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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A42MX24-FTQG176 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 176-TQFP (24x24) | 150 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX24 | 5V | 5.25V | 3V | 912 | 36000 | 912 | 1410 | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | M1A3PE1500-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | 2015 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3PE1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 272MHz | 1 | 38400 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | AFS600-FG484K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 172 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | AFS600 | 13.5kB | 110592 | 600000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | AX500-2FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 870MHz | 40 | AX500 | 336 | 1.5V | 9kB | 740 ps | 740 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 2 | 5376 | 0.74 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
| AFS600-1FG484K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 172 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | AFS600 | 13.5kB | 110592 | 600000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
| AFS600-1FGG484K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 172 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | AFS600 | 13.5kB | 110592 | 600000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
 | M1A3PE3000-2FG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 896 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | M1A3PE3000 | 620 | 1.5V | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 310MHz | 2 | 75264 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
| A54SX32-2BG329 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 329-BBGA | 329 | 249 | 0°C~70°C TA | Tray | 2006 | SX | e0 | 不用于新设计 | 3 (168 Hours) | 329 | 锡铅 | 3V~3.6V 4.75V~5.25V | BOTTOM | BALL | 225 | 3.3V | 320MHz | 30 | A54SX32 | 249 | 5V | 700 ps | 700 ps | 现场可编程门阵列 | 2880 | 48000 | 2 | 1080 | 0.7 ns | 1.8mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| APA600-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 370 | 0°C~70°C TA | Tray | 2007 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 250 | 2.5V | 1mm | 180MHz | 40 | APA600 | 370 | 2.5V | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 21504 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| APA600-PQG208A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 208 | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 0.5mm | APA600 | 158 | 2.5V | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 180MHz | 21504 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| AX1000-2FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 317 | 0°C~70°C TA | Tray | 2012 | Axcelerator | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX1000 | 1.5V | 1.575V | 1.425V | 20.3kB | 740 ps | 740 ps | 12096 | 165888 | 1000000 | 870MHz | 18144 | 12096 | 2 | 12096 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
 | AX1000-1FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 418 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 676 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 763MHz | 30 | AX1000 | 516 | 1.5V | 20.3kB | 850 ps | 850 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 1 | 12096 | 0.84 ns | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| AX1000-2FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 484 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 870MHz | 20 | AX1000 | 1.5V | 20.3kB | 740 ps | 740 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 2 | 12096 | 0.74 ns | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
 | 5962-9958501QYC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 176 | Military grade | -55°C~125°C TJ | Tray | 2009 | MX | e4 | 活跃 | 3 (168 Hours) | 208 | 3A001.A.2.C | GOLD | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | FLAT | 3.3V | 0.5mm | 5962-99585 | Qualified | 5V | 320B | 36000 GATES | 现场可编程门阵列 | 2560 | 54000 | 131MHz | MIL-PRF-38535 Class Q | 1184 | 1822 | 36000 | 3.18mm | 29.21mm | 29.21mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
| AX2000-CQ352M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 352-BFCQFP with Tie Bar | 352 | 10.567001g | 198 | Military grade | -55°C~125°C TA | Tray | 2005 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 352 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | FLAT | 225 | 1.5V | 0.5mm | 649MHz | 20 | AX2000 | 684 | 1.5V | 1.51.5/3.32.5/3.3V | 36kB | 990 ps | 990 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | MIL-STD-883 Class B | 21504 | 0.99 ns | 2.66mm | 48mm | 48mm | 无 | Non-RoHS Compliant | |||||||||||||||||
 | APA1000-LG624M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 624-BCLGA | 624 | 440 | Military grade | -55°C~125°C TC | Tray | 2007 | ProASICPLUS | 活跃 | 3 (168 Hours) | 624 | 3A001.A.2.C | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 2.5V | APA1000 | 2.5V | 5mA | 24.8kB | 现场可编程门阵列 | 202752 | 1000000 | 150MHz | MIL-STD-883 Class B | 56320 | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | A54SX32A-1CQ256B | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 203 | Military grade | -55°C~125°C TJ | Tray | 2006 | SX-A | 活跃 | 3 (168 Hours) | 256 | 32000 TYPICAL GATES AVAILABLE | 2.25V~5.25V | QUAD | FLAT | 2.5V | 0.5mm | A54SX32A | 228 | 2.5V | 2.53.3/5V | 1.1 ns | 现场可编程门阵列 | 48000 | 278MHz | 2880 | MIL-STD-883 Class B | 1 | 1980 | 3.3mm | 36mm | 36mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| A42MX24-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 176 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX24 | 5V | 5.25V | 3V | 912 | 36000 | 250MHz | 912 | 1410 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M7AFS600-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~85°C TA | Tray | Fusion® | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M7AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| M7AFS600-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~85°C TA | Tray | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | M7AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| M7AFS600-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | -40°C~85°C TA | Tray | Fusion® | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | M7AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| M7AFS600-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | -40°C~85°C TA | Tray | Fusion® | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M7AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.0989GHz | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| AX500-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 763MHz | 40 | AX500 | 336 | 1.5V | 9kB | 850 ps | 850 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 1 | 5376 | 0.84 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| M1A3P1000-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 1.425V~1.575V | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 231MHz | 24576 | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| A3P250-1FGG256T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 157 | -40°C~125°C TA | Tray | 2009 | Automotive, AEC-Q100, ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 30 | A3P250 | 157 | 1.5V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 272MHz | 1 | 6144 | 无 | 符合RoHS标准 |
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A42MX24-FTQG176
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE1500-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-FG484K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-2FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-1FG484K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-1FGG484K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-2FG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32-2BG329
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA600-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA600-PQG208A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-2FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-1FG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-2FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
5962-9958501QYC
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-CQ352M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA1000-LG624M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32A-1CQ256B
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-2FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1FGG256T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)