品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 内存大小 | 电流源 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | M1A3PE3000-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 341 | 0°C~85°C TJ | Tray | 2015 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3PE3000 | 63kB | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.575V | 1.425V | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2GL150TS-FCG1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 1152-BBGA, FCBGA | YES | 574 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | S-PBGA-B1152 | 574 | 不合格 | 1.2V | 574 | 现场可编程门阵列 | 146124 | 5120000 | 2.9mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||||||||||||||
![]() | M1A3PE3000-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M1A3PE3000 | 341 | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 231MHz | 75264 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||
![]() | M2GL150TS-1FC1152 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | YES | 574 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 1.2V | BOTTOM | BALL | 240 | 20 | 574 | 不合格 | 625kB | 574 | 现场可编程门阵列 | 146124 | 5120000 | 1 | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
![]() | M1A3PE3000-2FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 341 | 0°C~85°C TJ | Tray | 2015 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3PE3000 | 63kB | 516096 | 3000000 | 310MHz | 2 | 75264 | 1.575V | 1.425V | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2GL060T-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B400 | 现场可编程门阵列 | 56520 | 1869824 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||
![]() | A42MX36-3BGG272I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 202 | -40°C~85°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 272 | 5V | BOTTOM | BALL | A42MX36 | 202 | 320B | 现场可编程门阵列 | 2560 | 54000 | 180MHz | 1184 | 3 | 1822 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | APA750-FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 562 | 0°C~70°C TA | Tray | 2007 | ProASICPLUS | e0 | 活跃 | 3 (168 Hours) | 896 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 225 | 180MHz | 30 | APA750 | 562 | 2.52.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 750000 | 32768 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||
![]() | A3P1000-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.5V | QUAD | 鸥翼 | 245 | 0.5mm | 272MHz | 40 | A3P1000 | 18kB | 18kB | 75mA | 现场可编程门阵列 | 11000 | 147456 | 1000000 | 1 | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||
![]() | M2GL050TS-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 30 | S-PBGA-B325 | 200 | 不合格 | 1.2V | 200 | 现场可编程门阵列 | 56340 | 1869824 | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M2GL060-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M2GL060TS-1FCSG325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 30 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | A3P1000-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.5V | QUAD | 鸥翼 | 245 | 0.5mm | 310MHz | 40 | A3P1000 | 18kB | 18kB | 75mA | 现场可编程门阵列 | 11000 | 147456 | 1000000 | 2 | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||
![]() | M2GL060TS-1FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 30 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | M2GL060-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M2GL050T-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 1mm | 20 | S-PBGA-B484 | 267 | 不合格 | 1.2V | 267 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2GL060TS-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M2GL060T-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 1mm | 20 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
![]() | M2GL050TS-VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | S-PBGA-B400 | 207 | 不合格 | 1.2V | 207 | 现场可编程门阵列 | 56340 | 1869824 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | M2GL050-FG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 896-BGA | YES | 377 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 1mm | 20 | S-PBGA-B896 | 377 | 不合格 | 1.2V | 377 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 31mm | 31mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2GL060-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 1.14V~2.625V | BOTTOM | BALL | 260 | 30 | 228.3kB | 现场可编程门阵列 | 56520 | 1869824 | 1 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M2GL010T-1VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M2GL010T-1VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
![]() | M2GL010-1TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.2V | QUAD | 鸥翼 | 260 | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 12084 | 933888 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | A3P250-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 151 | 0°C~85°C TJ | Tray | 2011 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 231MHz | A3P250 | 4.5kB | 4.5kB | 3mA | 3000 | 36864 | 250000 | 231MHz | 6144 | 1.575V | 1.425V | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 |
M1A3PE3000-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL150TS-FCG1152I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3PE3000-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL150TS-1FC1152
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3PE3000-2FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060T-1VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-3BGG272I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA750-FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL050TS-FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060TS-1FCSG325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060TS-1FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL050T-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060TS-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060T-1FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL050TS-VFG400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL050-FG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010T-1VFG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010T-1VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010-1TQG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P250-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
