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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3PE600-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 165 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 310MHz | 2 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | M2GL025TS-1VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 27696 | 1130496 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M2GL060T-FCS325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 200 | 0°C~85°C TJ | Tray | 2011 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | M2GL060-1FCSG325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M2GL060-FCS325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 200 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| M2GL060-1FCS325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| M2GL150TS-1FCS536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | AX1000-1FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 418 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 763MHz | 40 | AX1000 | 516 | 1.5V | 20.3kB | 850 ps | 850 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 1 | 12096 | 0.84 ns | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||
| AX1000-FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 418 | -40°C~85°C TA | Tray | Axcelerator | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.425V~1.575V | 649MHz | AX1000 | 1.5V | 1.575V | 1.425V | 20.3kB | 990 ps | 990 ps | 12096 | 165888 | 1000000 | 649MHz | 18144 | 12096 | 12096 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| AX2000-FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 23 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 586 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 649MHz | 40 | AX2000 | 684 | 1.5V | 1.51.5/3.32.5/3.3V | 36kB | 990 ps | 990 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | 21504 | 0.99 ns | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||
| P1AFS1500-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 30 | P1AFS1500 | 1.5V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 2 | 38400 | 1.68mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| A3P1000-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.8mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M2GL060T-1FCS325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 200 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| M2GL060-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | not_compliant | 20 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| M2GL060TS-1FCS325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| M2GL060TS-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B400 | 现场可编程门阵列 | 56520 | 1869824 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M2GL060TS-FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M2GL060TS-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn63Pb37) | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | not_compliant | 20 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | M2GL060TS-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | P1AFS600-2FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 172 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | P1AFS600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 2 | 13824 | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| A3P250-1VQ100M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -55°C~125°C TJ | Tray | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 100 | 3A001.A.2.C | 锡铅 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 未说明 | 1.5V | 0.5mm | 272MHz | 未说明 | A3P250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 6144 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| M2GL150TS-1FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
 | M1A3PE3000-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2013 | ProASIC3E | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 40 | M1A3PE3000 | 147 | 1.5V | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 310MHz | 2 | 75264 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| A42MX36-FPQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 176 | 0°C~70°C TA | Tray | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX36 | 5V | 5.25V | 3V | 320B | 1184 | 2560 | 54000 | 79MHz | 1184 | 1822 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| AX1000-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 763MHz | 40 | AX1000 | 516 | 1.5V | 20.3kB | 850 ps | 850 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 1 | 12096 | 0.84 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 |
-
A3PE600-2FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-1VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-FCS325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-1FCSG325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-FCS325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-1FCS325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-1FCS536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-1FGG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-FGG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
P1AFS1500-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-1FCS325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FCS325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-FG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
P1AFS600-2FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1VQ100M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-1FCSG536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-FPQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)