品牌是'Microchip' (873)

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供应商器件包装

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厂商

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包装

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JESD-609代码

无铅代码

类型

端子表面处理

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HTS代码

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

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敏感度

ADC通道数量

主要属性

逻辑单元数

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核数量

闪光大小

ADC Resolution

高度

长度

宽度

MPFS095T-FCVG484I
MPFS095T-FCVG484I
Microchip Technology 数据表

2737 In Stock

-

最小起订量: 1

最小包装量: 1

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

667 MHz, 667 MHz

+ 100 C

0 C

SMD/SMT

276 I/O

93000 LE

Tray

活跃

This product may require additional documentation to export from the United States.

-

1

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS250TLS-FCSG536I
MPFS250TLS-FCSG536I
Microchip Technology 数据表

2618 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

667 MHz, 667 MHz

+ 100 C

- 40 C

SMD/SMT

372 I/O

254000 LE

Tray

活跃

This product may require additional documentation to export from the United States.

-

1

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS250T-FCSG536I
MPFS250T-FCSG536I
Microchip Technology 数据表

2355 In Stock

-

最小起订量: 1

最小包装量: 1

FCSG-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

667 MHz, 667 MHz

+ 100 C

0 C

SMD/SMT

372 I/O

254000 LE

Tray

活跃

This product may require additional documentation to export from the United States.

-

1

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

PIC32CX1025SG41128-E/Z2X
PIC32CX1025SG41128-E/Z2X
Microchip Technology 数据表

259 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-128

微芯片技术

PIC32CX

99 I/O

3.63 V

1.71 V

Details

- 40 C

+ 125 C

CAN, Ethernet, USB

SMD/SMT

1000

Tray

活跃

EV06X38A

120 MHz

Tray

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 125 C

32 Channel

PIC32CX1025SG41128-I/Z2X
PIC32CX1025SG41128-I/Z2X
Microchip Technology 数据表

171 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-128

微芯片技术

PIC32CX

99 I/O

3.63 V

1.71 V

Details

- 40 C

+ 85 C

CAN, Ethernet, USB

SMD/SMT

1000

Tray

活跃

EV06X38A

120 MHz

Tray

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 85 C

32 Channel

MPFS250TL-FCVG784E
MPFS250TL-FCVG784E
Microchip Technology 数据表

2554 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS095TS-1FCVG784I
MPFS095TS-1FCVG784I
Microchip Technology 数据表

2885 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-BGA

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS250TS-FCVG784I
MPFS250TS-FCVG784I
Microchip Technology 数据表

2300 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS250T-1FCSG536I
MPFS250T-1FCSG536I
Microchip Technology 数据表

2431 In Stock

-

最小起订量: 1

最小包装量: 1

FCSG-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS095T-1FCVG784E
MPFS095T-1FCVG784E
Microchip Technology 数据表

2618 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-BGA

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

0°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS095TS-FCSG536I
MPFS095TS-FCSG536I
Microchip Technology 数据表

2093 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

PIC32CX1025SG41100-I/E5X
PIC32CX1025SG41100-I/E5X
Microchip Technology 数据表

219 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-100

微芯片技术

PIC32CX

81 I/O

3.63 V

1.71 V

Details

- 40 C

+ 85 C

CAN, Ethernet, USB

SMD/SMT

1000

Tray

活跃

EV06X38A

120 MHz

Tray

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 85 C

32 Channel

PIC32CX1012BZ25048-I/MYX
PIC32CX1012BZ25048-I/MYX
Microchip Technology 数据表

992 In Stock

-

最小起订量: 1

最小包装量: 1

QFN-48

ARM Cortex M4

微芯片技术

64 MHz

GPIO, I2C, QSPI, SPI, UART

SRAM

128 kB

+ 85 C

- 40 C

96.7 mA

40.6 mA

1.9 V

2 Mb/s

Details

29 I/O

416

3.6 V

Tray

PIC32CX1012

活跃

SMD/SMT

Tray

-

Bluetooth, Zigbee

2.4 GHz

1.9 V to 3.6 V

Flash

1 MB

12 dBm

32 bit

- 40 C to + 85 C

- 96 dBm

8 Channel

4 Timer

12 bit

0.9 mm

7 mm

7 mm

MPFS025T-FCVG484I
MPFS025T-FCVG484I
Microchip Technology 数据表

38 In Stock

-

最小起订量: 1

最小包装量: 1

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

4 x 32 kB

-

23000 LE

108 I/O

0 C

+ 100 C

1

MSL 3 - 168 hours

Tray

活跃

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

-40°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

1843.2Kbit

FPGA - 23K Logic Modules

5 Core

128KB

MPFS250T-1FCSG536EES
MPFS250T-1FCSG536EES
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCSG-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

667 MHz

1

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS250T-1FCVG784EES
MPFS250T-1FCVG784EES
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCVG-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

667 MHz

1

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS250T-FCVG484EES
MPFS250T-FCVG484EES
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

667 MHz

1

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

M2S010-1FG484I
M2S010-1FG484I
Microchip Technology 数据表

5000 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

微芯片技术

166 MHz

-

-

64 kB

12084 LE

1007 LAB

60

233

Tray

M2S010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

M2S010-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

9744

1 Core

256KB

23 mm

23 mm

M2S090T-FCS325I
M2S090T-FCS325I
Microchip Technology 数据表

2420 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-325

325-FCBGA (11x13.5)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

176

SMARTFUSION2

100C

Industrial

FCBGA

-40C to 100C

180

86316

65nm

1.26(V)

1.2(V)

1.14(V)

-40C

86316

表面贴装

180

Tray

活跃

M2S090

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

325

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 90K Logic Modules

1 Core

512KB

M2S090T-FGG484I
M2S090T-FGG484I
Microchip Technology 数据表

2290 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

微芯片技术

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

60

1.2000 V

267

Tray

M2S090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

M2S090T-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S050T-FGG896I
M2S050T-FGG896I
Microchip Technology 数据表

2838 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-896

YES

896-FBGA (31x31)

896

ARM Cortex M3

微芯片技术

-

64 kB

56340 LE

4695 LAB

27

1.2000 V

377

Tray

M2S050

活跃

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

1.14 V

M2S050T-FGG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm

M2S090T-FCSG325
M2S090T-FCSG325
Microchip Technology 数据表

2477 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

微芯片技术

64 kB

86316 LE

7193 LAB

176

180

Tray

M2S090

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

85 °C

M2S090T-FCSG325

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.78

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

40

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

M2S150TS-FCV484I
M2S150TS-FCV484I
Microchip Technology 数据表

913 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

YES

484-FBGA (19x19)

484

ARM Cortex M3

微芯片技术

84

273

Tray

M2S150

活跃

FBGA,

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

M2S150TS-FCV484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

12177 LAB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN,WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

1 Core

512KB

19 mm

19 mm

M2S050TS-FG896I
M2S050TS-FG896I
Microchip Technology 数据表

2199 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-896

896-FBGA (31x31)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

27

377

Tray

M2S050

活跃

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

M2S005-FGG484I
M2S005-FGG484I
Microchip Technology 数据表

5000 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

209

1.26 V

表面贴装

209

活跃

M2S005

Tray

Industrial grade

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

505 LAB

60

0.377729 oz

6,060

FPBGA

1.2000 V

1.14 V

-40 to 100 °C

Tray

SmartFusion2

484

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

Industrial

STD

FPGA - 5K Logic Modules

1 Core

128KB