我的订单
会员中心 
在线咨询
0755-83328606
品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 内存大小 | 电流源 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 速度等级 | 寄存器数量 | 逻辑块数量 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3P125-VQG100I | Microsemi Corporation | 数据表 | 24 In Stock | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 8542.39.00.01 | 1.5V | QUAD | 鸥翼 | 260 | 0.5mm | 231MHz | 40 | A3P125 | 4.5kB | 4.5kB | 15mA | 现场可编程门阵列 | 1500 | 36864 | 125000 | 3072 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||
 | M2GL010TS-1VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| M2GL010TS-1VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | M1A3P600-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 231MHz | 40 | M1A3P600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M1A3P600-1FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 1.5V | 272MHz | M1A3P600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1 | 13824 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | M2GL010TS-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 233 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | S-PBGA-B484 | 233 | 不合格 | 1.2V | 233 | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||
| M1A3P600-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | M1A3P600 | 不合格 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 1.55mm | 13mm | 13mm | 符合RoHS标准 | ||||||||||||||||||||||||
| M2GL025-VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 27696 | 1130496 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| M1A3P600-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 40 | M1A3P600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 272MHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M1A3P600-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 256 | 1.5V | BOTTOM | BALL | 1mm | M1A3P600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 310MHz | 2 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| A3P125-1FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P125 | 4.5kB | 36864 | 125000 | 272MHz | 1 | 3072 | 1.575V | 1.425V | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| M2GL005-VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 161 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 6060 | 719872 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| A3P125-2FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | A3P125 | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 310MHz | 2 | 3072 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| A3P250-1VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 68 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 272MHz | A3P250 | 4.5kB | 36864 | 250000 | 272MHz | 1 | 6144 | 1.575V | 1.425V | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
| M1A3P250-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P250 | 4.5kB | 36864 | 250000 | 231MHz | 6144 | 1.575V | 1.425V | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| A3P125-1FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 272MHz | 40 | A3P125 | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 1 | 3072 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
 | AGLP030V5-CSG201 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 201-VFBGA, CSBGA | 201 | 201-CSP (8x8) | 120 | 0°C~85°C TJ | Tray | 2012 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGLP030 | 792 | 30000 | 892.86MHz | 792 | 1.575V | 1.425V | 660μm | 8mm | 8mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | M2GL060-FCSG325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 30 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A3P060-2VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P060 | 2.3kB | 18432 | 60000 | 310MHz | 2 | 1536 | 1.575V | 1.425V | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | AGLN125V5-CSG81 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 81-WFBGA, CSBGA | 81 | 81-CSP (5x5) | 60 | -20°C~85°C TJ | Tray | 2013 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.5V | AGLN125 | 4.5kB | 3072 | 36864 | 125000 | 1.575V | 1.425V | 660μm | 5mm | 5mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
| A3P030-2VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 77 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 1.5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | A3P030 | 现场可编程门阵列 | 30000 | 310MHz | 2 | 768 | 768 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| A3P030-1VQG100I | Microsemi Corporation | 数据表 | 20 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 77 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 1.5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | A3P030 | 现场可编程门阵列 | 30000 | 272MHz | 1 | 768 | 768 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| A3P060-2VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 1.5V | QUAD | 鸥翼 | 225 | 0.5mm | 30 | A3P060 | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 310MHz | 2 | 1536 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
| A3P125-2VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P125 | 4.5kB | 4.5kB | 2mA | 1500 | 36864 | 125000 | 310MHz | 2 | 3072 | 1.575V | 1.425V | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||
| A3P125-2VQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 100 | 锡铅 | 1.5V | QUAD | 鸥翼 | 225 | 0.5mm | 30 | A3P125 | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 310MHz | 2 | 3072 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant |
-
A3P125-VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010TS-1VFG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010TS-1VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-1FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010TS-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025-VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-2FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P250-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP030V5-CSG201
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-FCSG325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-2VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN125V5-CSG81
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P030-2VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P030-1VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-2VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-2VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-2VQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)