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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 传播延迟 | 接通延迟时间 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M2GL150-FCS536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 20 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| M2GL150TS-1FCVG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BFBGA | YES | 248 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 146124 | 5120000 | 3.15mm | 19mm | 19mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M2GL150T-1FCV484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | YES | 248 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B484 | 现场可编程门阵列 | 146124 | 5120000 | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| M2GL150-1FCS536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 20 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| M2GL150T-1FCSG536 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 30 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
| M2GL150TS-FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 30 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | M1A3PE3000-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 341 | 0°C~85°C TJ | Tray | 2013 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3PE3000 | 63kB | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.575V | 1.425V | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| M2GL150TS-1FCS536 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 20 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
 | AX1000-FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 418 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 1mm | 649MHz | 40 | AX1000 | 516 | 1.51.5/3.32.5/3.3V | 20.3kB | 990 ps | 990 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 12096 | 0.99 ns | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
| M2GL150T-1FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 30 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | 5962-9958501QXC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 10.567001g | 202 | Military grade | -55°C~125°C TJ | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 256 | 3A001.A.2.C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 5V | QUAD | FLAT | 0.5mm | 5962-99585 | Qualified | 320B | 36000 GATES | 现场可编程门阵列 | 1184 | 2560 | 54000 | 131MHz | MIL-PRF-38535 Class Q | 2880 | 1822 | 36000 | 2.8mm | 36mm | 36mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
 | M1A3P400-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 178 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| M1A3P400-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 178 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
 | M1A3P400-2PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 151 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
 | M1A3P400-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 97 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| M1A3P400-1FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 97 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
| M1A3P400-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 178 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| AGL125V2-FG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | 0°C~70°C TA | Tray | 2016 | IGLOO | e0 | Obsolete | 3 (168 Hours) | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | 235 | 20 | AGL125 | 4.5kB | 现场可编程门阵列 | 3072 | 36864 | 125000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| AGL250V2-FGG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | 0°C~70°C TA | Tray | 2016 | IGLOO | e1 | Obsolete | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | 260 | 30 | AGL250 | 4.5kB | 现场可编程门阵列 | 6144 | 36864 | 250000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
| AGL400V2-FG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | 0°C~70°C TA | Tray | 2016 | IGLOO | e0 | Obsolete | 3 (168 Hours) | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | 235 | 20 | AGL400 | 6.8kB | 现场可编程门阵列 | 9216 | 55296 | 400000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| AGL250V2-VQG100T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 100-TQFP | 68 | 0°C~70°C TA | Tray | IGLOO | e3 | Obsolete | 3 (168 Hours) | Tin (Sn) | 8542.39.00.01 | 1.14V~1.575V | 未说明 | 未说明 | AGL250 | 4.5kB | 现场可编程门阵列 | 6144 | 36864 | 250000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
| AGL1000V2-FGG256T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 177 | 0°C~70°C TA | Tray | 2010 | IGLOO | e1 | Obsolete | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | 250 | 30 | AGL1000 | 18kB | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | A54SX32A-TQ176I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 176-LQFP | 176-TQFP (24x24) | 147 | -40°C~85°C TA | Tray | 2007 | SX-A | Obsolete | 3 (168 Hours) | 2.25V~5.25V | A54SX32A | 48000 | 2880 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX32A-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 174 | -40°C~85°C TA | Tray | 2007 | SX-A | Obsolete | 3 (168 Hours) | 2.25V~5.25V | A54SX32A | 48000 | 2880 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| U1AFS600-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 114 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 85°C | 0°C | 1.425V~1.575V | U1AFS600 | 4.5kB | 36864 | 250000 | Non-RoHS Compliant |
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M2GL150-FCS536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-1FCVG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-1FCV484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150-1FCS536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-1FCSG536
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-FCSG536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-1FCS536
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-FGG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-1FCSG536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
5962-9958501QXC
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-1FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V2-FG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL250V2-FGG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V2-FG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL250V2-VQG100T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL1000V2-FGG256T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32A-TQ176I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32A-PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
U1AFS600-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)