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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | APA450-FGG484A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 344 | -40°C~125°C TJ | Tray | 2007 | ProASICPLUS | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 1mm | APA450 | 344 | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 180MHz | 12288 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | U1AFS1500-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | U1AFS1500 | 不合格 | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 1.68mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | U1AFS1500-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | U1AFS1500 | 不合格 | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 1.68mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
 | A42MX24-PLG84M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 6.777889g | 72 | -55°C~125°C TC | Tube | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 84 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 5V | QUAD | J BEND | 245 | 1.27mm | 40 | A42MX24 | 现场可编程门阵列 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 3.68mm | 29.31mm | 29.31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| AX250-FGG256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 138 | Military grade | -55°C~125°C TA | Tray | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 649MHz | 40 | AX250 | 248 | 1.51.5/3.32.5/3.3V | 6.8kB | 990 ps | 990 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 2816 | 0.99 ns | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| 5962-0151801QYC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 174 | Military grade | -55°C~125°C TJ | Tray | 2007 | SX-A | e4 | 活跃 | 3 (168 Hours) | 208 | 3A001.A.2.C | GOLD | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 8542.39.00.01 | 2.5V | QUAD | FLAT | 0.5mm | 238MHz | 5962-01518 | Qualified | 1.2 ns | 1.2 ns | 32000 GATES | 现场可编程门阵列 | 1800 | 48000 | 2880 | MIL-PRF-38535 Class Q | 1980 | 32000 | 3.22mm | 29.21mm | 29.21mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
 | A54SX32-CQ208B | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 208-CQFP (75x75) | 10.567001g | 174 | -55°C~125°C TJ | Tray | 2005 | SX | 不用于新设计 | 3 (168 Hours) | 125°C | -55°C | 5V | A54SX32 | 1 ns | 48000 | 205MHz | 2880 | 2880 | 1080 | 5.5V | 4.5V | 2.8mm | 29.21mm | 29.21mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| 5962-9958502QYC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 176 | Military grade | -55°C~125°C TJ | Tray | 2009 | MX | e4 | 活跃 | 3 (168 Hours) | 208 | GOLD | ALSO OPERATES AT 5V SUPPLY | 5V | QUAD | FLAT | 0.5mm | 5962-99585 | Qualified | 320B | 36000 GATES | 现场可编程门阵列 | 2560 | 54000 | 151MHz | MIL-PRF-38535 Class Q | 1184 | 1 | 1822 | 36000 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| 5962-9958502QXC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount, Through Hole | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 10.567001g | 202 | Military grade | -55°C~125°C TJ | Tray | 2009 | MX | e4 | 活跃 | 3 (168 Hours) | 256 | GOLD | ALSO OPERATES AT 5V SUPPLY | 5V | QUAD | FLAT | 0.5mm | 5962-99585 | Qualified | 320B | 36000 GATES | 现场可编程门阵列 | 2560 | 54000 | 151MHz | MIL-PRF-38535 Class Q | 1184 | 1 | 1822 | 36000 | 2.8mm | 36mm | 36mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
 | M1A3PE3000-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | 2013 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3PE3000 | 63kB | 516096 | 3000000 | 231MHz | 75264 | 1.575V | 1.425V | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
| AX500-2FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 317 | 0°C~70°C TA | Tray | 2012 | Axcelerator | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 870MHz | AX500 | 9kB | 740 ps | 740 ps | 5376 | 73728 | 500000 | 870MHz | 8064 | 5376 | 2 | 5376 | 1.575V | 1.425V | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M1A3PE3000-FGG324I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 324-BGA | 221 | -40°C~100°C TJ | Tray | 2009 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 324 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | M1A3PE3000 | S-PBGA-B324 | 221 | 不合格 | 1.5/3.3V | 63kB | 350MHz | 221 | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 75264 | 1.78mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| P1AFS1500-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | P1AFS1500 | 33.8kB | 276480 | 1500000 | 2 | 38400 | 1.575V | 1.425V | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
 | M1A3PE3000-1FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2013 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3PE3000 | 63kB | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.575V | 1.425V | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M1A3PE3000-FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -40°C~100°C TJ | Tray | 2013 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 40 | M1A3PE3000 | 620 | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 231MHz | 75264 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| AFS600-1FG256K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | -55°C~100°C TJ | Tray | 2012 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | AFS600 | 13.5kB | 110592 | 600000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| M2GL025TS-1FGG484T2 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | 267 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, IGLOO2 | yes | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 未说明 | 未说明 | 现场可编程门阵列 | 27696 | 1130496 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
| AFS1500-1FGG256K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | AFS1500 | 33.8kB | 276480 | 1500000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
| M1AFS1500-1FGG484K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 223 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | M1AFS1500 | 33.8kB | 276480 | 1500000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | M1A3P400-2FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 97 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
| M1A3P400-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 151 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| M1A3P400-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 151 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
 | A54SX32-TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | 144-TQFP (20x20) | 113 | 0°C~70°C TA | Tray | 2006 | SX | Obsolete | 3 (168 Hours) | 3V~3.6V 4.75V~5.25V | A54SX32 | 48000 | 2880 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX08A-FTQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | 144-TQFP (20x20) | 113 | 0°C~70°C TA | Tray | 2002 | SX-A | Obsolete | 3 (168 Hours) | 2.25V~5.25V | A54SX08A | 12000 | 768 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX32A-PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 174 | 0°C~70°C TA | Tray | 2007 | SX-A | Obsolete | 3 (168 Hours) | 2.25V~5.25V | A54SX32A | 48000 | 2880 | Non-RoHS Compliant |
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APA450-FGG484A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
U1AFS1500-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
U1AFS1500-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-PLG84M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-FGG256M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
5962-0151801QYC
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32-CQ208B
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
5962-9958502QYC
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
5962-9958502QXC
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-2FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-FGG324I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
P1AFS1500-2FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-1FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-FGG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-1FG256K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-1FGG484T2
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-1FGG256K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-1FGG484K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32-TQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX08A-FTQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32A-PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)