品牌是'Microchip' (873)

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JESD-609代码

无铅代码

端子表面处理

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HTS代码

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

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时间@峰值回流温度-最大值(s)

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JESD-30代码

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宽度

A2F200M3F-1FG484
A2F200M3F-1FG484
Microchip Technology 数据表

2353 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

100 MHz

-

-

64 kB

2000 LE

161 I/O

0 C

+ 85 C

-

60

SmartFusion

Tray

A2F200

活跃

N

SMD/SMT

0°C ~ 85°C (TJ)

Tray

A2F200

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

200000

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

1 Core

256KB

A2F200M3F-1CSG288
A2F200M3F-1CSG288
Microchip Technology 数据表

47 In Stock

-

最小起订量: 1

最小包装量: 1

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

ARM Cortex M3

SmartFusion

MCU - 31, FPGA - 78

Tray

微芯片技术

A2F200

活跃

TFBGA, BGA288,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA288,21X21,20

1.5 V

未说明

1.425 V

85 °C

A2F200M3F-1CSG288

100 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

Details

100 MHz

-

-

64 kB

2000 LE

-

176

0°C ~ 85°C (TJ)

Tray

A2F200

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

4608 CLBS, 200000 GATES

1.05 mm

现场可编程门阵列

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

11 mm

11 mm

M2S090-FG676
M2S090-FG676
Microchip Technology 数据表

2688 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

40

1.2000 V

425

微芯片技术

Tray

M2S090

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

M2S090-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

86316 LE

7193 LAB

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

M2S060-1FG484I
M2S060-1FG484I
Microchip Technology 数据表

2450 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

4710 LAB

60

SmartFusion2

267

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S150TS-FCS536I
M2S150TS-FCS536I
Microchip Technology 数据表

2510 In Stock

-

最小起订量: 1

最小包装量: 1

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

ARM Cortex M3

微芯片技术

Tray

M2S150

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

30

1.14 V

M2S150TS-FCS536I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

12177 LAB

90

1.2000 V

293

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

not_compliant

536

S-PBGA-B536

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

STD

FPGA - 150K Logic Modules

1 Core

512KB

M2S090T-FCS325
M2S090T-FCS325
Microchip Technology 数据表

2568 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

Tray

微芯片技术

M2S090

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

M2S090T-FCS325

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

86316 LE

7193 LAB

176

180

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

M2S010-VFG400
M2S010-VFG400
Microchip Technology 数据表

202 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

233 I/O

0 C

+ 85 C

1007 LAB

90

0.034371 oz

1.26 V

1.14 V

Tray

M2S010

0°C ~ 85°C (TJ)

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

M2S060TS-VF400
M2S060TS-VF400
Microchip Technology 数据表

2725 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

SmartFusion2

207

微芯片技术

Tray

M2S060

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

5.87

1.26 V

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2S060TS-VF400

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

90

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

M2S025-1VFG256
M2S025-1VFG256
Microchip Technology 数据表

9 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-256

256-FPBGA (17x17)

ARM Cortex M3

微芯片技术

2308 LAB

119

138

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S050TS-1VF400I
M2S050TS-1VF400I
Microchip Technology 数据表

2514 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

Tray

M2S050

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

M2S050TS-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

90

4695 LAB

56340 LE

64 kB

-

-

166 MHz

SMD/SMT

N

This product may require additional documentation to export from the United States.

207

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1.51 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

1 Core

256KB

17 mm

17 mm

M2S090T-FG484I
M2S090T-FG484I
Microchip Technology 数据表

2012 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

60

267

微芯片技术

Tray

M2S090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

M2S090T-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S150-FC1152
M2S150-FC1152
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

ARM Cortex M3

1.2000 V

574

微芯片技术

Tray

M2S150

活跃

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

85 °C

M2S150-FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

12177 LAB

24

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

STD

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

M2S090TS-FCSG325I
M2S090TS-FCSG325I
Microchip Technology 数据表

2187 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-325

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

7193 LAB

176

1.2, 1.5, 1.8, 2.5, 3.3 V

微芯片技术

180

Tray

M2S090

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

M2S090TS-FCSG325I

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.8

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

R-PBGA-B325

180

不合格

1.2 V

CAN/Ethernet/Serial

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

M2S060T-FG676I
M2S060T-FG676I
Microchip Technology 数据表

2413 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

676-BGA

676-FBGA (27x27)

ARM Cortex M3

微芯片技术

4710 LAB

40

SmartFusion2

387

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S050TS-1VFG400
M2S050TS-1VFG400
Microchip Technology 数据表

2280 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

4695 LAB

90

207

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

M2S060-1FGG484I
M2S060-1FGG484I
Microchip Technology 数据表

2453 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

4710 LAB

60

SmartFusion2

267

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56520 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S025T-1VF400I
M2S025T-1VF400I
Microchip Technology 数据表

2335 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

2308 LAB

90

1.2000 V

微芯片技术

1.14 V

1.26 V

207

Tray

M2S025

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

M2S025T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 25K Logic Modules

23988

1 Core

256KB

17 mm

17 mm

M2S060T-1VFG400
M2S060T-1VFG400
Microchip Technology 数据表

2178 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

207

微芯片技术

Tray

M2S060

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

1.14 V

85 °C

M2S060T-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56520 LE

4710 LAB

90

SmartFusion2

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

40

S-PBGA-B400

207

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

M2S090-FCSG325
M2S090-FCSG325
Microchip Technology 数据表

2450 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

176

180

Tray

微芯片技术

M2S090

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

M2S090-FCSG325

TFBGA

RECTANGULAR

活跃

FPGA - Field Programmable Gate Array SmartFusion2

MICROSEMI CORP

1.26 V

5.78

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

86316 LE

7193 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

M2S010-1VFG256
M2S010-1VFG256
Microchip Technology 数据表

9 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-256

YES

256-FPBGA (17x17)

256

ARM Cortex M3

1007 LAB

119

1.2000 V

微芯片技术

138

Tray

M2S010

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

85 °C

M2S010-1VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S150TS-1FCG1152I
M2S150TS-1FCG1152I
Microchip Technology 数据表

2904 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-1152

1152-FCBGA (35x35)

ARM Cortex M3

微芯片技术

-

-

64 kB

146124 LE

12177 LAB

24

1.2000 V

574

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 150K Logic Modules

1 Core

512KB

M2S090TS-FCS325
M2S090TS-FCS325
Microchip Technology 数据表

2437 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

1.2000 V

180

微芯片技术

Tray

M2S090

活跃

TFBGA, BGA325,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

M2S090TS-FCS325

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

86316 LE

7193 LAB

176

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

M2S005S-FGG484
M2S005S-FGG484
Microchip Technology 数据表

9 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

505 LAB

60

209

Tray

M2S005

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

6060 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S025T-1VF256I
M2S025T-1VF256I
Microchip Technology 数据表

2253 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LFBGA

256-FPBGA (14x14)

ARM Cortex M3

微芯片技术

2308 LAB

119

138

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S050-1VF400I
M2S050-1VF400I
Microchip Technology 数据表

2742 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

4695 LAB

90

1.2000 V

微芯片技术

1.14 V

1.26 V

207

Tray

M2S050

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

M2S050-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

48672

1 Core

256KB

17 mm

17 mm