N/A

-

FBGA-1071

EAR99

8542.31.00.01

40

Microchip

微芯片技术

Details

Tray

活跃

接口集成电路

RAID控制器

I/O Controller Interface IC

I/O Controller Interface IC

N/A

-

表面贴装

888-BFBGA, FCBGA

888-FCBGA (25x25)

微芯片技术

0 C

+ 105 C

40

Tube

活跃

SMD/SMT

Serial

0°C ~ 105°C

Tray

-

Networking

1 V

-

-

-

-

0.85V ~ 0.95V, 1.7V ~ 1.9V

0.85V ~ 0.95V, 1.7V ~ 1.9V

以太网交换机

-

N/A

-

VQFN-64

Details

SMD/SMT

RGMII

- 40 C

+ 105 C

260

Tray

3.3 V

10 Mb/s, 100 Mb/s, 1 Gb/s

8 Transceivers

以太网收发器

N/A

-

表面贴装

VQFN-64

64-VQFN (8x8)

微芯片技术

0 C

+ 70 C

1000

1.71 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

3.63 V

Details

SMD/SMT

GMII/MII/RGMII

0°C ~ 70°C (TA)

Reel

-

收发器

1.067V ~ 1.21V, 2.375V ~ 2.75V, 3.135V ~ 3.63V

3.3 V

1000 Mb/s

Ethernet

8/8

Half Duplex, Full Duplex

以太网收发器

10BASE-T, 100BASE-TX, 1000BASE-T

N/A

-

VQFN-64

PG-VQFN-68

微芯片技术

Details

SMD/SMT

RGMII/RMII/MII

- 40 C

+ 85 C

1000

1.8 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

3.63 V

-40°C ~ 105°C

Reel

-

-

Switch

3.3 V

MII, RGMII, RMII, SPI

-

100 Mb/s

Ethernet

IEEE 802.3, 100 Base-T PHY

以太网交换机

100BASE-T1

N/A

-

表面贴装

VQFN-64

64-VQFN (8x8)

微芯片技术

- 40 C

+ 105 C

260

1.71 V

Tray

活跃

3.63 V

Details

SMD/SMT

GMII/MII/RGMII

-40°C ~ 105°C (TA)

Tray

-

收发器

1.067V ~ 1.21V, 2.375V ~ 2.75V, 3.135V ~ 3.63V

3.3 V

1000 Mb/s

Ethernet

8/8

Half Duplex, Full Duplex

以太网收发器

10BASE-T, 100BASE-TX, 1000BASE-T

N/A

-

TQFP-EP-128

128-TQFP (14x14)

微芯片技术

Details

SMD/SMT

RGMII/RMII/MII

- 40 C

+ 85 C

90

1.8 V

Tray

活跃

3.63 V

-40°C ~ 105°C

Tray

-

-

Switch

3.3 V

MII, RGMII, RMII, SPI

-

100 Mb/s

Ethernet

IEEE 802.3, 100 Base-T PHY

以太网交换机

100BASE-T1

N/A

-

VQFN-64

PG-VQFN-68

微芯片技术

Details

SMD/SMT

RGMII/RMII/MII

- 40 C

+ 85 C

260

1.8 V

Tray

活跃

3.63 V

-40°C ~ 105°C

Tray

-

-

Switch

3.3 V

MII, RGMII, RMII, SPI

-

100 Mb/s

Ethernet

IEEE 802.3, 100 Base-T PHY

以太网交换机

100BASE-T1

N/A

-

VQFN-32

SMD/SMT

MII/RMII

- 40 C

+ 105 C

1000

1.8 V

3.63 V

Details

Reel

3.3 V

100 Mb/s

以太网收发器

100BASE-T1

N/A

-

Surface Mount, Wettable Flank

VQFN-32

32-VQFN (5x5)

微芯片技术

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

3.63 V

Details

SMD/SMT

MII/RMII

+ 85 C

1000

1.8 V

-40°C ~ 85°C

Reel

flexPWR™

收发器

1.1V

3.3 V

100 Mb/s

Ethernet

4/4

-

以太网收发器

100BASE-T1

N/A

-

TQFP-EP-128

128-TQFP (14x14)

微芯片技术

Details

SMD/SMT

RGMII/RMII/MII

- 40 C

+ 85 C

1000

1.8 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

3.63 V

-40°C ~ 105°C

Reel

-

-

Switch

3.3 V

MII, RGMII, RMII, SPI

-

100 Mb/s

Ethernet

IEEE 802.3, 100 Base-T PHY

以太网交换机

100BASE-T1

N/A

-

表面贴装

WFBGA-169

169-WFBGA (11x11)

微芯片技术

Tray

MEC1703

活跃

Details

SMD/SMT

I2C, SPI

148 I/O

1.8 V, 3.3 V

- 40 C

+ 85 C

69.3 mW

176

1.8 V, 3.3 V

-40°C ~ 85°C (TA)

Tray

-

用于笔记本电脑的键盘和嵌入式控制器

键盘和嵌入式控制器

1.71V ~ 3.465V

1.8 V, 3.3 V

ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI

10 Port

480KB

ARM® Cortex®-M4F

EEPROM (2kB), Boot ROM (64kB)

4 x 16-bit

10 bit

MEC170x

键盘和嵌入式控制器

0.8 mm

11 mm

11 mm

N/A

-

表面贴装

888-BFBGA, FCBGA

888-FCBGA (25x25)

微芯片技术

0 C

+ 105 C

40

Tube

活跃

SMD/SMT

Serial

0°C ~ 105°C

Tray

-

Networking

1 V

-

-

-

-

0.85V ~ 0.95V, 1.7V ~ 1.9V

0.85V ~ 0.95V, 1.7V ~ 1.9V

以太网交换机

-

N/A

-

表面贴装

BBGA-1221

1221-BBGA (29x29)

微芯片技术

36

SMD/SMT

This product may require additional documentation to export from the United States.

Tray

PM6110

活跃

-

Tray

-

网络和通信

-

-

-

-

-

-

以太网PHY

N/A

-

表面贴装

BBGA-1221

1221-BBGA (29x29)

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

36

Tray

PM6108

活跃

-

Tray

-

网络和通信

-

-

-

-

-

-

以太网PHY

N/A

-

SSOP-20

20-SSOP

微芯片技术

Details

SMD/SMT

3 V

- 40 C

+ 125 C

UART, USB

1600

5.5 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

-40°C ~ 125°C (TA)

Reel

-

Bridge, USB to UART

3V ~ 5.5V

Bridge, USB to UART

3 V to 5.5 V

UART

13 mA

Full Speed (FS)

15mA

12 Mb/s

USB

USB 2.0

USB转换器

USB 2.0

N/A

-

WFBGA-144

260

3.465 V

SMD/SMT

SPI

123 I/O

1.71 V

- 40 C

+ 85 C

Embedded

Parity

69.3 mW

Embedded Controller with SPI Integration

1.71 V to 3.465 V

15 Port

32 bit

4 x 16 bit, 2 x 32 bit

16 bit

键盘和嵌入式控制器

N/A

-

表面贴装

WFBGA-176

176-WFBGA (10x10)

微芯片技术

155

Tray

活跃

Details

168

-40°C ~ 85°C (TA)

Tray

-

键盘和嵌入式控制器

1.71V ~ 3.465V

ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI, UART

416kB

ARM® Cortex®-M4F

-

MEC172x

嵌入式控制器

N/A

-

YES

48

有

活跃

MICROCHIP TECHNOLOGY INC

7 X 7 MM, 0.50 MM PITCH, ROHS COMPLIANT, QFN-48

5.59

85 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.6 V

3.3 V

未说明

3 V

USB2513I-HZH

QUAD

无铅

未说明

0.5 mm

compliant

S-XQCC-N48

INDUSTRIAL

BUS CONTROLLER, UNIVERSAL SERIAL BUS

1 mm

I2C; SMBUS

7 mm

7 mm

N/A

-

YES

48

QFN

HVQCCN,

5.23

24 MHz

70 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.6 V

3.3 V

3 V

USB4640-HZH

活跃

MICROCHIP TECHNOLOGY INC

8542.31.00.01

QUAD

无铅

0.5 mm

compliant

48

S-XQCC-N48

不合格

COMMERCIAL

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

1 mm

NO

YES

USB

0.01220703125 MBps

ASYNC, BIT

7 mm

7 mm

N/A

-

QFN-48

YES

48

0 C

2600

SMD/SMT

微芯片技术

Details

3 V

USB2513-HZH

有

不推荐

MICROCHIP TECHNOLOGY INC

HVQCCN,

5.59

70 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.6 V

3.3 V

未说明

+ 70 C

0.005309 oz

集线器控制器

接口集成电路

QUAD

无铅

未说明

0.5 mm

compliant

S-XQCC-N48

3.3 V

COMMERCIAL

150 mA

3 Port

High Speed (HS)

BUS CONTROLLER, UNIVERSAL SERIAL BUS

480 Mb/s

1 mm

USB 接口 IC

I2C; SMBUS

USB集线器

USB 2.0

USB 接口 IC

7 mm

7 mm

N/A

-

YES

56

LAN7850T-I/4F

活跃

MICROCHIP TECHNOLOGY INC

HQCCN, LCC56,.31SQ,20

5.74

25 MHz

11

85 °C

-40 °C

PLASTIC/EPOXY

HQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.26 V

1.2 V

1.1 V

Automotive grade

8542.31.00.01

QUAD

无铅

0.5 mm

compliant

S-PQCC-N56

INDUSTRIAL

SERIAL IO/COMMUNICATION CONTROLLER

1 mm

YES

YES

TS 16949

125 MBps

SYNC, BYTE; ETHERNET

8 mm

8 mm

N/A

-

YES

256

BGA,

5.46

4

125 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

2.5 V

30

VSC8584XKS-13

有

生命周期结束

MICROCHIP TECHNOLOGY INC

BOTTOM

BALL

260

1

1 mm

compliant

S-PBGA-B256

OTHER

1.8 mm

以太网收发器

17 mm

17 mm

N/A

-

Desktop

-

微芯片技术

Obsolete

-

EIB传感器

Bulk

48V

0°C ~ 40°C

-

3.20 L x 2.20 W x 1.00 H (81.3mm x 55.9mm x 25.4mm)

Splitter

CE, FCC

-

-

2

2 A

5V

10/100 Mbps

RJ45 (Data, Power)

RJ45 (Data, Power)

-

10W

IEEE802.3af

N/A

-

表面贴装

888-BFBGA, FCBGA

888-FCBGA (25x25)

微芯片技术

Microchip Technology / Atmel

Tube

活跃

+ 110 C

- 40 C

40

SMD/SMT

Serial

Microchip

-40°C ~ 110°C

Tray

-

Networking

Communication & Networking ICs

1 V

以太网集成电路

-

-

-

-

0.9V ~ 1.9V, 1.5V ~ 3.3V

0.9V ~ 1.9V, 1.5V ~ 3.3V

以太网交换机

-

以太网集成电路