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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3PE3000-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2009 | ProASIC3E | e0 | Obsolete | 3 (168 Hours) | 208 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 231MHz | 30 | A3PE3000 | 147 | 1.5V | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | A42MX36-3PQ240I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 240-BFQFP | 240 | 202 | -40°C~85°C TA | Tray | 2014 | MX | e0 | Obsolete | 3 (168 Hours) | 240 | 锡铅 | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | A42MX36 | 240 | 202 | 5V | 320B | 现场可编程门阵列 | 2560 | 54000 | 180MHz | 1184 | 3 | 1822 | 1.9 ns | 2414 | 3.4mm | 32mm | 32mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| A3PE600-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2009 | ProASIC3E | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 231MHz | 30 | A3PE600 | 147 | 1.5V | 1.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| A42MX36-PQ208M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 176 | -55°C~125°C TC | Tray | 2009 | MX | e0 | Obsolete | 3 (168 Hours) | 208 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | A42MX36 | 208 | 5V | 320B | 现场可编程门阵列 | 2560 | 54000 | 131MHz | 1184 | 1822 | 2.7 ns | 2438 | 2414 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
 | AGL1000V5-FGG484I | Microsemi Corporation | 数据表 | 869 In Stock | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~85°C TA | Tray | 2015 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | AGL1000 | 不合格 | 1.5V | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 892.86MHz | 1.73mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| A3P125-1PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 133 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3P125 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 272MHz | 1 | 3072 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | EX128-TQG100 | Microsemi Corporation | 数据表 | 48 In Stock | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | 70 | 0°C~70°C TA | Tray | 2012 | EX | e3 | 活跃 | 1 (Unlimited) | 100 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 250MHz | 40 | EX128 | 2.5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 6000 | 256 | 1.4mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||
 | A3P250L-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 157 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e1 | Obsolete | 3 (168 Hours) | 256 | 锡银铜 | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | A3P250L | 157 | 1.2V | 1.5/3.3V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 781.25MHz | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||
| A3P125-PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 133 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P125 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 125000 | 231MHz | 3072 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | AGL125V5-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~85°C TA | Tray | 2009 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | AGL125 | 1.5V | 4.5kB | 4.5kB | 现场可编程门阵列 | 3072 | 36864 | 125000 | 892.86MHz | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||
| AGL125V2-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | 30 | AGL125 | 不合格 | 1.5V | 4.5kB | 现场可编程门阵列 | 3072 | 36864 | 125000 | 892.86MHz | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||
| AGL400V5-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL400 | 1.5V | 1.575V | 1.425V | 27μA | 6.8kB | 9216 | 55296 | 400000 | 250MHz | 1.05mm | 13mm | 13mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
| A3P1000-PQ208M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -55°C~125°C TJ | Tray | 2009 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 208 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3P1000 | 154 | 1.5V | 1.51.5/3.3V | 8mA | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 350MHz | 24576 | 4.1mm | 28mm | 28mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||
 | A3PN010-1QNG48 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 150.507618mg | 34 | -20°C~85°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 48 | 1.425V~1.575V | QUAD | 260 | 1.5V | 0.4mm | 30 | A3PN010 | 1.5V | 600μA | 现场可编程门阵列 | 100 | 10000 | 350MHz | 1 | 260 | 260 | 880μm | 6mm | 6mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| A3PN010-2QNG48I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 34 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 48 | 1.425V~1.575V | QUAD | 260 | 1.5V | 0.4mm | 30 | A3PN010 | 1.5V | 1mA | 现场可编程门阵列 | 10000 | 350MHz | 2 | 260 | 260 | 880μm | 6mm | 6mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | M1AGL250V2-VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 68 | 0°C~70°C TA | Tray | 2013 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1AGL250 | 1.5V | 1.575V | 1.14V | 4.5kB | 6144 | 36864 | 250000 | 1mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | A3P400-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 178 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 231MHz | 30 | A3P400 | 1.5V | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | M2GL010-TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 12084 | 933888 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
| APA450-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | 0°C~70°C TA | Tray | 2000 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 260 | 2.5V | 1mm | 180MHz | 40 | APA450 | 186 | 2.5V | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 12288 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
| M2GL150T-1FCG1152 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152 | 574 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | M2GL150T | 574 | 不合格 | 1.2V | 625kB | 现场可编程门阵列 | 146124 | 5120000 | 1 | 2.9mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M2GL025-VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 27696 | 1130496 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | M2GL025TS-1FCSG325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B325 | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 27696 | 1130496 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
| AGL400V2-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 178 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | 30 | AGL400 | 不合格 | 1.5V | 27μA | 6.8kB | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 1.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| M2GL025TS-FCS325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 180 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 27696 | 1130496 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
 | A3P600-2FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 235 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 310MHz | 2 | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant |
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A3PE3000-PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-3PQ240I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE600-PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-PQ208M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL1000V5-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
EX128-TQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250L-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V5-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V2-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V5-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-PQ208M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN010-1QNG48
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN010-2QNG48I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL250V2-VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010-TQG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA450-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-1FCG1152
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025-VFG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-1FCSG325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V2-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-FCS325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600-2FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)