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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | EX64-FTQ64 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 64-LQFP | 64 | 360.605934mg | 41 | 0°C~70°C TA | Tray | 2006 | EX | e0 | Obsolete | 1 (Unlimited) | 64 | Tin/Lead (Sn/Pb) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 225 | 2.5V | 0.5mm | 30 | EX64 | 2.5V | 178MHz | 现场可编程门阵列 | 128 | 3000 | 1.4 ns | 1.4mm | 10mm | 10mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
 | AGLN030V5-ZQNG68I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 49 | -40°C~100°C TJ | Tray | 2013 | IGLOO nano | Obsolete | 3 (168 Hours) | 68 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 无铅 | 未说明 | 1.5V | 0.4mm | 未说明 | AGLN030 | 不合格 | 现场可编程门阵列 | 768 | 30000 | 768 | 1mm | 8mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
| EX64-TQ64 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 64-LQFP | 64 | 64-TQFP (10x10) | 360.605934mg | 41 | 0°C~70°C TA | Tray | 2012 | EX | Obsolete | 1 (Unlimited) | 70°C | 0°C | 2.3V~2.7V | 250MHz | EX64 | 2.5V | 2.7V | 2.3V | 1.1 ns | 1.1 ns | 128 | 3000 | 250MHz | 128 | 128 | 1.4mm | 10mm | 10mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | AGL060V5-QNG132I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | YES | 80 | -40°C~85°C TA | Tray | 2013 | IGLOO | Obsolete | 3 (168 Hours) | 132 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BUTT | 未说明 | 1.5V | 0.5mm | compliant | 未说明 | AGL060 | S-XBCC-B132 | 80 | 不合格 | 1.5V | 108MHz | 80 | 现场可编程门阵列 | 1536 | 18432 | 60000 | 0.8mm | 8mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| AGL030V5-QNG132I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | YES | 81 | -40°C~85°C TA | Tray | 2013 | IGLOO | Obsolete | 3 (168 Hours) | 132 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BUTT | 未说明 | 1.5V | 0.5mm | compliant | 未说明 | AGL030 | S-XBCC-B132 | 81 | 不合格 | 1.5V | 108MHz | 81 | 现场可编程门阵列 | 768 | 30000 | 768 | 768 | 0.8mm | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| AGL060V5-QNG132 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 132-WFQFN | 132 | 132-QFN (8x8) | 80 | 0°C~70°C TA | Tray | 2013 | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL060 | 1.5V | 1.575V | 1.425V | 2.3kB | 1536 | 18432 | 60000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| AGL125V2-QNG132I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 132-WFQFN | 132 | 84 | -40°C~85°C TA | Tray | 2013 | IGLOO | Obsolete | 3 (168 Hours) | 132 | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BUTT | 未说明 | 1.2V | 0.5mm | 未说明 | AGL125 | 84 | 不合格 | 1.2/1.5V | 4.5kB | 108MHz | 现场可编程门阵列 | 3072 | 36864 | 125000 | 0.8mm | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
 | AGLN125V2-CSG81 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 81-WFBGA, CSBGA | 81-CSP (5x5) | 60 | -20°C~85°C TJ | Tray | 2015 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.14V~1.575V | AGLN125 | 1.5V | 1.575V | 1.14V | 4.5kB | 3072 | 36864 | 125000 | 660μm | 5mm | 5mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||
| AGLN250V5-ZCSG81 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 81-WFBGA, CSBGA | 81 | 81-CSP (5x5) | 60 | -20°C~85°C TJ | Tray | 2015 | IGLOO nano | Obsolete | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | AGLN250 | 4.5kB | 6144 | 36864 | 250000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | APA150-PQ208A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | Obsolete | 3 (168 Hours) | 208 | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 0.5mm | APA150 | 158 | 2.5V | 2.52.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 150000 | 180MHz | 6144 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| AGL060V2-QNG132I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | YES | 80 | -40°C~85°C TA | Tray | 2013 | IGLOO | Obsolete | 3 (168 Hours) | 132 | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BUTT | 未说明 | 1.2V | 0.5mm | compliant | 未说明 | AGL060 | S-XBCC-B132 | 80 | 不合格 | 1.2/1.5V | 108MHz | 80 | 现场可编程门阵列 | 1536 | 18432 | 60000 | 0.8mm | 8mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | AX250-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 138 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 763MHz | 40 | AX250 | 248 | 1.5V | 6.8kB | 850 ps | 850 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | 1 | 2816 | 0.84 ns | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
| M2GL060T-1FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | IGLOO2 | e0 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | 锡铅 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| AX1000-FGG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 516 | Military grade | -55°C~125°C TA | Tray | 2012 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 896 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 649MHz | 40 | AX1000 | 516 | 1.5V | 1.51.5/3.32.5/3.3V | 20.3kB | 990 ps | 990 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | MIL-STD-883 Class B | 12096 | 0.99 ns | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
 | A54SX32A-CQ256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 256-CQFP (75x75) | 203 | 0°C~70°C TA | Tray | 2007 | SX-A | 活跃 | 3 (168 Hours) | 70°C | 0°C | 2.25V~5.25V | A54SX32A | 2.5V | 1.2 ns | 48000 | 238MHz | 2880 | 2880 | 1980 | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
| M1A3P400-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 178 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | M1A3P400-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.55mm | 13mm | 13mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M1A3P400-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 4.1mm | 28mm | 28mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M1A3P400-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 178 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
| M1A3P400-2PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 151 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
| M1A3P400-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 178 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.8mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M1A3P400-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 4.1mm | 28mm | 28mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | APA1000-CQ352B | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 352-BFCQFP with Tie Bar | YES | 248 | Military grade | -55°C~125°C TJ | Tray | 2007 | ProASICPLUS | e0 | Obsolete | 3 (168 Hours) | 352 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.3V~2.7V | QUAD | FLAT | 225 | 2.5V | 0.5mm | 20 | APA1000 | S-CQFP-F352 | 248 | 不合格 | 2.52.5/3.3V | 180MHz | 248 | 现场可编程门阵列 | 202752 | 1000000 | MIL-STD-883 Class B | 56320 | 2.89mm | 48mm | 48mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
 | A54SX16-CQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 208-CQFP (75x75) | 10.567001g | 175 | 0°C~70°C TA | Tray | 2006 | SX | Obsolete | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | 205MHz | A54SX16 | 5V | 5.25V | 4.75V | 1 ns | 1 ns | 1452 | 24000 | 205MHz | 1452 | 1452 | 528 | 2.8mm | 29.21mm | 29.21mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | EX128-FTQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | 70 | 0°C~70°C TA | Tray | 2012 | EX | e0 | Obsolete | 1 (Unlimited) | 100 | Tin/Lead (Sn/Pb) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 225 | 2.5V | 0.5mm | 30 | EX128 | S-PQFP-G100 | 178MHz | 现场可编程门阵列 | 256 | 6000 | 1.4 ns | 1.6mm | 14mm | 14mm | Non-RoHS Compliant |
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EX64-FTQ64
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN030V5-ZQNG68I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
EX64-TQ64
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL060V5-QNG132I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL030V5-QNG132I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL060V5-QNG132
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V2-QNG132I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN125V2-CSG81
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN250V5-ZCSG81
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA150-PQ208A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL060V2-QNG132I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-1FG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-FGG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32A-CQ256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA1000-CQ352B
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX16-CQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
EX128-FTQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)