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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M1A3PE3000-2FG324 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 324-BGA | 324-FBGA (19x19) | 221 | 0°C~85°C TJ | Tray | 2015 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3PE3000 | 63kB | 516096 | 3000000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | APA450-FGG256A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~125°C TJ | Tray | ProASICPLUS | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 1mm | APA450 | 186 | 2.5V | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 180MHz | 12288 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | AX500-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 763MHz | 40 | AX500 | 336 | 1.5V | 9kB | 850 ps | 850 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 1 | 5376 | 0.84 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
 | A42MX24-3TQG176 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 176-TQFP (24x24) | 150 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX24 | 5V | 5.25V | 3V | 912 | 36000 | 912 | 3 | 1410 | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M1A3PE3000-1FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2015 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3PE3000 | 1.5V | 1.575V | 1.425V | 63kB | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | M1AFS1500-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 252 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AFS1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | A54SX32-CQ208M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 10.567001g | 174 | -55°C~125°C TC | Tray | SX | e0 | 不用于新设计 | 3 (168 Hours) | 208 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 3V~3.6V 4.75V~5.25V | QUAD | FLAT | 225 | 3.3V | 0.5mm | 205MHz | 20 | A54SX32 | 246 | 5V | 1 ns | 1 ns | 现场可编程门阵列 | 2880 | 48000 | 1080 | 32000 | 2.8mm | 29.21mm | 29.21mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | M1A3P250-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 151 | 0°C~85°C TJ | Tray | 2012 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 272MHz | 1 | 6144 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | M2GL005-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 209 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | M2GL005 | S-PBGA-B484 | 209 | 不合格 | 1.2V | 87.9kB | 209 | 现场可编程门阵列 | 6060 | 719872 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| M2GL005S-1VFG256T2 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | 161 | -40°C~125°C TJ | Tray | 2014 | Automotive, AEC-Q100, IGLOO2 | yes | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 未说明 | 未说明 | 现场可编程门阵列 | 6060 | 719872 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | AGLP030V5-CSG289 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 120 | 0°C~85°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGLP030 | 1.5V | 1.575V | 1.425V | 792 | 30000 | 892.86MHz | 792 | 810μm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| AGLP060V5-CS289 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 157 | 0°C~85°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGLP060 | 1.5V | 1.575V | 1.425V | 2.3kB | 1584 | 18432 | 60000 | 892.86MHz | 512 | 1584 | 810μm | 14mm | 14mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| M1A3P400-2FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 97 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | A3P060-1VQG100T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~125°C TA | Tray | 2008 | Automotive, AEC-Q100, ProASIC3 | 活跃 | 3 (168 Hours) | 100 | 1.425V~1.575V | QUAD | 鸥翼 | 1.5V | 0.5mm | A3P060 | 71 | 1.5V | 2mA | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 272MHz | 1 | 1536 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | AGLN010V5-UCG36 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 36-WFBGA, CSPBGA | 36 | 36-UCSP (3x3) | 23 | -20°C~85°C TJ | Tray | 2012 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | AGLN010 | 1.5V | 1.575V | 1.425V | 3μA | 260 | 10000 | 250MHz | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||
| A3PN060-2VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -20°C~85°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 100 | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 40 | A3PN060 | 1.5V | 2mA | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 350MHz | 2 | 1536 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| A3PN125-2VQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -20°C~85°C TJ | Tray | 2009 | ProASIC3 nano | e0 | 活跃 | 3 (168 Hours) | 100 | 锡铅 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3PN125 | 1.5V | 2mA | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 350MHz | 2 | 3072 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| AGLN125V5-VQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | -20°C~85°C TJ | Tray | 2013 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | AGLN125 | 1.5V | 1.575V | 1.425V | 18μA | 4.5kB | 3072 | 36864 | 125000 | 250MHz | 1mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| A3PN250-2VQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -20°C~85°C TJ | Tray | 2009 | ProASIC3 nano | e0 | 活跃 | 3 (168 Hours) | 100 | 锡铅 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3PN250 | 1.5V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 350MHz | 2 | 6144 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| M1A3P400-1FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.55mm | 13mm | 13mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| A3P125-VQG100T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~125°C TA | Tray | 2013 | Automotive, AEC-Q100, ProASIC3 | 活跃 | 3 (168 Hours) | 100 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 1.5V | 0.5mm | A3P125 | 71 | 1.5V | 1.5/3.3V | 2mA | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 231MHz | 3072 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
| A3P400-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 178 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P400 | 1.5V | 1.575V | 1.425V | 6.8kB | 55296 | 400000 | 272MHz | 1 | 9216 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| M1A3P400-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 178 | -40°C~100°C TJ | Tray | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.8mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M1A3P400-2FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.55mm | 13mm | 13mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| M1A3P400-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 178 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.8mm | 17mm | 17mm | Non-RoHS Compliant |
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M1A3PE3000-2FG324
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA450-FGG256A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-3TQG176
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-1FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-1FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32-CQ208M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P250-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-1VFG256T2
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP030V5-CSG289
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP060V5-CS289
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-1VQG100T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN010V5-UCG36
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN060-2VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN125-2VQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN125V5-VQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN250-2VQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-1FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-VQG100T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)