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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出的数量 | 电源 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 电流源 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AFS1500-1FG256K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | -55°C~100°C TJ | Tray | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | AFS1500 | 33.8kB | 276480 | 1500000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
 | AFS1500-1FGG484K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 223 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | AFS1500 | 33.8kB | 276480 | 1500000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | M1A3PE3000-2FG324 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 324-BGA | 324-FBGA (19x19) | 221 | 0°C~85°C TJ | Tray | 2015 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3PE3000 | 63kB | 516096 | 3000000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| M2GL005S-1VFG256T2 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | 161 | -40°C~125°C TJ | Tray | 2014 | Automotive, AEC-Q100, IGLOO2 | yes | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 未说明 | 未说明 | 现场可编程门阵列 | 6060 | 719872 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
| M1A3P400-2FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 97 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
 | AGL125V2-FGG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | 0°C~70°C TA | Tray | 2016 | IGLOO | e1 | Obsolete | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | 260 | 30 | AGL125 | 4.5kB | 现场可编程门阵列 | 3072 | 36864 | 125000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| AGL400V2-FGG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | 0°C~70°C TA | Tray | 2016 | IGLOO | e1 | Obsolete | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | 260 | 30 | AGL400 | 6.8kB | 现场可编程门阵列 | 9216 | 55296 | 400000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
 | AGLN125V2-ZVQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | -20°C~85°C TJ | Tray | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.14V~1.575V | AGLN125 | 4.5kB | 3072 | 36864 | 125000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | AGLN030V2-ZUCG81 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 81-WFBGA, CSBGA | 81 | 81-UCSP (4x4) | 66 | -20°C~85°C TJ | Tray | 2015 | IGLOO nano | Obsolete | 3 (168 Hours) | 70°C | -20°C | 1.14V~1.575V | AGLN030 | 768 | 30000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
 | AGLN010V5-UCG36 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 36-WFBGA, CSPBGA | 36 | 36-UCSP (3x3) | 23 | -20°C~85°C TJ | Tray | 2012 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.5V | AGLN010 | 3μA | 260 | 10000 | 250MHz | 1.575V | 1.425V | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
| AX500-1FG676M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 336 | Military grade | -55°C~125°C TA | Tray | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 676 | 锡铅 | 1.5V | BOTTOM | BALL | 225 | 30 | AX500 | 336 | 9kB | 850 ps | 现场可编程门阵列 | 5376 | 73728 | 500000 | 763MHz | 8064 | MIL-STD-883 Class B | 1 | 0.84 ns | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||
 | AX500-CQ208M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 10.567001g | 115 | Military grade | -55°C~125°C TA | Tray | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 208 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | QUAD | FLAT | 225 | 0.5mm | 649MHz | 20 | AX500 | 336 | 1.51.5/3.32.5/3.3V | 9kB | 990 ps | 990 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | MIL-STD-883 Class B | 5376 | 0.99 ns | 2.8mm | 29.21mm | 29.21mm | 无 | Non-RoHS Compliant | ||||||||||||||||
| A3PE3000L-FGG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -55°C~125°C TJ | Tray | 2009 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 896 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 1mm | 40 | A3PE3000L | 620 | 1.2/1.51.2/3.3V | 63kB | 250MHz | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 2.44mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
| A3P1000-FGG256T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~125°C TA | Tray | 2009 | Automotive, AEC-Q100, ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | 锡银铜 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1mm | 40 | A3P1000 | 177 | 1.5/3.3V | 18kB | 8mA | 现场可编程门阵列 | 147456 | 1000000 | 231MHz | 24576 | 1.8mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
 | M1A3PE1500-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 1998 | ProASIC3E | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.5V | QUAD | 鸥翼 | 245 | 0.5mm | 40 | M1A3PE1500 | 147 | 1.5/3.3V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 231MHz | 38400 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M7AFS600-1FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | 0°C~70°C TA | Tray | Fusion® | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.5V | BOTTOM | BALL | 225 | 30 | M7AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| M7AFS600-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | 0°C~70°C TA | Tray | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 40 | M7AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| M1A3PE1500-2PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | 2015 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3PE1500 | 33.8kB | 276480 | 1500000 | 310MHz | 2 | 38400 | 1.575V | 1.425V | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | M7AFS600-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | 0°C~70°C TA | Tray | Fusion® | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M7AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.0989GHz | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
| M7AFS600-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | 0°C~70°C TA | Tray | Fusion® | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 1mm | 40 | M7AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.0989GHz | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | M1A3PE1500-1FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 444 | 0°C~85°C TJ | Tray | 2015 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3PE1500 | 33.8kB | 276480 | 1500000 | 272MHz | 1 | 38400 | 1.575V | 1.425V | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
| M1A3PE1500-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.5V | QUAD | 鸥翼 | 245 | 0.5mm | 40 | M1A3PE1500 | 147 | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 272MHz | 1 | 38400 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| M7AFS600-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | 0°C~70°C TA | Tray | 2014 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 250 | 40 | M7AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| M1A3PE1500-FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 444 | -40°C~100°C TJ | Tray | 1998 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 1mm | 40 | M1A3PE1500 | 444 | 1.5/3.3V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 231MHz | 38400 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| AX250-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 248 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 250 | 763MHz | 40 | AX250 | 248 | 6.8kB | 850 ps | 850 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | 1 | 2816 | 0.84 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 |
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AFS1500-1FG256K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-1FGG484K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-2FG324
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-1VFG256T2
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V2-FGG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V2-FGG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN125V2-ZVQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN030V2-ZUCG81
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN010V5-UCG36
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-1FG676M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-CQ208M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-FGG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-FGG256T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE1500-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-1FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE1500-2PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE1500-1FGG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE1500-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE1500-FGG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)