品牌是'Microchip' (873)
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![]() | M2S060TS-FG484 | Microchip Technology | 数据表 | 2510 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 64 kB | 56520 LE | 有 | 4710 LAB | 60 | SmartFusion2 | 活跃 | M2S060 | Tray | 267 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-1FG484I | Microchip Technology | 数据表 | 2470 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | This product may require additional documentation to export from the United States. | N | ARM Cortex M3 | SMD/SMT | 100 MHz | - | - | 64 kB | 6000 LE | 204 I/O | - 40 C | + 100 C | 有 | 微芯片技术 | - | 60 | SmartFusion | 1.5000 V | 1.425 V | 1.575 V | Tray | A2F500 | 活跃 | BGA, BGA484,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | 5.24 | 1.575 V | MICROSEMI CORP | 活跃 | SQUARE | BGA | 100 MHz | A2F500M3G-1FG484I | 无 | 100 °C | 1.425 V | 20 | 1.5 V | -40 °C | BGA484,26X26,40 | -40 to 100 °C | Tray | A2F500 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 128 | 不合格 | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | 现场可编程门阵列 | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 23 mm | 23 mm | |||||||||||||
![]() | A2F500M3G-1FGG484M | Microchip Technology | 数据表 | 767 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 64 kB | 6000 LE | 有 | - | 60 | SmartFusion | MCU - 41, FPGA - 128 | Tray | A2F500 | 活跃 | This product may require additional documentation to export from the United States. | Details | 100 MHz | - | - | -55°C ~ 125°C (TJ) | Tray | A2F500 | 125 °C | -55 °C | 100 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-1FCG1152 | Microchip Technology | 数据表 | 2590 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-1152 | 1152-FCBGA (35x35) | ARM Cortex M3 | 微芯片技术 | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 24 | 1.2000 V | 574 | Tray | M2S150 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-1VFG400 | Microchip Technology | 数据表 | 2769 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | - | 64 kB | 27696 LE | 有 | 2308 LAB | 90 | 207 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-FG484I | Microchip Technology | 数据表 | 2619 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 60 | 267 | 微芯片技术 | Tray | M2S090 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 无 | M2S090-FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||
![]() | M2S025TS-1VF400 | Microchip Technology | 数据表 | 2216 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 90 | 207 | 微芯片技术 | Tray | M2S025 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S025TS-1VF400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||
![]() | M2S010T-1VF256 | Microchip Technology | 数据表 | 31 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | 1007 LAB | 119 | 138 | 微芯片技术 | Tray | M2S010 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S010T-1VF256 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||||||||||
![]() | M2S060TS-1FCS325I | Microchip Technology | 数据表 | 2550 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 微芯片技术 | Tray | M2S060 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 无 | M2S060TS-1FCS325I | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.88 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 176 | SmartFusion2 | 200 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | 无 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.01 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||
![]() | M2S090T-FG676 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | ARM Cortex M3 | 40 | 425 | Tray | 微芯片技术 | M2S090 | 活跃 | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S090T-FG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||
![]() | M2S010S-TQG144 | Microchip Technology | 数据表 | 9 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-144 | 144-TQFP (20x20) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 84 I/O | 0 C | + 85 C | 400 kbit | 1007 LAB | 60 | 1.2000 V | Tray | M2S010 | 活跃 | 0 to 85 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060T-1FGG484M | Microchip Technology | 数据表 | 2894 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | - | 64 kB | 56520 LE | 267 I/O | - 55 C | + 125 C | 1314 kbit | 微芯片技术 | 4710 LAB | 60 | SmartFusion2 | Tray | M2S060 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | -55 °C | 1.2 V | 40 | 1.14 V | 125 °C | 有 | M2S060T-1FGG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | 有 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||
![]() | M2S060TS-1FGG484M | Microchip Technology | 数据表 | 600 In Stock | - | 最小起订量: 1 最小包装量: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | - | 64 kB | 56520 LE | 267 I/O | - 55 C | + 125 C | 1314 kbit | 微芯片技术 | 4710 LAB | 60 | SmartFusion2 | Tray | M2S060 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | -55 °C | 1.2 V | 40 | 1.14 V | 125 °C | 有 | M2S060TS-1FGG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | 有 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||
![]() | M2S010TS-1FG484M | Microchip Technology | 数据表 | 2000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 有 | 1007 LAB | 60 | 233 | 微芯片技术 | Tray | M2S010 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 30 | 1.14 V | 125 °C | 无 | M2S010TS-1FG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.86 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||
![]() | M2S150T-1FCS536 | Microchip Technology | 数据表 | 2022 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | ARM Cortex M3 | 293 | Tray | 微芯片技术 | M2S150 | 活跃 | BGA, BGA536,30X30,20 | 网格排列 | PLASTIC/EPOXY | BGA536,30X30,20 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S150T-1FCS536 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 90 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | not_compliant | S-PBGA-B536 | 293 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | |||||||||||||||||||||||||||||||||
![]() | M2S060T-FG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 60 | SmartFusion2 | 267 | 微芯片技术 | Tray | M2S060 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S060T-FG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.88 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||
![]() | M2S010T-FGG484I | Microchip Technology | 数据表 | 194 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 64 kB | 12084 LE | 有 | 1007 LAB | 60 | 1.2000 V | 微芯片技术 | 1.14 V | 1.26 V | 233 | Tray | M2S010 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 有 | M2S010T-FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 2.32 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||
![]() | M2S005S-1VFG400 | Microchip Technology | 数据表 | 26 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 有 | 505 LAB | 90 | 171 | 微芯片技术 | Tray | M2S005 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S005S-1VFG400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 171 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | 1.51 mm | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 17 mm | 17 mm | |||||||||||||||||||||||||||
![]() | M2S010T-VF256 | Microchip Technology | 数据表 | 9 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 256-LFBGA | 256-FPBGA (14x14) | ARM Cortex M3 | 微芯片技术 | 119 | 138 | Tray | M2S010 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050TS-FGG484 | Microchip Technology | 数据表 | 2136 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 60 | 267 | Tray | M2S050 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-FG484 | Microchip Technology | 数据表 | 18 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 有 | 505 LAB | 60 | 209 | Tray | M2S005 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 6060 LE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-1FGG484I | Microchip Technology | 数据表 | 9 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | - | 64 kB | 6060 LE | 有 | 505 LAB | 60 | 209 | Tray | M2S005 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-FGG896I | Microchip Technology | 数据表 | 2296 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | ARM Cortex M3 | 27 | 1.2000 V | 微芯片技术 | 377 | Tray | M2S050 | 活跃 | FBGA-896 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.2 V | 40 | 1.14 V | 有 | M2S050-FGG896I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.26 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 377 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | |||||||||||||||||||||||||||
![]() | M2S005S-VF256 | Microchip Technology | 数据表 | 9 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 256-LFBGA | 256-FPBGA (14x14) | ARM Cortex M3 | 微芯片技术 | 有 | 505 LAB | 119 | 161 | Tray | M2S005 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 6060 LE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-1FCSG325 | Microchip Technology | 数据表 | 2445 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | ARM Cortex M3 | 有 | 7193 LAB | 176 | 180 | 微芯片技术 | Tray | M2S090 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S090-1FCSG325 | TFBGA | RECTANGULAR | 活跃 | MICROSEMI CORP | 1.26 V | 5.78 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | R-PBGA-B325 | 180 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm |
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