品牌是'Microchip' (873)

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供应商器件包装

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Core

厂商

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包装

系列

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

端子位置

终端形式

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端子间距

Reach合规守则

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JESD-30代码

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工作电源电压

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逻辑块数量

逻辑单元数

核数量

等效门数

闪光大小

长度

宽度

M2S060TS-FG484
M2S060TS-FG484
Microchip Technology 数据表

2510 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

64 kB

56520 LE

4710 LAB

60

SmartFusion2

活跃

M2S060

Tray

267

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

A2F500M3G-1FG484I
A2F500M3G-1FG484I
Microchip Technology 数据表

2470 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

ARM Cortex M3

SMD/SMT

100 MHz

-

-

64 kB

6000 LE

204 I/O

- 40 C

+ 100 C

微芯片技术

-

60

SmartFusion

1.5000 V

1.425 V

1.575 V

Tray

A2F500

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

5.24

1.575 V

MICROSEMI CORP

活跃

SQUARE

BGA

100 MHz

A2F500M3G-1FG484I

100 °C

1.425 V

20

1.5 V

-40 °C

BGA484,26X26,40

-40 to 100 °C

Tray

A2F500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

128

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

23 mm

23 mm

A2F500M3G-1FGG484M
A2F500M3G-1FGG484M
Microchip Technology 数据表

767 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

64 kB

6000 LE

-

60

SmartFusion

MCU - 41, FPGA - 128

Tray

A2F500

活跃

This product may require additional documentation to export from the United States.

Details

100 MHz

-

-

-55°C ~ 125°C (TJ)

Tray

A2F500

125 °C

-55 °C

100 MHz

EBI/EMI, Ethernet, I2C, SPI, UART, USART

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

M2S150T-1FCG1152
M2S150T-1FCG1152
Microchip Technology 数据表

2590 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-1152

1152-FCBGA (35x35)

ARM Cortex M3

微芯片技术

166 MHz

-

-

64 kB

146124 LE

12177 LAB

24

1.2000 V

574

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 150K Logic Modules

1 Core

512KB

M2S025-1VFG400
M2S025-1VFG400
Microchip Technology 数据表

2769 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

-

64 kB

27696 LE

2308 LAB

90

207

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S090-FG484I
M2S090-FG484I
Microchip Technology 数据表

2619 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

60

267

微芯片技术

Tray

M2S090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

M2S090-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S025TS-1VF400
M2S025TS-1VF400
Microchip Technology 数据表

2216 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

90

207

微芯片技术

Tray

M2S025

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

M2S025TS-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

17 mm

17 mm

M2S010T-1VF256
M2S010T-1VF256
Microchip Technology 数据表

31 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-256

YES

256-FPBGA (14x14)

256

ARM Cortex M3

1007 LAB

119

138

微芯片技术

Tray

M2S010

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

85 °C

M2S010T-1VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S060TS-1FCS325I
M2S060TS-1FCS325I
Microchip Technology 数据表

2550 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

ARM Cortex M3

微芯片技术

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

M2S060TS-1FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

176

SmartFusion2

200

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

1 Core

256KB

11 mm

11 mm

M2S090T-FG676
M2S090T-FG676
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

40

425

Tray

微芯片技术

M2S090

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

M2S090T-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

86316 LE

7193 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

M2S010S-TQG144
M2S010S-TQG144
Microchip Technology 数据表

9 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-144

144-TQFP (20x20)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

84 I/O

0 C

+ 85 C

400 kbit

1007 LAB

60

1.2000 V

Tray

M2S010

活跃

0 to 85 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

M2S060T-1FGG484M
M2S060T-1FGG484M
Microchip Technology 数据表

2894 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

-

64 kB

56520 LE

267 I/O

- 55 C

+ 125 C

1314 kbit

微芯片技术

4710 LAB

60

SmartFusion2

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

-55 °C

1.2 V

40

1.14 V

125 °C

M2S060T-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

1 Core

256KB

23 mm

23 mm

M2S060TS-1FGG484M
M2S060TS-1FGG484M
Microchip Technology 数据表

600 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

-

64 kB

56520 LE

267 I/O

- 55 C

+ 125 C

1314 kbit

微芯片技术

4710 LAB

60

SmartFusion2

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

-55 °C

1.2 V

40

1.14 V

125 °C

M2S060TS-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

1 Core

256KB

23 mm

23 mm

M2S010TS-1FG484M
M2S010TS-1FG484M
Microchip Technology 数据表

2000 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

1007 LAB

60

233

微芯片技术

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

1.14 V

125 °C

M2S010TS-1FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.86

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

M2S150T-1FCS536
M2S150T-1FCS536
Microchip Technology 数据表

2022 In Stock

-

最小起订量: 1

最小包装量: 1

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

ARM Cortex M3

293

Tray

微芯片技术

M2S150

活跃

BGA, BGA536,30X30,20

网格排列

PLASTIC/EPOXY

BGA536,30X30,20

1.2 V

30

1.14 V

85 °C

M2S150T-1FCS536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

12177 LAB

90

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

not_compliant

S-PBGA-B536

293

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

293

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

M2S060T-FG484
M2S060T-FG484
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

YES

484-FPBGA (23x23)

484

ARM Cortex M3

60

SmartFusion2

267

微芯片技术

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

M2S060T-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

23 mm

23 mm

M2S010T-FGG484I
M2S010T-FGG484I
Microchip Technology 数据表

194 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

64 kB

12084 LE

1007 LAB

60

1.2000 V

微芯片技术

1.14 V

1.26 V

233

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

M2S010T-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

2.32

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

M2S005S-1VFG400
M2S005S-1VFG400
Microchip Technology 数据表

26 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

505 LAB

90

171

微芯片技术

Tray

M2S005

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

85 °C

M2S005S-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

171

1.51 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

1 Core

128KB

17 mm

17 mm

M2S010T-VF256
M2S010T-VF256
Microchip Technology 数据表

9 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

256-LFBGA

256-FPBGA (14x14)

ARM Cortex M3

微芯片技术

119

138

Tray

M2S010

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

12084 LE

1007 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

M2S050TS-FGG484
M2S050TS-FGG484
Microchip Technology 数据表

2136 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

60

267

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56340 LE

4695 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

M2S005S-FG484
M2S005S-FG484
Microchip Technology 数据表

18 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

505 LAB

60

209

Tray

M2S005

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

6060 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S005S-1FGG484I
M2S005S-1FGG484I
Microchip Technology 数据表

9 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

-

64 kB

6060 LE

505 LAB

60

209

Tray

M2S005

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S050-FGG896I
M2S050-FGG896I
Microchip Technology 数据表

2296 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-896

YES

896-FBGA (31x31)

896

ARM Cortex M3

27

1.2000 V

微芯片技术

377

Tray

M2S050

活跃

FBGA-896

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

1.14 V

M2S050-FGG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.26

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm

M2S005S-VF256
M2S005S-VF256
Microchip Technology 数据表

9 In Stock

-

最小起订量: 1

最小包装量: 1

256-LFBGA

256-FPBGA (14x14)

ARM Cortex M3

微芯片技术

505 LAB

119

161

Tray

M2S005

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

6060 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S090-1FCSG325
M2S090-1FCSG325
Microchip Technology 数据表

2445 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-325

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

7193 LAB

176

180

微芯片技术

Tray

M2S090

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

M2S090-1FCSG325

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.78

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm