品牌是'Microchip' (873)

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JESD-609代码

无铅代码

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最高工作温度

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宽度

M2S050TS-FG484I
M2S050TS-FG484I
Microchip Technology 数据表

2911 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

YES

484-FPBGA (23x23)

484

ARM Cortex M3

微芯片技术

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

M2S050TS-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56340 LE

4695 LAB

60

267

Tray

M2S050

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

1 Core

256KB

23 mm

23 mm

M2S150TS-1FCSG536
M2S150TS-1FCSG536
Microchip Technology 数据表

679 In Stock

-

最小起订量: 1

最小包装量: 1

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

ARM Cortex M3

Tray

M2S150

微芯片技术

活跃

5.82

1.26 V

MICROSEMI CORP

活跃

SQUARE

BGA

M2S150TS-1FCSG536

85 °C

1.14 V

40

1.2 V

PLASTIC/EPOXY

3

网格排列

FBGA-536

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

146124 LE

12177 LAB

90

293

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

compliant

S-PBGA-B536

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

FPGA - 150K Logic Modules

1 Core

512KB

M2S050T-1VF400I
M2S050T-1VF400I
Microchip Technology 数据表

2657 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

4695 LAB

90

1.2000 V

1.14 V

微芯片技术

1.26 V

207

Tray

M2S050

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

M2S050T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

48672

1 Core

256KB

17 mm

17 mm

M2S025TS-FG484
M2S025TS-FG484
Microchip Technology 数据表

2821 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

267

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

27696 LE

2308 LAB

60

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S010-1VF256I
M2S010-1VF256I
Microchip Technology 数据表

31 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-256

YES

256-FPBGA (14x14)

256

ARM Cortex M3

138

Tray

微芯片技术

M2S010

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

M2S010-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

1007 LAB

119

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S025TS-1VF256I
M2S025TS-1VF256I
Microchip Technology 数据表

2296 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LFBGA

YES

256-FPBGA (14x14)

256

ARM Cortex M3

微芯片技术

M2S025

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

M2S025TS-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

119

138

Tray

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1.56 mm

现场可编程门阵列

FPGA - 25K Logic Modules

1 Core

256KB

14 mm

14 mm

M2S010-VF256
M2S010-VF256
Microchip Technology 数据表

47 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LFBGA

YES

256-FPBGA (14x14)

256

ARM Cortex M3

M2S010

微芯片技术

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

85 °C

M2S010-VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

12084 LE

1007 LAB

119

138

Tray

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S025-1VFG400I
M2S025-1VFG400I
Microchip Technology 数据表

2627 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

64 kB

27696 LE

2308 LAB

90

207

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB

M2S150T-FCVG484I
M2S150T-FCVG484I
Microchip Technology 数据表

2524 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

484-FBGA (19x19)

ARM Cortex M3

微芯片技术

12177 LAB

84

273

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

146124 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

M2S060T-1FGG676I
M2S060T-1FGG676I
Microchip Technology 数据表

2494 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

This product may require additional documentation to export from the United States.

1.2000 V

387

微芯片技术

Tray

M2S060

活跃

MICROSEMI CORP

1.26 V

5.8

活跃

SQUARE

BGA

M2S060T-1FGG676I

1.14 V

40

1.2 V

BGA676,26X26,40

PLASTIC/EPOXY

3

网格排列

FBGA-676

SmartFusion2

40

4710 LAB

56520 LE

64 kB

-

-

166 MHz

Details

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

387

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

现场可编程门阵列

1

FPGA - 60K Logic Modules

56520

1 Core

256KB

27 mm

27 mm

M2S090T-1FG484I
M2S090T-1FG484I
Microchip Technology 数据表

2929 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

7193 LAB

60

1.2000 V

267

微芯片技术

Tray

M2S090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

M2S090T-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S025TS-VF256
M2S025TS-VF256
Microchip Technology 数据表

2605 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LFBGA

256-FPBGA (14x14)

ARM Cortex M3

微芯片技术

138

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

27696 LE

2308 LAB

119

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S010TS-1VFG400
M2S010TS-1VFG400
Microchip Technology 数据表

39 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

SMD/SMT

Details

This product may require additional documentation to export from the United States.

195

Tray

M2S010

活跃

90

1007 LAB

12084 LE

64 kB

-

-

166 MHz

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

M2S025TS-VF400I
M2S025TS-VF400I
Microchip Technology 数据表

2019 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

2308 LAB

90

207

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

A2F200M3F-FG484
A2F200M3F-FG484
Microchip Technology 数据表

2427 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

2000 LE

161 I/O

0 C

+ 85 C

-

60

微芯片技术

SmartFusion

Tray

A2F200

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

1.5 V

30

1.425 V

85 °C

A2F200M3F-FG484

80 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

N

SMD/SMT

80 MHz

-

-

64 kB

0°C ~ 85°C (TJ)

Tray

A2F200

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

94

不合格

1.5,1.8,2.5,3.3 V

OTHER

2 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

现场可编程门阵列

200000

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

23 mm

23 mm

A2F500M3G-1FG484
A2F500M3G-1FG484
Microchip Technology 数据表

2162 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

Tray

A2F500

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

100 MHz

-

-

64 kB

6000 LE

204 I/O

0 C

+ 85 C

-

SmartFusion

60

1.5000 V

1.425 V

1.575 V

0 to 85 °C

Tray

A2F500

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

A2F500M3G-1FGG484I
A2F500M3G-1FGG484I
Microchip Technology 数据表

2386 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

Details

SMD/SMT

ARM Cortex M3

100 MHz

-

-

64 kB

6000 LE

204 I/O

- 40 C

+ 100 C

-

60

微芯片技术

SmartFusion

1.5000 V

1.425 V

500000

500000

1.575 V

Tray

A2F500

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-40 °C

1.5 V

30

1.425 V

100 °C

A2F500M3G-1FGG484I

100 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

-40 to 100 °C

Tray

A2F500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

不合格

1.5 V

1.5,1.8,2.5,3.3 V

INDUSTRIAL

16.5 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

23 mm

23 mm

A2F200M3F-1FGG484I
A2F200M3F-1FGG484I
Microchip Technology 数据表

2442 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

64 kB

2000 LE

161 I/O

- 40 C

+ 100 C

-

60

微芯片技术

SmartFusion

Tray

A2F200

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-40 °C

1.5 V

30

1.425 V

100 °C

A2F200M3F-1FGG484I

100 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

Details

SMD/SMT

100 MHz

-

-

-40°C ~ 100°C (TJ)

Tray

A2F200

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

94

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

现场可编程门阵列

200000

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

23 mm

23 mm

A2F500M3G-FG484I
A2F500M3G-FG484I
Microchip Technology 数据表

2527 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

80 MHz

-

-

64 kB

6000 LE

204 I/O

- 40 C

+ 100 C

-

60

SmartFusion

Tray

A2F500

活跃

-40°C ~ 100°C (TJ)

Tray

A2F500

2 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

M2S060TS-FG484
M2S060TS-FG484
Microchip Technology 数据表

2510 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

56520 LE

4710 LAB

60

SmartFusion2

活跃

M2S060

Tray

267

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

A2F500M3G-1FG484I
A2F500M3G-1FG484I
Microchip Technology 数据表

2470 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

N

ARM Cortex M3

SMD/SMT

100 MHz

-

-

64 kB

6000 LE

204 I/O

- 40 C

+ 100 C

-

微芯片技术

60

SmartFusion

1.5000 V

1.425 V

1.575 V

Tray

A2F500

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

5.24

1.575 V

MICROSEMI CORP

活跃

SQUARE

BGA

100 MHz

A2F500M3G-1FG484I

100 °C

1.425 V

20

1.5 V

-40 °C

BGA484,26X26,40

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

A2F500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

128

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

现场可编程门阵列

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

23 mm

23 mm

A2F500M3G-1FGG484M
A2F500M3G-1FGG484M
Microchip Technology 数据表

767 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

6000 LE

-

60

SmartFusion

MCU - 41, FPGA - 128

Tray

A2F500

活跃

This product may require additional documentation to export from the United States.

Details

100 MHz

-

-

64 kB

-55°C ~ 125°C (TJ)

Tray

A2F500

125 °C

-55 °C

100 MHz

EBI/EMI, Ethernet, I2C, SPI, UART, USART

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

M2S150T-1FCG1152
M2S150T-1FCG1152
Microchip Technology 数据表

2590 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-1152

1152-FCBGA (35x35)

ARM Cortex M3

微芯片技术

-

-

64 kB

146124 LE

12177 LAB

24

1.2000 V

574

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 150K Logic Modules

1 Core

512KB

M2S025-1VFG400
M2S025-1VFG400
Microchip Technology 数据表

2769 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

64 kB

27696 LE

2308 LAB

90

207

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S090-FG484I
M2S090-FG484I
Microchip Technology 数据表

2619 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

267

Tray

微芯片技术

M2S090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

M2S090-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

60

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm