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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 时钟频率 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A42MX36-3PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 176 | -40°C~85°C TA | Tray | MX | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 245 | 3.3V | 0.5mm | 40 | A42MX36 | 5V | 320B | 现场可编程门阵列 | 2560 | 54000 | 180MHz | 1184 | 3 | 1822 | 1.9 ns | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| A3P1000-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 310MHz | 40 | A3P1000 | 1.5V | 18kB | 75mA | 18kB | 现场可编程门阵列 | 11000 | 147456 | 1000000 | 2 | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | M2GL060TS-1FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
 | M2GL060-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
 | M2GL060-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 56520 | 1869824 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | M2GL050T-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B484 | 267 | 不合格 | 1.2V | 267 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M2GL060TS-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
 | M2GL060T-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| M2GL050TS-VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B400 | 207 | 不合格 | 1.2V | 207 | 现场可编程门阵列 | 56340 | 1869824 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M2GL050-FG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 896-BGA | YES | 377 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B896 | 377 | 不合格 | 1.2V | 377 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 31mm | 31mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M2GL060-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | 1.2V | 228.3kB | 现场可编程门阵列 | 56520 | 1869824 | 1 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M2GL060T-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B400 | 现场可编程门阵列 | 56520 | 1869824 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||
 | A42MX36-3BGG272I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 202 | -40°C~85°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 272 | 3V~3.6V 4.5V~5.5V | BOTTOM | BALL | A42MX36 | 202 | 5V | 320B | 现场可编程门阵列 | 2560 | 54000 | 180MHz | 1184 | 3 | 1822 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | APA750-FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 562 | 0°C~70°C TA | Tray | 2007 | ProASICPLUS | e0 | 活跃 | 3 (168 Hours) | 896 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 225 | 2.5V | 180MHz | 30 | APA750 | 562 | 2.5V | 2.52.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 750000 | 32768 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| A42MX36-BGG272M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 202 | -55°C~125°C TC | Tray | MX | e1 | 活跃 | 3 (168 Hours) | 272 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | BOTTOM | BALL | 250 | 3.3V | 40 | A42MX36 | 5V | 320B | 现场可编程门阵列 | 2560 | 54000 | 131MHz | 1184 | 1822 | 2.7 ns | 2438 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| A3P1000-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 272MHz | 40 | A3P1000 | 1.5V | 18kB | 75mA | 18kB | 现场可编程门阵列 | 11000 | 147456 | 1000000 | 1 | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| M2GL050TS-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B325 | 200 | 不合格 | 1.2V | 200 | 现场可编程门阵列 | 56340 | 1869824 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M2GL060-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M2GL060TS-1FCSG325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
| M1AFS600-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 119 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AFS600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M2GL060TS-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
 | U1AFS250-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 114 | -40°C~100°C TJ | Tray | Fusion® | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | U1AFS250 | 不合格 | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 6144 | 1.68mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M2GL090T-1FCS325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | M1AGL1000V2-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484 | 300 | -40°C~85°C TA | Tray | 2010 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | M1AGL1000 | 不合格 | 18kB | 108MHz | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| AFS600-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 172 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AFS600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant |
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A42MX36-3PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050T-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-1FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050TS-VFG400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050-FG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-1VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-3BGG272I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA750-FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-BGG272M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050TS-FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FCSG325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS600-2FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
U1AFS250-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090T-1FCS325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V2-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)