品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | AGLN125V5-CSG81 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 81-WFBGA, CSBGA | 81 | 81-CSP (5x5) | 60 | -20°C~85°C TJ | Tray | 2013 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | AGLN125 | 1.5V | 1.575V | 1.425V | 4.5kB | 3072 | 36864 | 125000 | 660μm | 5mm | 5mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||
A3P030-2VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 77 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 40 | A3P030 | 1.5V | 现场可编程门阵列 | 30000 | 310MHz | 2 | 768 | 768 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
A3P030-1VQG100I | Microsemi Corporation | 数据表 | 20 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 77 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 40 | A3P030 | 1.5V | 现场可编程门阵列 | 30000 | 272MHz | 1 | 768 | 768 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
A3P060-2VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3P060 | 1.5V | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 310MHz | 2 | 1536 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
A3P125-2VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P125 | 1.5V | 1.575V | 1.425V | 4.5kB | 2mA | 4.5kB | 1500 | 36864 | 125000 | 310MHz | 2 | 3072 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||||||
A3P125-2VQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 100 | 锡铅 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3P125 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 310MHz | 2 | 3072 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
A3P060-2VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 40 | A3P060 | 1.5V | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 310MHz | 2 | 1536 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | A3P060-1FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 96 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 40 | A3P060 | 1.5V | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 272MHz | 1 | 1536 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
![]() | MPF200T-FCG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 244 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500T-FCG1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | 584 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 现场可编程门阵列 | 481000 | 33792000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
![]() | M2GL010TS-1VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
![]() | M2GL010TS-1VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | M1A3P600-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 231MHz | 40 | M1A3P600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
![]() | M1A3P600-1FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 1.425V~1.575V | 272MHz | M1A3P600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1 | 13824 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
![]() | M2GL010TS-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 233 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 233 | 不合格 | 1.2V | 233 | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
![]() | M1A3P600-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | M1A3P600 | 不合格 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 1.55mm | 13mm | 13mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M2GL025-VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 27696 | 1130496 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | M1A3P600-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 40 | M1A3P600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 272MHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
![]() | AGL060V5-CSG121 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 121-VFBGA, CSBGA | 121 | 121-CSP (6x6) | 96 | 0°C~70°C TA | Tray | 2000 | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL060 | 1.5V | 1.575V | 1.425V | 2.3kB | 1536 | 18432 | 60000 | 892.86MHz | 990μm | 6mm | 6mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||
AGLN250V2-VQG100 | Microsemi Corporation | 数据表 | 2080 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 68 | -20°C~85°C TJ | Tray | 2013 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.14V~1.575V | AGLN250 | 1.5V | 1.575V | 1.14V | 4.5kB | 34μA | 4.5kB | 6144 | 36864 | 250000 | 250MHz | 1mm | 14mm | 14mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||
AGLN125V5-VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | -20°C~85°C TJ | Tray | 2013 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | AGLN125 | 1.5V | 1.575V | 1.425V | 4.5kB | 18μA | 4.5kB | 3072 | 36864 | 125000 | 250MHz | 1mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | AGLN020V5-UCG81 | Microsemi Corporation | 数据表 | 370 In Stock | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 81-WFBGA, CSBGA | 81 | 81-UCSP (4x4) | 52 | -20°C~85°C TJ | Tray | 2012 | IGLOO nano | Obsolete | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | AGLN020 | 1.5V | 1.575V | 1.425V | 6μA | 520 | 20000 | 250MHz | 660μm | 4mm | 4mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
![]() | A40MX04-PQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-BQFP | 100 | 100-PQFP (20x14) | 1.758804g | 69 | 0°C~70°C TA | Tray | 2009 | MX | Obsolete | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A40MX04 | 5V | 5.25V | 3V | 547 | 6000 | 139MHz | 547 | 273 | 2.7mm | 20mm | 14mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||
A1020B-PQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 100-BQFP | 100 | 69 | -40°C~85°C TA | Tray | 1997 | ACT™ 1 | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 4.5V~5.5V | QUAD | 鸥翼 | 225 | 5V | 0.65mm | 48MHz | 30 | A1020 | 100 | 69 | 5V | 5V | 4.5 ns | 4.5 ns | 现场可编程门阵列 | 547 | 2000 | 273 | 547 | 547 | 3.4mm | 20mm | 14mm | 无 | Non-RoHS Compliant |
AGLN125V5-CSG81
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P030-2VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P030-1VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P060-2VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P125-2VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P125-2VQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P060-2VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P060-1FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF200T-FCG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF500T-FCG1152I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010-VFG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010TS-1VFG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010TS-1VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600-1FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010TS-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL025-VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL060V5-CSG121
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN250V2-VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN125V5-VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN020V5-UCG81
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX04-PQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1020B-PQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
