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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M1A3P1000-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P1000 | 1.5V | 1.575V | 1.425V | 18kB | 147456 | 1000000 | 272MHz | 1 | 24576 | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
 | AFS250-2FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 114 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AFS250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 1.47059GHz | 2 | 6144 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | M1A3P1000-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2000 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 40 | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 272MHz | 1 | 24576 | 2.44mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M1A3P1000-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 484 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 272MHz | 1 | 24576 | 2.44mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M2GL050-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL050 | S-PBGA-B484 | 267 | 不合格 | 1.2V | 228.3kB | 267 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | APA150-FG144A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 100 | -40°C~125°C TJ | Tray | 2007 | ProASICPLUS | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 1mm | APA150 | 100 | 2.5V | 2.52.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 150000 | 180MHz | 6144 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
 | APA150-PQG208A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 208 | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 0.5mm | APA150 | 158 | 2.5V | 2.52.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 150000 | 180MHz | 6144 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | M2GL050-FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 25 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 896-BGA | YES | 377 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | not_compliant | 20 | M2GL050 | S-PBGA-B896 | 377 | 不合格 | 1.2V | 377 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 31mm | 31mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| M1A3P1000-2FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 40 | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| M1A3P1000-2FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 484 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
 | M2GL050T-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | M2GL050T | 207 | 不合格 | 1.2V | 228.3kB | 现场可编程门阵列 | 56340 | 1869824 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | U1AFS600-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 114 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 85°C | 0°C | 1.425V~1.575V | U1AFS600 | 4.5kB | 36864 | 250000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | M1A3PE3000L-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2013 | ProASIC3L | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.14V~1.575V | QUAD | 鸥翼 | 245 | 1.2V | 0.5mm | 40 | M1A3PE3000L | 147 | 1.2V | 63kB | 350MHz | 现场可编程门阵列 | 516096 | 3000000 | 1 | 75264 | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | APA750-FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 562 | 0°C~70°C TA | Tray | 2007 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 250 | 2.5V | 180MHz | 40 | APA750 | 562 | 2.5V | 2.52.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 750000 | 32768 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| M1A3PE3000L-1FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 620 | -40°C~100°C TJ | Tray | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.575V | BOTTOM | BALL | 250 | 1.2V | 40 | M1A3PE3000L | 620 | 1.2V | 63kB | 350MHz | 现场可编程门阵列 | 516096 | 3000000 | 1 | 75264 | 2.44mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M1AFS1500-1FG484K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 223 | -55°C~100°C TJ | Tray | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | M1AFS1500 | 33.8kB | 276480 | 1500000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| AFS1500-1FG484K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 223 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | AFS1500 | 33.8kB | 276480 | 1500000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| APA750-FG896A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 562 | -40°C~125°C TJ | Tray | ProASICPLUS | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | APA750 | 562 | 2.5V | 2.52.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 750000 | 180MHz | 32768 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| AX500-FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | Military grade | -55°C~125°C TA | Tray | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 649MHz | 40 | AX500 | 336 | 1.5V | 1.51.5/3.32.5/3.3V | 9kB | 990 ps | 990 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | MIL-STD-883 Class B | 5376 | 0.99 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M1A3PE3000L-1FG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | -55°C~125°C TJ | Tray | 2014 | ProASIC3L | 活跃 | 3 (168 Hours) | 125°C | -55°C | 1.425V~1.575V | M1A3PE3000L | 1.5V | 1.575V | 1.14V | 25mA | 63kB | 516096 | 3000000 | 350MHz | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| M1A3PE3000L-1FGG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 620 | -55°C~125°C TJ | Tray | 2009 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 896 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.2V | 1mm | 40 | M1A3PE3000L | S-PBGA-B896 | 620 | 不合格 | 1.2/1.51.2/3.3V | 63kB | 250MHz | 620 | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 75264 | 2.44mm | 31mm | 31mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| A54SX72A-FGG256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 203 | -55°C~125°C TC | Tray | 2006 | SX-A | 活跃 | 3 (168 Hours) | 125°C | -55°C | 2.25V~5.25V | 217MHz | A54SX72A | 2.5V | 2.75V | 2.25V | 1.5 ns | 1.5 ns | 6036 | 108000 | 217MHz | 6036 | 6036 | 4024 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A54SX08A-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 130 | 0°C~70°C TA | Tray | 2007 | SX-A | Obsolete | 3 (168 Hours) | 70°C | 0°C | 2.25V~5.25V | 238MHz | A54SX08A | 2.5V | 2.75V | 2.25V | 1.2 ns | 1.2 ns | 768 | 12000 | 238MHz | 768 | 768 | 512 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
| A1280A-1PG176C | Microsemi Corporation | 数据表 | 1096 In Stock | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Through Hole | 通孔 | 176-BCPGA | 176 | 140 | 0°C~70°C TA | Tray | 2005 | ACT™ 2 | e0 | Obsolete | 3 (168 Hours) | 176 | 锡铅 | 4.5V~5.5V | PERPENDICULAR | PIN/PEG | 5V | 2.54mm | 90MHz | A1280 | 140 | 5V | 5V | 4.3 ns | 现场可编程门阵列 | 1232 | 8000 | 1 | 998 | 7.874mm | 39.878mm | 39.878mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| AX500-2PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 115 | 0°C~70°C TA | Tray | 1995 | Axcelerator | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX500 | 1.5V | 1.575V | 1.425V | 9kB | 740 ps | 740 ps | 5376 | 73728 | 500000 | 870MHz | 8064 | 5376 | 2 | 5376 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant |
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M1A3P1000-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS250-2FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA150-FG144A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA150-PQG208A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050-FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-2FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-2FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050T-1VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
U1AFS600-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000L-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA750-FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000L-1FGG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-1FG484K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-1FG484K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA750-FG896A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000L-1FG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000L-1FGG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX72A-FGG256M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX08A-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1280A-1PG176C
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-2PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)