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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | APA1000-LG624B | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | Surface Mount, Through Hole | 表面贴装 | 624-BCLGA | 624 | 440 | Military grade | -55°C~125°C TJ | Tray | 2007 | ProASICPLUS | 活跃 | 3 (168 Hours) | 624 | 3A001.A.2.C | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 2.5V | 180MHz | APA1000 | 2.5V | 5mA | 24.8kB | 现场可编程门阵列 | 202752 | 1000000 | MIL-STD-883 Class B | 56320 | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | M1A3P1000-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2000 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.8mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | M1A3P1000-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 40 | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 4.1mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | M2GL025TS-1FGG484T2 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | 267 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, IGLOO2 | yes | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 未说明 | 未说明 | 现场可编程门阵列 | 27696 | 1130496 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| APA150-FGG256A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~125°C TJ | Tray | 2000 | ProASICPLUS | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 1mm | APA150 | 186 | 2.5V | 2.52.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 150000 | 180MHz | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | AFS1500-1FGG256K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | AFS1500 | 33.8kB | 276480 | 1500000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| M1AFS1500-1FGG484K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 223 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | M1AFS1500 | 33.8kB | 276480 | 1500000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
| M1A3PE3000L-FG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 400.011771mg | 620 | -55°C~125°C TJ | Tray | 2014 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 896 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | M1A3PE3000L | S-PBGA-B896 | 620 | 不合格 | 1.5V | 1.2/1.51.2/3.3V | 25mA | 63kB | 620 | 现场可编程门阵列 | 516096 | 3000000 | 350MHz | 75264 | 75264 | 2.44mm | 31mm | 31mm | Non-RoHS Compliant | ||||||||||||||||||||||||
| M1A3P1000-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2000 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P1000 | 1.5V | 1.575V | 1.425V | 18kB | 147456 | 1000000 | 231MHz | 24576 | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | M1A3P1000-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.55mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| M1A3P1000-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P1000 | 1.5V | 1.575V | 1.425V | 18kB | 147456 | 1000000 | 231MHz | 24576 | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||
| M1A3P1000-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P1000 | 1.5V | 1.575V | 1.425V | 18kB | 147456 | 1000000 | 272MHz | 1 | 24576 | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
| M1A3P1000-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2000 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P1000 | 1.5V | 1.575V | 1.425V | 18kB | 147456 | 1000000 | 272MHz | 1 | 24576 | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
| APA075-FGG144A | Microsemi Corporation | 数据表 | 100 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 100 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 1mm | APA075 | 100 | 2.5V | 2.52.5/3.3V | 3.4kB | 现场可编程门阵列 | 27648 | 75000 | 180MHz | 3072 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M1A3PE1500-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 40 | M1A3PE1500 | 147 | 1.5V | 1.5/3.3V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 310MHz | 2 | 38400 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| APA300-PQG208A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~125°C TJ | Tray | ProASICPLUS | 活跃 | 3 (168 Hours) | 208 | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 0.5mm | APA300 | 158 | 2.5V | 2.52.5/3.3V | 9kB | 现场可编程门阵列 | 73728 | 300000 | 180MHz | 8192 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| AX250-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 138 | 0°C~70°C TA | Tray | 2005 | Axcelerator | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX250 | 1.5V | 1.575V | 1.425V | 6.8kB | 740 ps | 740 ps | 2816 | 55296 | 250000 | 870MHz | 4224 | 2816 | 2 | 2816 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M1AFS600-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 256-LBGA | YES | 119 | -40°C~100°C TJ | Tray | Fusion® | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1AFS600 | S-PBGA-B256 | 不合格 | 现场可编程门阵列 | 110592 | 600000 | 1.7mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| P1AFS600-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 30 | P1AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 2 | 13824 | 1.68mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| APA1000-PQG208A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 208 | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 0.5mm | APA1000 | 158 | 2.5V | 2.52.5/3.3V | 24.8kB | 现场可编程门阵列 | 202752 | 1000000 | 180MHz | 56320 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | APA1000-FGG896A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 642 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | APA1000 | 642 | 2.5V | 2.52.5/3.3V | 24.8kB | 现场可编程门阵列 | 202752 | 1000000 | 180MHz | 56320 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | AX1000-1FGG676M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 418 | Military grade | -55°C~125°C TA | Tray | 2012 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 40 | AX1000 | 516 | 1.5V | 20.3kB | 850 ps | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 763MHz | 18144 | MIL-STD-883 Class B | 1 | 0.84 ns | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| M2GL060TS-1FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| M1A3PE3000-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2013 | ProASIC3E | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 40 | M1A3PE3000 | 147 | 1.5V | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 231MHz | 75264 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | AX2000-FGG1152M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 1152-BGA | 1152 | 400.011771mg | 684 | Military grade | -55°C~125°C TA | Tray | 2012 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1mm | 649MHz | 40 | AX2000 | 684 | 1.5V | 1.51.5/3.32.5/3.3V | 36kB | 990 ps | 990 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | MIL-STD-883 Class B | 21504 | 0.99 ns | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 |
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APA1000-LG624B
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-1FGG484T2
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA150-FGG256A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-1FGG256K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-1FGG484K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000L-FG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA075-FGG144A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE1500-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA300-PQG208A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-2FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS600-2FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
P1AFS600-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA1000-PQG208A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA1000-FGG896A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-1FGG676M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-FGG1152M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)