm
M2S060T-1VFG400	Microchip Technology	数据表	2178 In Stock	1: ¥1,705.796281 10: ¥1,609.241774 100: ¥1,518.152615 500: ¥1,432.219453 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	4710 LAB	90	SmartFusion2	微芯片技术	207	Tray	M2S060	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	1.14 V	85 °C	有	M2S060T-1VFG400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	40	S-PBGA-B400	207	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207		1.51 mm	现场可编程门阵列		FPGA - 60K Logic Modules		56520	1 Core	256KB	17 mm	17 mm
M2S090-FCSG325	Microchip Technology	数据表	2450 In Stock	1: ¥1,477.445763 10: ¥1,393.816760 100: ¥1,314.921466 500: ¥1,240.491956 查看所有的价格 -	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	86316 LE	有	7193 LAB	176	180	微芯片技术	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S090-FCSG325	TFBGA	RECTANGULAR	活跃	FPGA - Field Programmable Gate Array SmartFusion2	MICROSEMI CORP	1.26 V	5.78		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant		R-PBGA-B325	180	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180		1.16 mm	现场可编程门阵列		FPGA - 90K Logic Modules		86316	1 Core	512KB	13.5 mm	11 mm
M2S010-1VFG256	Microchip Technology	数据表	9 In Stock	1: ¥491.238172 10: ¥463.432235 100: ¥437.200228 500: ¥412.453045 查看所有的价格 -	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (17x17)	256	ARM Cortex M3	-	64 kB	12084 LE	有	1007 LAB	119	微芯片技术	1.2000 V	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S010-1VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	0 to 85 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant		S-PBGA-B256	138	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138		1.56 mm	现场可编程门阵列	1	FPGA - 10K Logic Modules		12084	1 Core	256KB	14 mm	14 mm
M2S150TS-1FCG1152I	Microchip Technology	数据表	2904 In Stock	1: ¥4,119.221481 10: ¥3,886.058002 100: ¥3,666.092451 500: ¥3,458.577791 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FCBGA-1152	1152-FCBGA (35x35)	ARM Cortex M3	微芯片技术	Details	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	1.2000 V	574	Tray	M2S150	活跃				This product may require additional documentation to export from the United States.	-40 to 100 °C	Tray	SmartFusion2																		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					1	FPGA - 150K Logic Modules			1 Core	512KB
M2S090TS-FCS325	Microchip Technology	数据表	2437 In Stock	1: ¥1,964.105204 10: ¥1,852.929439 100: ¥1,748.046638 500: ¥1,649.100601 查看所有的价格 -	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	有	7193 LAB	176	1.2000 V	微芯片技术	180	Tray	M2S090	活跃	TFBGA, BGA325,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S090TS-FCS325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.83		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	86316 LE	0 to 85 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant		R-PBGA-B325	180	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180		1.16 mm	现场可编程门阵列	STD	FPGA - 90K Logic Modules		86316	1 Core	512KB	13.5 mm	11 mm
M2S005S-FGG484	Microchip Technology	数据表	9 In Stock	1: ¥362.695853 10: ¥342.165895 100: ¥322.798016 500: ¥304.526432 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	64 kB	6060 LE	有	505 LAB	60	209	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2																		166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 5K Logic Modules			1 Core	128KB
M2S025T-1VF256I	Microchip Technology	数据表	2253 In Stock	1: ¥1,152.269041 10: ¥1,087.046264 100: ¥1,025.515344 500: ¥967.467309 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 25K Logic Modules			1 Core	256KB
M2S050-1VF400I	Microchip Technology	数据表	2742 In Stock	1: ¥1,087.063161 10: ¥1,025.531283 100: ¥967.482347 500: ¥912.719192 查看所有的价格 -	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	-	64 kB	56340 LE	有	4695 LAB	90	微芯片技术	1.2000 V	1.14 V	1.26 V	207	Tray	M2S050	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S050-1VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-40 to 100 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B400	160	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160		1.51 mm	现场可编程门阵列	1	FPGA - 50K Logic Modules		48672	1 Core	256KB	17 mm	17 mm
M2S060-FGG676I	Microchip Technology	数据表	2993 In Stock	1: ¥1,723.897145 10: ¥1,626.318060 100: ¥1,534.262320 500: ¥1,447.417284 查看所有的价格 -	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	-	64 kB	56520 LE	有	4710 LAB	40	SmartFusion2	微芯片技术	1.2000 V	1.14 V	1.26 V	387	Tray	M2S060	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	有	M2S060-FGG676I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B676	387	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	387		2.44 mm	现场可编程门阵列	STD	FPGA - 60K Logic Modules		56520	1 Core	256KB	27 mm	27 mm
M2S060-FCSG325	Microchip Technology	数据表	2558 In Stock	1: ¥1,005.158850 10: ¥948.263065 100: ¥894.587802 500: ¥843.950755 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	-	64 kB	56520 LE	有	4710 LAB	176	SmartFusion2	微芯片技术	1.2000 V	1.14 V	1.26 V	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S060-FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	Details	166 MHz	-	0 to 85 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant		S-PBGA-B325	200	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200		1.01 mm	现场可编程门阵列	STD	FPGA - 60K Logic Modules		56520	1 Core	256KB	11 mm	11 mm
M2S050T-FCS325I	Microchip Technology	数据表	2844 In Stock	1: ¥1,306.436533 10: ¥1,232.487295 100: ¥1,162.723864 500: ¥1,096.909305 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	4695 LAB	176	微芯片技术	200	Tray	M2S050	活跃	TFBGA, BGA325,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S050T-FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant		S-PBGA-B325	200	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200		1.01 mm	现场可编程门阵列		FPGA - 50K Logic Modules		56340	1 Core	256KB	11 mm	11 mm
M2S050TS-FGG896	Microchip Technology	数据表	2319 In Stock	1: ¥2,047.925176 10: ¥1,932.004884 100: ¥1,822.646118 500: ¥1,719.477471 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	896-BGA	896-FBGA (31x31)	ARM Cortex M3	微芯片技术	有	4695 LAB	27	377	Tray	M2S050	活跃			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56340 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2																		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 50K Logic Modules			1 Core	256KB
M2S005S-FGG484I	Microchip Technology	数据表	9 In Stock	1: ¥406.317438 10: ¥383.318336 100: ¥361.621077 500: ¥341.151959 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	60	209	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																		166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 5K Logic Modules			1 Core	128KB
M2S050-FG896I	Microchip Technology	数据表	2574 In Stock	1: ¥1,911.848016 10: ¥1,803.630200 100: ¥1,701.537926 500: ¥1,605.224458 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-896	YES	896-FBGA (31x31)	896	ARM Cortex M3	56340 LE	有	4695 LAB	27	微芯片技术	377	Tray	M2S050	活跃	FBGA-896	网格排列	3	PLASTIC/EPOXY	BGA896,30X30,40	1.2 V	30	1.14 V	无	M2S050-FG896I	50 MHz	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.26	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B896	377	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377	48672 CLBS	2.44 mm	现场可编程门阵列		FPGA - 50K Logic Modules	48672	56340	1 Core	256KB	31 mm	31 mm
M2S060TS-1FCS325	Microchip Technology	数据表	2208 In Stock	1: ¥1,451.506508 10: ¥1,369.345759 100: ¥1,291.835625 500: ¥1,218.712850 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	4710 LAB	176	SmartFusion2	微芯片技术	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S060TS-1FCS325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant		S-PBGA-B325	200	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200		1.01 mm	现场可编程门阵列		FPGA - 60K Logic Modules		56520	1 Core	256KB	11 mm	11 mm

M2S060-1FG676

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,726.996656
M2S025-1VFG256

Microchip Technology

分类:Embedded - System On Chip (SoC)

733.912501
M2S050TS-1VF400I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,462.714718
M2S090T-FG484I

Microchip Technology

分类:Embedded - System On Chip (SoC)

2,915.775096
M2S150-FC1152

Microchip Technology

分类:Embedded - System On Chip (SoC)
M2S090TS-FCSG325I

Microchip Technology

分类:Embedded - System On Chip (SoC)

2,182.227919
M2S060T-FG676I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,877.192593
M2S050TS-1VFG400

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,804.957423
M2S060-1FGG484I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,853.393512
M2S025T-1VF400I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,198.489814
M2S060T-1VFG400

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,705.796281
M2S090-FCSG325

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,477.445763
M2S010-1VFG256

Microchip Technology

分类:Embedded - System On Chip (SoC)

491.238172
M2S150TS-1FCG1152I

Microchip Technology

分类:Embedded - System On Chip (SoC)

4,119.221481
M2S090TS-FCS325

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,964.105204
M2S005S-FGG484

Microchip Technology

分类:Embedded - System On Chip (SoC)

362.695853
M2S025T-1VF256I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,152.269041
M2S050-1VF400I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,087.063161
M2S060-FGG676I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,723.897145
M2S060-FCSG325

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,005.158850
M2S050T-FCS325I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,306.436533
M2S050TS-FGG896

Microchip Technology

分类:Embedded - System On Chip (SoC)

2,047.925176
M2S005S-FGG484I

Microchip Technology

分类:Embedded - System On Chip (SoC)

406.317438
M2S050-FG896I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,911.848016
M2S060TS-1FCS325

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,451.506508