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品牌是'Microchip' (986)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源 | 通道数量 | 界面 | 电路数量 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 端口的数量 | 电源电流 | 最大电源电流 | 电源电流-最大值 | 电流源 | 逻辑功能 | 数据率 | 通信IC类型 | 最大工作周期 | 收发器数量 | 最大电源电压（DC） | 最小电源电压(DC) | 电池供电 | PSRR-Min | 混合动力车 | 马克斯噪音 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | ZL50012GDG2 | Microchip Technology | 数据表 | 60 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 144-LBGA | 144 | -40°C~85°C | Tray | 2006 | e1 | 活跃 | 3 (168 Hours) | 144 | 锡银铜 | 3V~3.6V | BOTTOM | BALL | 3.3V | ZL50012 | Switch | 3.3V | 1 | 250mA | 16 | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | VSC7440XMT | Microchip Technology | 数据表 | 1600 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-BGA | 324-BGA (19x19) | Tray | SparX™-IV-34 | 活跃 | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL88601LDF1 | Microchip Technology | 数据表 | 2009 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 64 | 3.135V~3.465V | QUAD | 3.3V | 0.5mm | S-XQCC-N64 | Telecom Circuit | 3.3V | PCM | 1 | 3.465V | 3.135V | 2-4 CONVERSION | 9mm | 9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | LE58QL061BVC | Microchip Technology | 数据表 | 2400 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 44-TQFP | 44 | 44-TQFP (10x10) | -40°C~85°C | Tray | 2007 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 3.3V | Subscriber Line Interface Concept (SLIC) | 3.3V | PCM | 4 | 3.135V | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8502XML | Microchip Technology | 数据表 | 714 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | QFN | 135-QFN (12x12) | Commercial grade | Tray | 活跃 | 4 (72 Hours) | 125°C | 0°C | 3.3V | Ethernet | Ethernet | 1 | 1 Gbps | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT8870DN1 | Microchip Technology | 数据表 | 59 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | 453.59237mg | -40°C~85°C | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 500mW | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 3.58MHz | 30 | DTMF接收器 | 5V | 5V | 1 | 3mA | 9mA | Receiver | DTMF信号电路 | 2mm | 7.2mm | 5.3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | LE89810BSCT | Microchip Technology | 数据表 | 5000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | SOIC | 16-SOIC | 665.986997mg | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 2 | PCM | 1 | 电信电路 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE9642PQC | Microchip Technology | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 3 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 48-VFQFN Exposed Pad | YES | Industrial grade | -40°C~85°C | Tray | miSLIC™ | 活跃 | 3 (168 Hours) | 48 | 3.135V~3.465V | QUAD | 无铅 | 3.3V | 0.5mm | unknown | S-XQCC-N48 | Subscriber Line Interface Concept (SLIC) | 4-Wire | 2 | 25mA | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | VSC8582XKS-11 | Microchip Technology | 数据表 | 3080 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 256-BGA | YES | -40°C~125°C | Tray | 活跃 | 4 (72 Hours) | 256 | 1V | BOTTOM | BALL | 1V | unknown | S-PBGA-B256 | Ethernet | GMII, SerDes, SPI, TBI | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9041BP1 | Microchip Technology | 数据表 | 84 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 28-PLCC | 1.182714g | -40°C~85°C | Tube | 2001 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 4.5V~5.5V | 数字锁相环 | 1 | 5.5V | 4.5V | 60mA | 60mA | 60mA | 60mA | 60 % | 1 | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | LE79R70DJC | Microchip Technology | 数据表 | 53 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | 32-PLCC (11.43x13.97) | Commercial grade | 0°C~70°C | Tube | 2002 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 4.75V~5.25V | Subscriber Line Interface Concept (SLIC) | 5V | 2-Wire | 1 | 4.75V | 6.5mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | ZL38002QDG1 | Microchip Technology | 数据表 | 291 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 48-TQFP | YES | 48 | 9.071791g | -40°C~85°C | Tray | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 哑光锡 | 90mW | 2.7V~3.6V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 20MHz | 30 | 回声消除 | 3.3V | 2 | Serial | 1 | 20mA | ISDN回音消除器 | 7mm | 7mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
 | ZL50111GAG2 | Microchip Technology | 数据表 | 5000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 552-BGA | 552-PBGA (35x35) | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | 1.65V~1.95V | ZL50111 | Telecom Circuit | TDM | 1 | 950mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9122AP1 | Microchip Technology | 数据表 | 160 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | -40°C~85°C | Tube | e3 | yes | 活跃 | 1 (Unlimited) | 28 | 哑光锡 | 4.5V~5.5V | QUAD | J BEND | 260 | 5V | 30 | 回声消除 | 5V | 5V | Serial | 2 | 70mA | ISDN回音消除器 | 4.57mm | 11.505mm | 11.505mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | LE79112AKVC | Microchip Technology | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | TQFP | 128 | 128-TQFP | 503.487531mg | Tray | 活跃 | 3 (168 Hours) | 3.3V | Telecom Circuit | 2-Wire | 32 | 3.3V | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT88L70ASR1 | Microchip Technology | 数据表 | 2000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 18 | -40°C~85°C | Tape & Reel (TR) | 2003 | e3 | yes | 活跃 | 3 (168 Hours) | 18 | EAR99 | 哑光锡 | 500mW | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 3V | 3.58MHz | 30 | DTMF接收器 | 3V | 3V | 1 | 2mA | Receiver | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||
 | MT8888CS1 | Microchip Technology | 数据表 | 5000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | 800.987426mg | -40°C~85°C | Tube | 2000 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 1W | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 3.58MHz | 30 | DTMF 收发器 | 5V | 5V | 1 | 7mA | 收发器 | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
 | LE79R79-1DJCT | Microchip Technology | 数据表 | 224 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Industrial grade | 0°C~70°C | Tape & Reel (TR) | e3 | 活跃 | 3 (168 Hours) | 32 | 哑光锡 | 4.75V~5.25V | QUAD | J BEND | 5V | Subscriber Line Interface Concept (SLIC) | 不合格 | 5V | 5V | 2-Wire | 1 | 6.5mA | CONSTANT CURRENT | 30 dB | 2-4 CONVERSION | 79 dBrnC | 3.556mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| MT8880CS1 | Microchip Technology | 数据表 | 800 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | 800.987426mg | -40°C~85°C | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 1W | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 3.58MHz | 30 | DTMF 收发器 | 不合格 | 5V | 5V | 1 | 7mA | 收发器 | DTMF信号电路 | 2.65mm | 7.5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||
 | LE79114KVC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 128-TQFP | 128-TQFP | Tray | 活跃 | 3 (168 Hours) | 3.3V | PCM | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE88286DLC | Microchip Technology | 数据表 | 27950 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 80-LQFP | 80 | 80-eLQFP | Tray | 2001 | 活跃 | 3 (168 Hours) | 4.75V~35V | Telecom Circuit | PCM | 2 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9075BL1 | Microchip Technology | 数据表 | 2500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 100-BQFP | 100-MQFP (14x20) | -40°C~85°C | Tray | 2001 | 活跃 | 1 (Unlimited) | 4.75V~5.25V | 收发器 | 1 | 150mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT8889CSR1 | Microchip Technology | 数据表 | 41 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | -40°C~85°C | Tape & Reel (TR) | 2001 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 5V | 3.579MHz | DTMF 收发器 | 5V | 5V | 1 | 7mA | 收发器 | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | LE57D111BTC | Microchip Technology | 数据表 | 121 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) | Industrial grade | -40°C~85°C | Tray | 2011 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 4.75V~5.25V | Subscriber Line Interface Concept (SLIC) | 5V | 2 | 4.75V | 9mA | 9mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8486YSN-04 | Microchip Technology | 数据表 | 11 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-BBGA, FCBGA | 256-FCBGA (17x17) | Tray | 活跃 | 4 (72 Hours) | 1.2V | 收发器 | Serial | 1 | 10 Gbps | 1 | ROHS3 Compliant | 无铅 |
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ZL50012GDG2
Microchip Technology
分类:Interface - Telecom
-
VSC7440XMT
Microchip Technology
分类:Interface - Telecom
-
ZL88601LDF1
Microchip Technology
分类:Interface - Telecom
-
LE58QL061BVC
Microchip Technology
分类:Interface - Telecom
-
VSC8502XML
Microchip Technology
分类:Interface - Telecom
-
MT8870DN1
Microchip Technology
分类:Interface - Telecom
-
LE89810BSCT
Microchip Technology
分类:Interface - Telecom
-
LE9642PQC
Microchip Technology
分类:Interface - Telecom
-
VSC8582XKS-11
Microchip Technology
分类:Interface - Telecom
-
MT9041BP1
Microchip Technology
分类:Interface - Telecom
-
LE79R70DJC
Microchip Technology
分类:Interface - Telecom
-
ZL38002QDG1
Microchip Technology
分类:Interface - Telecom
-
ZL50111GAG2
Microchip Technology
分类:Interface - Telecom
-
MT9122AP1
Microchip Technology
分类:Interface - Telecom
-
LE79112AKVC
Microchip Technology
分类:Interface - Telecom
-
MT88L70ASR1
Microchip Technology
分类:Interface - Telecom
-
MT8888CS1
Microchip Technology
分类:Interface - Telecom
-
LE79R79-1DJCT
Microchip Technology
分类:Interface - Telecom
-
MT8880CS1
Microchip Technology
分类:Interface - Telecom
-
LE79114KVC
Microchip Technology
分类:Interface - Telecom
-
LE88286DLC
Microchip Technology
分类:Interface - Telecom
-
MT9075BL1
Microchip Technology
分类:Interface - Telecom
-
MT8889CSR1
Microchip Technology
分类:Interface - Telecom
-
LE57D111BTC
Microchip Technology
分类:Interface - Telecom
-
VSC8486YSN-04
Microchip Technology
分类:Interface - Telecom