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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 电流源 | 输入数量 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 5962-0054302QXC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 203 | Military grade | -55°C~125°C TJ | Tray | 2007 | SX-A | e4 | 活跃 | 3 (168 Hours) | 256 | GOLD | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 2.5V | QUAD | FLAT | 0.5mm | 250MHz | 5962-00543 | Qualified | 1.3 ns | 1.3 ns | 72000 GATES | 现场可编程门阵列 | 4024 | 108000 | 6036 | MIL-PRF-38535 Class Q | 1 | 72000 | 3.22mm | 36mm | 36mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | APA1000-LG624B | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | Surface Mount, Through Hole | 表面贴装 | 624-BCLGA | 624 | 440 | Military grade | -55°C~125°C TJ | Tray | 2007 | ProASICPLUS | 活跃 | 3 (168 Hours) | 624 | 3A001.A.2.C | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 180MHz | APA1000 | 24.8kB | 5mA | 现场可编程门阵列 | 202752 | 1000000 | MIL-STD-883 Class B | 56320 | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| M2GL060TS-1FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 1mm | 20 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
 | M1A3PE3000-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2013 | ProASIC3E | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.5V | QUAD | 鸥翼 | 245 | 0.5mm | 40 | M1A3PE3000 | 147 | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 231MHz | 75264 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M1A3PE3000L-FG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 400.011771mg | 620 | -55°C~125°C TJ | Tray | 2014 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 896 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M1A3PE3000L | S-PBGA-B896 | 620 | 不合格 | 1.2/1.51.2/3.3V | 63kB | 25mA | 620 | 现场可编程门阵列 | 516096 | 3000000 | 350MHz | 75264 | 75264 | 2.44mm | 31mm | 31mm | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | M1A3P1000-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2000 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1mm | 40 | M1A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.8mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M1A3P1000-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.5V | QUAD | 鸥翼 | 245 | 0.5mm | 40 | M1A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 4.1mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| APA150-FGG256A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~125°C TJ | Tray | 2000 | ProASICPLUS | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 1mm | APA150 | 186 | 2.52.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 150000 | 180MHz | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | M1A3P400-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~100°C TJ | Tray | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.55mm | 13mm | 13mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M1A3P400-1FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.55mm | 13mm | 13mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M1A3P400-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.5V | QUAD | 鸥翼 | 245 | 0.5mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 4.1mm | 28mm | 28mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M1A3P400-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 178 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.8mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| A3P250-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.5V | QUAD | 鸥翼 | 245 | 0.5mm | 310MHz | 40 | A3P250 | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 2 | 6144 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M1A3P1000-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P1000 | 18kB | 147456 | 1000000 | 272MHz | 1 | 24576 | 1.575V | 1.425V | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
 | M1A3P1000-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2000 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P1000 | 18kB | 147456 | 1000000 | 272MHz | 1 | 24576 | 1.575V | 1.425V | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
| APA075-FGG144A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 100 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 1mm | APA075 | 100 | 2.52.5/3.3V | 3.4kB | 现场可编程门阵列 | 27648 | 75000 | 180MHz | 3072 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M1A3P1000-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2000 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P1000 | 18kB | 147456 | 1000000 | 231MHz | 24576 | 1.575V | 1.425V | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
| M1A3P1000-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | M1A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.55mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M1A3P1000-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P1000 | 18kB | 147456 | 1000000 | 231MHz | 24576 | 1.575V | 1.425V | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | A1010B-2PL44C | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 34 | 0°C~70°C TA | Tray | 1997 | ACT™ 1 | Obsolete | 3 (168 Hours) | 44 | 5V | QUAD | J BEND | 65MHz | A1010 | 57 | 5V | 3.4 ns | 现场可编程门阵列 | 295 | 1200 | 2 | 147 | 547 | 295 | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
| A1010B-2PLG44I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 34 | -40°C~85°C TA | Tray | 1997 | ACT™ 1 | e3 | Obsolete | 3 (168 Hours) | 44 | 哑光锡 | 5V | QUAD | J BEND | 245 | 40 | A1010 | S-PQCC-J44 | 57 | 不合格 | 5V | 54.1MHz | 3.4 ns | 57 | 现场可编程门阵列 | 1200 | 295 | 2 | 147 | 295 | 295 | 4.445mm | 16.51mm | 16.51mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | A10V10B-PLG68C | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 68-LCC (J-Lead) | 57 | 0°C~70°C TA | Tray | 1997 | ACT™ 1 | e3 | Obsolete | 3 (168 Hours) | 68 | 哑光锡 | 3.3V | QUAD | J BEND | 245 | 1.27mm | 40 | A10V10 | S-PQCC-J68 | 57 | 50MHz | 6.5 ns | 57 | 现场可编程门阵列 | 1200 | 295 | 147 | 4.5 ns | 295 | 295 | 4.445mm | 24.13mm | 24.13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| A54SX08-1TQ176I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 128 | -40°C~85°C TA | Tray | 2006 | SX | e0 | Obsolete | 3 (168 Hours) | 176 | 锡铅 | 5V | QUAD | 鸥翼 | 225 | 0.5mm | 280MHz | 30 | A54SX08 | 800 ps | 800 ps | 现场可编程门阵列 | 768 | 12000 | 1 | 256 | 0.8 ns | 768 | 8000 | 1.4mm | 24mm | 24mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | A54SX32A-2TQ176 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 147 | 0°C~70°C TA | Tray | 2007 | SX-A | e0 | Obsolete | 3 (168 Hours) | 176 | 锡铅 | 2.5V | QUAD | 鸥翼 | 225 | 0.5mm | 313MHz | 30 | A54SX32A | 147 | 900 ps | 900 ps | 现场可编程门阵列 | 2880 | 48000 | 2 | 1980 | 0.9 ns | 1.4mm | 24mm | 24mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | A54SX08-TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 144-TQFP (20x20) | 1.319103g | 113 | 0°C~70°C TA | Tray | 2006 | SX | Obsolete | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | 240MHz | A54SX08 | 900 ps | 900 ps | 768 | 12000 | 240MHz | 768 | 768 | 256 | 5.25V | 4.75V | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 |
-
5962-0054302QXC
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA1000-LG624B
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000L-FG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA150-FGG256A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-1FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA075-FGG144A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1010B-2PL44C
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1010B-2PLG44I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A10V10B-PLG68C
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX08-1TQ176I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32A-2TQ176
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX08-TQG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)