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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 5962-9958502QXC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount, Through Hole | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 10.567001g | 202 | Military grade | -55°C~125°C TJ | Tray | 2009 | MX | e4 | 活跃 | 3 (168 Hours) | 256 | GOLD | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | FLAT | 3.3V | 0.5mm | 5962-99585 | Qualified | 5V | 320B | 36000 GATES | 现场可编程门阵列 | 2560 | 54000 | 151MHz | MIL-PRF-38535 Class Q | 1184 | 1 | 1822 | 36000 | 2.8mm | 36mm | 36mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
 | U1AFS600-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 114 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 85°C | 0°C | 1.425V~1.575V | U1AFS600 | 4.5kB | 36864 | 250000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | A42MX24-TQG176M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 150 | -55°C~125°C TC | Tray | MX | e3 | 活跃 | 3 (168 Hours) | 176 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | A42MX24 | 5V | 现场可编程门阵列 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | APA750-PQG208A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 208 | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 0.5mm | APA750 | 158 | 2.5V | 2.52.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 750000 | 180MHz | 32768 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | AX2000-2FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 586 | 0°C~70°C TA | Tray | 2012 | Axcelerator | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX2000 | 1.5V | 1.575V | 1.425V | 36kB | 740 ps | 740 ps | 21504 | 294912 | 2000000 | 870MHz | 32256 | 21504 | 2 | 21504 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | AX500-1FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | Military grade | -55°C~125°C TA | Tray | 2012 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 763MHz | 40 | AX500 | 336 | 1.5V | 9kB | 850 ps | 850 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | MIL-STD-883 Class B | 1 | 5376 | 0.84 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| AX2000-2FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 586 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 870MHz | 40 | AX2000 | 684 | 1.5V | 36kB | 740 ps | 740 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | 2 | 21504 | 0.74 ns | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| M1A3PE3000-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | 2013 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3PE3000 | 1.5V | 1.575V | 1.425V | 63kB | 516096 | 3000000 | 231MHz | 75264 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
| AX500-2FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 317 | 0°C~70°C TA | Tray | 2012 | Axcelerator | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX500 | 1.5V | 1.575V | 1.425V | 9kB | 740 ps | 740 ps | 5376 | 73728 | 500000 | 870MHz | 8064 | 5376 | 2 | 5376 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M1A3PE3000-FGG324I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 324-BGA | 221 | -40°C~100°C TJ | Tray | 2009 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 324 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | M1A3PE3000 | S-PBGA-B324 | 221 | 不合格 | 1.5/3.3V | 63kB | 350MHz | 221 | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 75264 | 1.78mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| P1AFS1500-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | P1AFS1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 2 | 38400 | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
 | M1A3PE3000-1FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2013 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3PE3000 | 1.5V | 1.575V | 1.425V | 63kB | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M1A3PE3000-FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -40°C~100°C TJ | Tray | 2013 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 40 | M1A3PE3000 | 620 | 1.5V | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 231MHz | 75264 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| AX250-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 138 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 649MHz | 40 | AX250 | 248 | 1.5V | 1.51.5/3.32.5/3.3V | 6.8kB | 990 ps | 990 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | 2816 | 0.99 ns | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| M1A3PE1500-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | 2012 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3PE1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 231MHz | 38400 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
| P1AFS600-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | 0°C~85°C TJ | Tray | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | P1AFS600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 2 | 13824 | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
| AFS600-1FG256K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | -55°C~100°C TJ | Tray | 2012 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | AFS600 | 13.5kB | 110592 | 600000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | M1A3PE3000L-FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2013 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1A3PE3000L | 1.2V | 1.26V | 1.14V | 63kB | 516096 | 3000000 | 781.25MHz | 75264 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M1A3PE3000-2FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -40°C~100°C TJ | Tray | 2013 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 40 | M1A3PE3000 | 620 | 1.5V | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 310MHz | 2 | 75264 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | AX1000-2FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 418 | 0°C~70°C TA | Tray | 2012 | Axcelerator | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX1000 | 1.5V | 1.575V | 1.425V | 20.3kB | 740 ps | 740 ps | 12096 | 165888 | 1000000 | 870MHz | 18144 | 12096 | 2 | 12096 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| AX1000-2FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 317 | 0°C~70°C TA | Tray | 2012 | Axcelerator | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX1000 | 1.5V | 1.575V | 1.425V | 20.3kB | 740 ps | 740 ps | 12096 | 165888 | 1000000 | 870MHz | 18144 | 12096 | 2 | 12096 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| AX1000-2FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 418 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 870MHz | 40 | AX1000 | 516 | 1.5V | 20.3kB | 740 ps | 740 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 2 | 12096 | 0.74 ns | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| 5962-0054302QYC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 171 | Military grade | -55°C~125°C TJ | Tray | 2007 | SX-A | e4 | 活跃 | 3 (168 Hours) | 208 | GOLD | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 2.25V~5.25V | QUAD | FLAT | 2.5V | 0.5mm | 250MHz | 5962-00543 | Qualified | 2.5V | 1.3 ns | 1.3 ns | 72000 GATES | 现场可编程门阵列 | 4024 | 108000 | 6036 | MIL-PRF-38535 Class Q | 1 | 72000 | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| 5962-0054301QXC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 203 | Military grade | -55°C~125°C TJ | Tray | 2007 | SX-A | e4 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.2.C | GOLD | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 8542.39.00.01 | 2.25V~5.25V | QUAD | FLAT | 2.5V | 0.5mm | 217MHz | 5962-00543 | Qualified | 2.5V | 1.5 ns | 1.5 ns | 72000 GATES | 现场可编程门阵列 | 4024 | 108000 | 6036 | MIL-PRF-38535 Class Q | 72000 | 3.22mm | 36mm | 36mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
| 5962-0054302QXC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 203 | Military grade | -55°C~125°C TJ | Tray | 2007 | SX-A | e4 | 活跃 | 3 (168 Hours) | 256 | GOLD | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 2.25V~5.25V | QUAD | FLAT | 2.5V | 0.5mm | 250MHz | 5962-00543 | Qualified | 2.5V | 1.3 ns | 1.3 ns | 72000 GATES | 现场可编程门阵列 | 4024 | 108000 | 6036 | MIL-PRF-38535 Class Q | 1 | 72000 | 3.22mm | 36mm | 36mm | 无 | Non-RoHS Compliant |
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5962-9958502QXC
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
U1AFS600-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-TQG176M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA750-PQG208A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-2FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-1FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-2FGG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-2FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-FGG324I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
P1AFS1500-2FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-1FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-FGG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE1500-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
P1AFS600-2FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-1FG256K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000L-FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-2FGG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-2FGG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-2FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-2FGG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
5962-0054302QYC
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
5962-0054301QXC
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
5962-0054302QXC
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)